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XC17V01VO8C
AMD
IC PROM SER 1M 8-SOIC
3778 Pcs New Original In Stock
Memory, Integrated Circuits (ICs)
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5.0 / 5.0
- (492 Ratings)
XC17V01VO8C
Product Overview
8700429
DiGi Electronics Part Number
XC17V01VO8C-DGManufacturer
AMD
XC17V01VO8C
Description
IC PROM SER 1M 8-SOICInventory
3778 Pcs New Original In Stock
Memory, Integrated Circuits (ICs)
Quantity
Minimum 1
Minimum 1
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XC17V01VO8C Technical Specifications
Category
Memory, Configuration PROMs for FPGAs
Packaging
-
Series
-
Product Status
Obsolete
DiGi-Electronics Programmable
Verified
Programmable Type
OTP
Memory Size
1Mb
Voltage - Supply
3V ~ 3.6V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Supplier Device Package
8-TSOP
Base Product Number
XC17V01
Datasheet & Documents
HTML Datasheet
XC17V01VO8C-DG
Environmental & Export Classification
RoHS Status
RoHS non-compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.32.0071
Additional Information
Standard Package
98
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Their consistent product quality keeps me loyal to the brand.
Dec 02, 2025
Technical support from DiGi was detailed and patient, ensuring I understood every step.
Dec 02, 2025
Order confirmation and shipment notifications are prompt and clear.
Dec 02, 2025
Delivery was quick, and I was pleasantly surprised by their immediate response to my questions afterward.
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Frequently Asked Questions (FAQ)
Can the XC17V01VO8C be used as a drop-in replacement for the Xilinx XC1701L in modern FPGA configuration designs?
The XC17V01VO8C is functionally similar to the Xilinx XC1701L and shares compatibility in 1Mbit serial PROM architecture, but it is not a guaranteed drop-in replacement due to timing and voltage differences. The XC17V01VO8C operates at 3V–3.6V, whereas the XC1701L supports lower voltages (2.7V–3.3V), potentially causing compatibility issues with legacy or low-voltage systems. Additionally, timing specifications such as access time and clock-to-output delay may differ between manufacturers. Always verify timing margins in your FPGA configuration interface and consider redesigning for modern, non-obsolete alternatives like the Spansion S25FL series with appropriate glue logic if long-term availability is a concern.
What are the key design-in risks when using the XC17V01VO8C in a new production design given its obsolete status from AMD?
Using the XC17V01VO8C in new designs poses significant supply chain and lifecycle risks due to its obsolete status. While current inventory exists, long-term availability from third-party sources increases exposure to counterfeit parts and inconsistent quality. Mitigate this by verifying programmability through independent programmers, sourcing from franchised distributors with traceability, and implementing accelerated obsolescence management planning. Designers should also consider redesigning with modern, pin-compatible, and actively supported SPI NOR flash solutions such as the Winbond W25Q80 or Cypress FL-S series with a serial configuration bridge to support newer FPGAs reliably.
How does the OTP (One-Time Programmable) nature of the XC17V01VO8C impact firmware development and field updates in embedded systems?
The OTP memory of the XC17V01VO8C prevents field firmware updates, making it unsuitable for applications requiring iterative testing or remote upgrades. This creates significant risk during prototyping or field deployment—any firmware error requires physical replacement of the IC. To reduce risk, validate bitstreams thoroughly in FPGA simulation and use a programmable platform (e.g., Xilinx Platform Flash XL) during development. Only program the XC17V01VO8C once the configuration is fully verified. For flexible development, consider using a small SPI flash with a microcontroller to emulate serial PROM behavior during testing.
What thermal and electrical derating considerations should be applied when deploying the XC17V01VO8C in high-density surface-mount assemblies?
While the XC17V01VO8C has a rated operating temperature of 0°C to 70°C, in high-density PCBs with poor airflow, localized heating can push device junction temperatures beyond limits. Ensure board-level thermal relief in copper pours near the 8-TSOP package and avoid placing near high-power components. Electrically, maintain tight decoupling: use a 0.1µF ceramic capacitor within 5mm of the VCC pin to suppress noise during programming and read cycles. Additionally, consider that signal integrity risks increase on long traces—use controlled impedance routing if the clock exceeds 10MHz to prevent FPGA configuration failures.
How does the RoHS non-compliance of the XC17V01VO8C affect compliance in new commercial or industrial electronics designs?
The RoHS non-compliance of the XC17V01VO8C restricts its use in commercial or industrial products sold in EU and other regulated markets, exposing manufacturers to legal and customs risks. While exemptions may apply for industrial monitoring or legacy systems under RoHS Article 7, these require formal documentation. For new designs, avoid this component unless grandfathered into a legacy support program. Instead, migrate to RoHS-compliant serial configuration memories like the Macronix MX25L4006E or use Xilinx’s SPI-based configuration solutions that support modern environmental standards while providing similar functionality.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
XC17V01VO8C CAD Models
AMD XC17V01VO8C PCB symbols & footprints
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