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WR04X3300FTL
Walsin Technology Corporation
RES 330 OHM 1% 1/16W 0402
35143 Pcs New Original In Stock
330 Ohms ±1% 0.063W, 1/16W Chip Resistor 0402 (1005 Metric) Thick Film
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5.0 / 5.0
- (208 Ratings)
WR04X3300FTL
Product Overview
9494365
DiGi Electronics Part Number
WR04X3300FTL-DGManufacturer
Walsin Technology Corporation
WR04X3300FTL
Description
RES 330 OHM 1% 1/16W 0402Inventory
35143 Pcs New Original In Stock
330 Ohms ±1% 0.063W, 1/16W Chip Resistor 0402 (1005 Metric) Thick Film
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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WR04X3300FTL Technical Specifications
Category
Chip Resistor - Surface Mount
Packaging
Cut Tape (CT) & Digi-Reel®
Series
WR
Product Status
Active
Resistance
330 Ohms
Tolerance
±1%
Power (Watts)
0.063W, 1/16W
Composition
Thick Film
Features
-
Temperature Coefficient
±100ppm/°C
Operating Temperature
-55°C ~ 155°C
Package / Case
0402 (1005 Metric)
Supplier Device Package
0402
Ratings
-
Size / Dimension
0.039" L x 0.020" W (1.00mm x 0.50mm)
Height - Seated (Max)
0.016" (0.40mm)
Number of Terminations
2
Failure Rate
-
Datasheet & Documents
HTML Datasheet
WR04X3300FTL-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8533.21.0030
Additional Information
Other Names
1292-WR04X3300FTLCT
1292-WR04X3300FTLDKR
4639-WR04X3300FTLTR
1292-WR04X3300FTLTR
Standard Package
10,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Une entreprise exemplaire, alliant qualité exceptionnelle et service amical.
Dec 02, 2025
Their logistics system ensured my order was dispatched and delivered swiftly, which I appreciated.
Dec 02, 2025
DiGi Electronics consistently provides exceptional service with a wide selection of products always in stock, making our procurement process seamless.
Dec 02, 2025
DiGi's customer care team is dedicated and always accessible for support.
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Frequently Asked Questions (FAQ)
How does the WR04X3300FTL compare to the Yageo RC0402FR-07330RL in high-density PCB designs where thermal performance is a concern?
Both the WR04X3300FTL and Yageo RC0402FR-07330RL are 0402-sized 330Ω ±1% thick film resistors, but the WR04X3300FTL offers a tighter temperature coefficient of ±100ppm/°C, which supports better stability in variable thermal environments. In high-density layouts where adjacent components limit airflow, the WR04X3300FTL’s rated operating temperature up to 155°C provides a safer margin compared to similar parts that may derate earlier. However, both share the same 1/16W power rating, so neither is suitable for circuits exceeding 50mW without careful thermal verification. For dense routing with minimal copper pour, consider conservative power loading—limit to 30–40% of rated power—to mitigate localized heating and long-term drift risks with the WR04X3300FTL.
Can the WR04X3300FTL be used as a drop-in replacement for the Samsung SR04X3300F in automated SMT assembly lines without modifying reflow profiles?
The WR04X3300FTL can typically replace the Samsung SR04X3300F in automated SMT processes, but verification of reflow thermal response is essential due to possible differences in thick film material formulation. The WR04X3300FTL has an MSL rating of 1 (unlimited floor life), which simplifies handling versus moisture-sensitive alternatives, but it's still critical to align peak reflow temperatures with the manufacturer's recommended profile—ideally not exceeding 260°C for more than 30 seconds. Conduct a small-batch trial if switching from Samsung, as solder joint integrity and tombstoning risks may increase if the thermal mass or pad design isn't optimized for Walsin’s termination metallization. Ensure stencil aperture design matches the 0402 footprint to prevent paste volume inconsistencies with the WR04X3300FTL.
What are the reliability risks when operating the WR04X3300FTL near its maximum 155°C operating temperature in automotive under-hood applications?
While the WR04X3300FTL is rated for operation up to 155°C, sustained use above 125°C increases long-term resistance drift due to accelerated aging of the thick film element. In automotive under-hood environments subject to thermal cycling, the WR04X3300FTL may experience increased failure risk if power dissipation exceeds 50% of its 1/16W rating. Mitigate this by minimizing DC bias, increasing board-level airflow, or using larger case sizes (e.g., 0603) for critical nodes. Also, ensure adequate standoff from high-heat sources like switches or power MOSFETs. For long-life designs, apply a 50% derating rule: use WR04X3300FTL only if actual dissipation is ≤30mW, especially when combined with wide ambient swings and vibration.
How does the low power rating of the WR04X3300FTL impact its suitability in battery-powered IoT sensor nodes with occasional transmit bursts?
The WR04X3300FTL’s 1/16W (62.5mW) power rating limits its use in battery-powered IoT nodes during RF or wireless module transmit bursts, where transient current flows can cause momentary resistor heating. While average power in sleep modes may be negligible, the peak power across current-sense or pull-up resistors during transmission can exceed safe operating limits if not analyzed. For example, in a 3.3V circuit with 10mA burst current through WR04X3300FTL, power dissipation reaches 3.3mW—within spec—but repeated pulses without thermal recovery may accumulate heat in compact enclosures. To ensure reliability, model transient thermal behavior using RC network approximations, or consider 0603 alternatives for critical current-setting paths. Use the WR04X3300FTL primarily for signal conditioning and biasing with stable, low-current loads.
What PCB layout precautions are necessary to avoid thermomechanical stress failures with the WR04X3300FTL in designs exposed to frequent thermal cycling?
To prevent thermomechanical stress failures in thermal cycling environments—such as industrial controls or outdoor electronics—PCB layout must minimize strain on the WR04X3300FTL’s small 0402 (1.00mm x 0.50mm) package. Avoid placing the WR04X3300FTL near vias or ground planes that create uneven heat distribution during reflow or operation. Use symmetrical pad designs per IPC-7351 and offset thermal relief connections to prevent tombstoning. Additionally, avoid end-cap termination over copper pours; instead, apply solder mask defined pads when possible. For ruggedized applications, consider edge-to-edge placement spacing of at least 0.3mm to allow for CTE mismatch expansion. These steps reduce microcracking risk in solder joints and internal electrode layers during repeated thermal shocks.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
WR04X3300FTL CAD Models
Walsin Technology Corporation WR04X3300FTL PCB symbols & footprints
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