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CY62256LL-70SNXC
Infineon Technologies
IC SRAM 256KBIT PARALLEL 28SOIC
25161 Pcs New Original In Stock
SRAM - Asynchronous Memory IC 256Kbit Parallel 70 ns 28-SOIC
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5.0 / 5.0
- (82 Ratings)
CY62256LL-70SNXC
Product Overview
6329042
DiGi Electronics Part Number
CY62256LL-70SNXC-DGManufacturer
Infineon Technologies
CY62256LL-70SNXC
Description
IC SRAM 256KBIT PARALLEL 28SOICInventory
25161 Pcs New Original In Stock
SRAM - Asynchronous Memory IC 256Kbit Parallel 70 ns 28-SOIC
Quantity
Minimum 1
Minimum 1
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CY62256LL-70SNXC Technical Specifications
Category
Memory, Memory
Packaging
-
Series
MoBL®
Product Status
Obsolete
DiGi-Electronics Programmable
Not Verified
Memory Type
Volatile
Memory Format
SRAM
Technology
SRAM - Asynchronous
Memory Size
256Kbit
Memory Organization
32K x 8
Memory Interface
Parallel
Write Cycle Time - Word, Page
70ns
Access Time
70 ns
Voltage - Supply
4.5V ~ 5.5V
Operating Temperature
0°C ~ 70°C (TA)
Mounting Type
Surface Mount
Package / Case
28-SOIC (0.295", 7.50mm Width)
Supplier Device Package
28-SOIC
Base Product Number
CY62256
Datasheet & Documents
HTML Datasheet
CY62256LL-70SNXC-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.32.0041
Additional Information
Other Names
CYPCYPCY62256LL-70SNXC
2156-CY62256LL-70SNXC-CY
Standard Package
27
Alternative Parts
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MANUFACTURER
QUANTITY AVAILABLE
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SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Customer support was courteous and attentive to my needs.
Dec 02, 2025
The packaging was efficient, ensuring the items were well-protected.
Dec 02, 2025
The packaging safety standards maintained by DiGi Electronics are outstanding, ensuring products arrive intact and ready for use.
Dec 02, 2025
Quality and affordability come together perfectly at DiGi Electronics, backed by friendly customer care.
Dec 02, 2025
Consistency in affordable pricing and personable service is impressive.
Dec 02, 2025
I always appreciate how transparent their pricing is, and their products consistently meet high standards.
Dec 02, 2025
DiGi Electronics provides outstanding after-sales service that sets them apart.
Dec 02, 2025
Their prompt delivery allows us to meet tight production deadlines without worry.
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Frequently Asked Questions (FAQ)
Can the CY62256LL-70SNXC be used as a drop-in replacement for the IS62C256AL-45ULI in an existing high-speed microcontroller interface design?
The CY62256LL-70SNXC is not a direct drop-in replacement for the IS62C256AL-45ULI due to timing and access time differences—the CY62256LL-70SNXC has a 70 ns access time compared to the IS62C256AL-45ULI's 45 ns. In high-speed MCU applications, this slower access may violate setup and hold times, leading to data corruption. If replacing, verify timing margins in the read/write cycles using the MCU's timing engine or external logic analyzer, and consider inserting wait states. Additionally, confirm voltage compatibility, as both operate at 4.5V–5.5V, but the CY62256LL-70SNXC's MoBL® (Mobile RAM) design emphasizes low power, which may affect drive strength in legacy systems. Designers should assess signal integrity and fanout under worst-case conditions.
What are the key reliability risks when designing the CY62256LL-70SNXC into a new industrial control system despite its obsolete status?
Although the CY62256LL-70SNXC is RoHS3 compliant and rated for 0°C to 70°C, its obsolete status poses significant long-term reliability and supply chain risks in industrial designs. Obsolete parts increase end-of-life exposure, risking premature redesign during product lifecycle. For new designs, this could lead to costly requalification and inventory stocking challenges. Mitigate this by securing multi-year inventory or initiating a second-source qualification (e.g., evaluating pin-to-pin-compatible SRAMs or modern SPI SRAM with protocol bridges). Also, ensure robust power supply filtering—industrial environments with voltage transients can disrupt volatile memory during brownout events. Consider adding voltage supervisors or battery backup to protect data integrity during power loss.
How does the 70 ns write cycle time of the CY62256LL-70SNXC impact bus contention in parallel memory architectures with fast microprocessors?
The CY62256LL-70SNXC's 70 ns write cycle time can create bus contention issues when interfaced with microprocessors that operate faster than 14 MHz (e.g., ARM7 or high-speed 8051 variants), especially if no wait-state logic is implemented. Without proper timing control, the processor may initiate a new access before the CY62256LL-70SNXC completes the write, resulting in corrupted data or bus conflicts. Use hardware flow control signals like READY or BHE to extend cycles and ensure write completion. Additionally, minimize trace lengths on WE, CE, and data lines to reduce propagation delays, and simulate timing with the processor’s worst-case output-to-setup time to avoid race conditions.
What thermal and PCB layout considerations are critical when using the CY62256LL-70SNXC in dense surface-mount assemblies?
Despite its 28-SOIC (7.50mm) package, the CY62256LL-70SNXC can exhibit thermal buildup in high-density layouts with limited airflow. Ensure adequate copper pour connected to GND and VCC pins for heat dissipation, but avoid excessive thermal vias that may cause solder wicking during reflow. Given the MSL-1 rating, moisture sensitivity isn't a concern, but closely spaced high-speed signal traces (especially address lines) should be routed with controlled impedance and minimized parallel runs to prevent crosstalk. Maintain ≥8 mil spacing between critical signals and use ground guard traces if necessary. Also, avoid placing heat-generating components (e.g., voltage regulators) adjacent to the CY62256LL-70SNXC to prevent exceeding its maximum operating temperature.
When replacing a failing CY62256LL-70SNXC in legacy hardware repair, what board-level tests should be performed to rule out system-level causes before assuming SRAM failure?
Before replacing a suspected failed CY62256LL-70SNXC, perform board-level diagnostics to rule out peripheral faults. Check for stable 5V supply with low ripple (use oscilloscope at the VCC pin under load), as undervoltage can mimic SRAM failure. Test continuity on address and data lines for shorts or open traces—especially common in repaired or aged boards. Monitor chip-enable (CE), output-enable (OE), and write-enable (WE) signals with a logic analyzer to verify correct timing and absence of glitches. Run a March C memory test algorithm via the host MCU if possible. False failures often stem from degraded decoupling capacitors near the CY62256LL-70SNXC—replace nearby 0.1 µF ceramics proactively. Confirm the host system’s timing still meets the 70 ns access window after aging or component drift.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
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