1210B105K101CT >
1210B105K101CT
Walsin Technology Corporation
CAP CER 1UF 100V X7R 1210
15891 Pcs New Original In Stock
1 µF ±10% 100V Ceramic Capacitor X7R 1210 (3225 Metric)
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1210B105K101CT Walsin Technology Corporation
5.0 / 5.0 - (386 Ratings)

1210B105K101CT

Product Overview

10452760

DiGi Electronics Part Number

1210B105K101CT-DG
1210B105K101CT

Description

CAP CER 1UF 100V X7R 1210

Inventory

15891 Pcs New Original In Stock
1 µF ±10% 100V Ceramic Capacitor X7R 1210 (3225 Metric)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 10 0.0580 0.5800
  • 100 0.0465 4.6500
  • 300 0.0407 12.2100
  • 1000 0.0350 35.0000
  • 5000 0.0315 157.5000
  • 10000 0.0298 298.0000
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1210B105K101CT Technical Specifications

Category Ceramic Capacitors

Manufacturer Walsin Technology

Packaging Tape & Reel (TR)

Series -

Product Status Active

Capacitance 1 µF

Tolerance ±10%

Voltage - Rated 100V

Temperature Coefficient X7R

Operating Temperature -55°C ~ 125°C

Features -

Ratings -

Applications General Purpose

Failure Rate -

Mounting Type Surface Mount, MLCC

Package / Case 1210 (3225 Metric)

Size / Dimension 0.126" L x 0.098" W (3.20mm x 2.50mm)

Height - Seated (Max) -

Thickness (Max) 0.087" (2.20mm)

Lead Spacing -

Lead Style -

Datasheet & Documents

HTML Datasheet

1210B105K101CT-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8532.24.0020

Additional Information

Other Names
1292-1210B105K101CTTR
Standard Package
3,000

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
AC1210KKX7R0BB105
YAGEO
2800
AC1210KKX7R0BB105-DG
0.0264
Upgrade
C3225X7R2A105K200AM
TDK Corporation
4101
C3225X7R2A105K200AM-DG
0.1370
Parametric Equivalent
C1210X105K101T
Holy Stone Enterprise Co., Ltd.
19372
C1210X105K101T-DG
0.0496
Parametric Equivalent
885012209069
Würth Elektronik
1938
885012209069-DG
0.7792
Parametric Equivalent
C3225X7R2A105K200AA
TDK Corporation
39044
C3225X7R2A105K200AA-DG
0.1218
Parametric Equivalent

Reviews

5.0/5.0-(Show up to 5 Ratings)
Sunbu***Spirit
Dec 02, 2025
5.0
DiGi Electronics consistently ensures product availability, even during high demand periods.
Silv***ining
Dec 02, 2025
5.0
The eco-friendly packaging materials were clearly labeled and easy to recycle, which I appreciate.
Radi***eVibe
Dec 02, 2025
5.0
The team is well-trained and friendly, making every interaction pleasant and productive.
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Frequently Asked Questions (FAQ)

What are the key risks when replacing C3225X7R2A105K200AM with Walsin 1210B105K101CT in a high-temperature industrial power supply design?

When substituting Walsin 1210B105K101CT for Murata C3225X7R2A105K200AM, verify footprint compatibility—Walsin 1210B105K101CT uses a 1210 (3.2mm x 2.5mm) case while Murata's C3225 is 3225 metric, which may require PCB redesign. Both parts have 100V X7R ratings and similar capacitance, but Walsin’s DC bias performance can degrade faster under high field strength. In a high-temperature industrial power supply (>85°C), derate voltage to at least 50% of rated 100V to maintain stable 1µF capacitance. Also confirm equivalent ESR and ripple current capability to avoid output instability. Always validate via solder-joint thermal cycling if operating near 125°C sustained.

How does the voltage coefficient effect in Walsin 1210B105K101CT impact decoupling performance in a 5V rail with transient loads?

The Walsin 1210B105K101CT exhibits significant capacitance drop under DC bias—typical X7R dielectrics lose 60–80% of rated 1µF at 50V and even 40–50% at 5V. In a 5V rail application, the effective capacitance may be only ~500nF, which risks inadequate decoupling during fast load transients. To mitigate, parallel Walsin 1210B105K101CT with a smaller 0.1µF 100V X7R (e.g., 0805) to enhance high-frequency response, or select a higher-voltage-rated part (e.g., 200V) to reduce field stress and improve usable capacitance. Always model impedance vs. frequency using manufacturer SPICE models if available.

Can Walsin 1210B105K101CT be used reliably in automotive under-hood applications given its X7R dielectric and 1210 package size?

While the Walsin 1210B105K101CT supports an operating temperature range of -55°C to 125°C, automotive under-hood environments can exceed 125°C in extreme conditions, pushing the part beyond its safe operating limit. Additionally, the 1210 SMD package is prone to mechanical stress cracking from thermal cycling and board flex. For under-hood use, consider automotive-qualified alternatives like TAIYO YUDEN’s LMK316BJ107MM-T or Murata’s GRM32DC71H107KA12#, which are AEC-Q200 compliant. If using Walsin 1210B105K101CT, implement strict board strain relief, avoid placement near mounting holes, and ensure conformal coating to manage humidity and thermal shock.

What PCB layout practices minimize microphonics and cracking risks with Walsin 1210B105K101CT in vibration-prone environments?

To reduce microphonics and mechanical cracking in vibration-sensitive systems, optimize PCB layout for the Walsin 1210B105K101CT by orienting the longer 3.2mm dimension perpendicular to expected board flex, minimizing stress on solder joints. Use solder reliefs or rounded traces to reduce stress concentration. Avoid placing near board edges or connectors. Implement castellated mounting vias or edge restraints in high-vibration equipment. Additionally, use polymer solder masks and low-modulus solder paste if feasible. For critical applications, consider conformal coating or potting to dampen mechanical resonance. Always validate with mechanical shock and thermal cycling testing.

How does moisture sensitivity level (MSL-1) of Walsin 1210B105K101CT affect SMT assembly yield in humid environments?

The Walsin 1210B105K101CT has MSL-1 (unlimited floor life), meaning it can be stored and handled at ambient conditions ≤30°C/85% RH without pre-baking. This significantly reduces SMT assembly risks in high-humidity environments compared to MSL-2 or higher parts. However, ensure storage remains within specification to prevent surface oxidation or moisture absorption at the terminations, which can cause tombstoning or poor wetting. Use nitrogen-assisted reflow if humidity control is inconsistent. Verify solder paste stencil design (0.15mm thick recommended) matches 1210 footprint to ensure consistent thermal mass and minimize defects during rapid heating.

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