SI8719BD-A-ISR >
SI8719BD-A-ISR
Skyworks Solutions Inc.
DGTL ISO 5000VRMS 1CH GP 6DIP GW
3004 Pcs New Original In Stock
General Purpose Digital Isolator 5000Vrms 1 Channel 15Mbps 35kV/µs CMTI 6-SOIC (0.295", 7.50mm Width)
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SI8719BD-A-ISR Skyworks Solutions Inc.
5.0 / 5.0 - (97 Ratings)

SI8719BD-A-ISR

Product Overview

7994280

DiGi Electronics Part Number

SI8719BD-A-ISR-DG
SI8719BD-A-ISR

Description

DGTL ISO 5000VRMS 1CH GP 6DIP GW

Inventory

3004 Pcs New Original In Stock
General Purpose Digital Isolator 5000Vrms 1 Channel 15Mbps 35kV/µs CMTI 6-SOIC (0.295", 7.50mm Width)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 3.1616 3.1616
  • 200 1.2617 252.3400
  • 500 1.2200 610.0000
  • 1000 1.1992 1199.2000
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SI8719BD-A-ISR Technical Specifications

Category Digital Isolators

Manufacturer Skyworks Solutions

Packaging Tape & Reel (TR)

Series -

Product Status Active

Technology Capacitive Coupling

Type General Purpose

Isolated Power No

Number of Channels 1

Inputs - Side 1/Side 2 1/0

Channel Type Unidirectional

Voltage - Isolation 5000Vrms

Common Mode Transient Immunity (Min) 35kV/µs

Data Rate 15Mbps

Propagation Delay tpLH / tpHL (Max) 50ns, 50ns

Pulse Width Distortion (Max) 25ns

Rise / Fall Time (Typ) 2.5ns, 2.5ns

Voltage - Supply 2.5V ~ 5.5V

Operating Temperature -40°C ~ 125°C

Mounting Type Surface Mount

Package / Case 6-SOIC (0.295", 7.50mm Width)

Supplier Device Package 6-SDIP Gull Wing

Base Product Number SI8719

Datasheet & Documents

HTML Datasheet

SI8719BD-A-ISR-DG

Environmental & Export Classification

Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Standard Package
1,000

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
SI8715BD-A-ISR
Skyworks Solutions Inc.
2121
SI8715BD-A-ISR-DG
0.0905
Parametric Equivalent

Reviews

5.0/5.0-(Show up to 5 Ratings)
행***날들
Dec 02, 2025
5.0
항상 빠르고 정확한 배송, 그리고 뛰어난 제품으로 신뢰를 쌓아갑니다.
桜***み
Dec 02, 2025
5.0
商品の品質は素晴らしく、耐久性も抜群です。お得な価格で大満足です。
Everg***nSoul
Dec 02, 2025
5.0
Their efficient inventory management minimizes disruptions in our project timeline.
Clou***aser
Dec 02, 2025
5.0
Post-sale support includes helpful instructions and tips, which enhance my overall experience.
Velv***hadow
Dec 02, 2025
5.0
I’ve used their products in high-stress environments, and they continue to operate flawlessly after prolonged use.
Peacef***ourney
Dec 02, 2025
5.0
Their products exhibit high standards of craftsmanship and durability.
Whispe***gWaves
Dec 02, 2025
5.0
Reliable shipping and excellent customer support make DiGi Electronics top-notch.
Evergr***Eclipse
Dec 02, 2025
5.0
Their quick and reliable after-sales support makes them my go-to electronics distributor.
StarBri***Visions
Dec 02, 2025
5.0
I was impressed by how approachable and friendly their customer service team is.
Skywa***pirit
Dec 02, 2025
5.0
DiGi Electronics's pricing strategy is truly advantageous for our procurement needs.
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Frequently Asked Questions (FAQ)

Can the SI8719BD-A-ISR safely replace a failing optocoupler like the HCPL-0721 in a 24V industrial input module, and what design changes are needed to ensure reliable signal integrity?

Yes, the SI8719BD-A-ISR can replace the HCPL-0721 in a 24V industrial input module, but several design adjustments are critical. Unlike optocouplers, the SI8719BD-A-ISR uses capacitive isolation and requires stable, low-noise power supplies on both sides (2.5V to 5.5V). You must add local decoupling capacitors (e.g., 100nF ceramic) near each supply pin and ensure ground planes are properly partitioned to maintain the 5000Vrms isolation barrier. Additionally, because the SI8719BD-A-ISR has a much faster rise/fall time (2.5ns typical), transmission line effects may occur on long traces—keep signal paths short or add series termination resistors (e.g., 33Ω) to reduce ringing. The higher CMTI (35kV/µs) makes it more robust against ground bounce in noisy environments, but layout symmetry between input and output sides is essential to preserve signal fidelity.

What are the key reliability risks when using the SI8719BD-A-ISR in a high-temperature automotive application near the engine control unit, and how can they be mitigated?

The SI8719BD-A-ISR is rated for -40°C to 125°C, making it suitable for under-hood automotive use, but long-term reliability depends on thermal management and moisture exposure. At sustained temperatures above 105°C, solder joint fatigue and mold compound delamination become concerns—ensure the PCB uses high-Tg FR4 or polyimide substrate and avoid placing the device near heat sources without adequate spacing. Since it has an MSL-3 rating (168 hours floor life), strict handling per J-STD-033 is required; baking may be necessary if exposed to ambient humidity beyond floor life. Also, thermal cycling can stress the 6-SOIC gull-wing leads—use NSMD pad design and avoid excessive via stitching near the package to reduce CTE mismatch stress. Regular HAST or THB testing during qualification is recommended for mission-critical systems.

How does the SI8719BD-A-ISR compare to the SI8715BD-A-ISR in terms of performance trade-offs for a 15Mbps UART link in a motor drive controller, and which should I choose?

Both the SI8719BD-A-ISR and SI8715BD-A-ISR offer 15Mbps data rates and 5000Vrms isolation, but the SI8719BD-A-ISR has superior common-mode transient immunity (35kV/µs vs. 25kV/µs on the SI8715BD-A-ISR), making it the better choice for motor drive controllers where high dV/dt switching nodes induce fast ground shifts. However, the SI8715BD-A-ISR consumes slightly less quiescent current, which may matter in always-on subsystems. For UART communication—typically asynchronous and sensitive to pulse width distortion—the SI8719BD-A-ISR’s tighter pulse width distortion (max 25ns) ensures better timing margin at high speeds. Unless ultra-low power is the top priority, the SI8719BD-A-ISR is the safer engineering choice for noisy power electronics environments due to its enhanced noise resilience.

Is it safe to daisy-chain multiple SI8719BD-A-ISR devices on a single SPI bus across an isolation barrier, and what signal integrity issues should I anticipate?

Daisy-chaining multiple SI8719BD-A-ISR devices on an isolated SPI bus is technically feasible but introduces significant signal integrity challenges. Each isolator adds up to 50ns propagation delay and 25ns pulse width distortion, which can accumulate and violate SPI timing margins—especially at clock rates above 5MHz. Additionally, the fast 2.5ns edge rates can cause reflections if trace impedance isn’t controlled (aim for 50–75Ω). To mitigate this, use a star topology instead of daisy-chaining when possible, or insert small series resistors (22–47Ω) at the input of each SI8719BD-A-ISR to dampen ringing. Also, ensure that all isolated grounds are properly decoupled and that the total capacitive load on the shared lines doesn’t exceed the driver capability. For multi-drop SPI across isolation, consider using a dedicated isolated transceiver or reducing the clock frequency to accommodate cumulative delays.

What layout practices are critical when placing the SI8719BD-A-ISR on a mixed-signal PCB to prevent crosstalk and maintain 5000Vrms isolation integrity?

Maintaining the 5000Vrms isolation rating of the SI8719BD-A-ISR requires strict PCB layout discipline. First, ensure a minimum creepage distance of 8mm between any primary-side and secondary-side traces, especially around the package perimeter—use slots or cutouts in the PCB if space is constrained. Avoid routing high-speed digital or power traces parallel to the isolation barrier; perpendicular crossings are acceptable but keep them short. The 6-SOIC gull-wing package has internal capacitive coupling, so do not place copper pours or planes directly under the device across the isolation gap. Use separate ground planes for input and output sides, connected only through the system’s safety ground reference (if required), and place 100nF + 1µF decoupling caps on both VDD1 and VDD2 as close to the pins as possible. Finally, guard rings tied to local grounds can reduce surface leakage, but they must not bridge the isolation boundary—this layout rigor ensures both EMI compliance and long-term dielectric withstand.

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