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CY7C1302DV25-167BZXC
Infineon Technologies
IC SRAM 9MBIT PAR 167MHZ 165FBGA
2036 Pcs New Original In Stock
SRAM - Synchronous, QDR Memory IC 9Mbit Parallel 167 MHz 165-FBGA (13x15)
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5.0 / 5.0
- (486 Ratings)
CY7C1302DV25-167BZXC
Product Overview
6329026
DiGi Electronics Part Number
CY7C1302DV25-167BZXC-DGManufacturer
Infineon Technologies
CY7C1302DV25-167BZXC
Description
IC SRAM 9MBIT PAR 167MHZ 165FBGAInventory
2036 Pcs New Original In Stock
SRAM - Synchronous, QDR Memory IC 9Mbit Parallel 167 MHz 165-FBGA (13x15)
Quantity
Minimum 1
Minimum 1
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CY7C1302DV25-167BZXC Technical Specifications
Category
Memory, Memory
Packaging
-
Series
-
Product Status
Obsolete
DiGi-Electronics Programmable
Not Verified
Memory Type
Volatile
Memory Format
SRAM
Technology
SRAM - Synchronous, QDR
Memory Size
9Mbit
Memory Organization
512K x 18
Memory Interface
Parallel
Clock Frequency
167 MHz
Write Cycle Time - Word, Page
-
Voltage - Supply
2.4V ~ 2.6V
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Surface Mount
Package / Case
165-LBGA
Supplier Device Package
165-FBGA (13x15)
Base Product Number
CY7C1302
Datasheet & Documents
HTML Datasheet
CY7C1302DV25-167BZXC-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991B2A
HTSUS
8542.32.0041
Additional Information
Other Names
2156-CY7C1302DV25-167BZXC-CY
2015-CY7C1302DV25-167BZXC
CYPCYPCY7C1302DV25-167BZXC
2832-CY7C1302DV25-167BZXC
Standard Package
136
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Der Kundenservice ist schnell, freundlich und sehr hilfsbereit.
Dec 02, 2025
Fast and reliable shipping is what sets DiGi Electronics apart.
Dec 02, 2025
Their after-sales warranty service provides peace of mind for any potential issues.
Dec 02, 2025
Super quick delivery! And the prices made it easy to add more to my collection without breaking the bank.
Dec 02, 2025
Their affordability makes it simple to get what I need without overspending.
Dec 02, 2025
DiGi Electronics’ online platform consistently provides an efficient shopping journey.
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Frequently Asked Questions (FAQ)
Is the CY7C1302DV25-167BZXC still a viable option for new high-speed FPGA-based designs given its obsolete status, and what are the key risks in long-term supply and support?
The CY7C1302DV25-167BZXC is marked as obsolete by Infineon Technologies, which significantly increases long-term supply chain and support risks for new designs. While it remains electrically functional and may be available through distributors like DiGi-Electronics, relying on it for new development exposes your project to sudden stockouts, lack of future firmware or documentation updates, and no manufacturer warranty or technical support. We strongly recommend evaluating pin-compatible or functionally equivalent alternatives such as the Renesas IDT72V321A or Micron MT55L256K36D3 before committing to design-in. If you must use this part due to legacy compatibility, secure a lifetime buy and implement a second-source strategy to mitigate obsolescence risk.
Can the CY7C1302DV25-167BZXC be safely replaced with a modern QDR-II SRAM like the Cypress CY7C1513KV33-200BZXC in an existing 167 MHz parallel memory interface without redesigning the PCB?
Direct replacement of the CY7C1302DV25-167BZXC with the CY7C1513KV33-200BZXC is not recommended without thorough signal integrity and timing analysis. Although both are QDR SRAMs in a 165-FBGA package, the newer part operates at a higher clock frequency (200 MHz vs. 167 MHz) and may have different input capacitance, output slew rates, and power sequencing requirements. Additionally, the pinout is not guaranteed to be identical across generations. Even if the physical footprint matches, differences in propagation delay and setup/hold times could cause timing violations in your current design. Always validate compatibility using IBIS models and perform bench testing under worst-case operating conditions before deployment.
What are the critical layout and power delivery considerations when designing with the CY7C1302DV25-167BZXC to avoid data corruption at 167 MHz operation?
At 167 MHz, the CY7C1302DV25-167BZXC demands strict high-speed layout practices to maintain signal integrity. Ensure matched-length routing for data and address buses within ±50 mils to prevent skew-induced errors. Use a solid ground plane beneath the 165-FBGA package and place decoupling capacitors (100 nF X7R) as close as possible to each VDD pin—ideally within 2 mm. The 2.5V ±0.1V supply must be clean and stable; consider using a dedicated low-noise LDO with <30 mV ripple. Avoid vias in high-speed signal paths and maintain 50 Ω controlled impedance for clock and strobe lines. Thermal vias under the package are also essential to manage junction temperature, especially since the device lacks built-in ECC and is sensitive to voltage and timing noise.
How does the moisture sensitivity level (MSL 3) of the CY7C1302DV25-167BZXC impact handling and reflow processes in a production environment?
The CY7C1302DV25-167BZXC has an MSL 3 rating, meaning it can be exposed to ambient conditions for up to 168 hours (7 days) after dry packaging is opened before requiring baking. In production, this necessitates strict moisture control: trays or reels must remain sealed until immediately before placement, and any unused parts must be re-baked at 125°C for 24 hours if the floor life is exceeded. During reflow, adhere to the peak temperature of 260°C with a time above liquidus (TAL) of 60–90 seconds to avoid popcorning or delamination. Failure to follow MSL 3 protocols can lead to internal package cracking, intermittent failures, or reduced long-term reliability—especially critical in high-reliability applications like industrial or medical systems.
Given that the CY7C1302DV25-167BZXC lacks ECC and operates at tight voltage tolerances (2.4V–2.6V), what design mitigations should be implemented to ensure data integrity in noisy industrial environments?
Because the CY7C1302DV25-167BZXC is a non-ECC SRAM with a narrow 2.5V ±4% supply window, it is highly susceptible to soft errors and data corruption in electrically noisy environments. To mitigate risk, implement a regulated, filtered 2.5V power rail with bulk and high-frequency decoupling, and consider adding a watchdog timer or periodic memory scrubbing routine in your host controller (e.g., FPGA or MCU) to detect and correct bit flips. Shield high-speed traces from switching power supplies and motor drivers, and use ground stitching vias around the BGA perimeter to reduce EMI coupling. For mission-critical data, add application-level checksums or redundancy. If error rates exceed acceptable thresholds, transition to an ECC-protected memory solution such as a synchronous DRAM with on-die ECC or a radiation-tolerant SRAM variant.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
CY7C1302DV25-167BZXC CAD Models
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