SIP12116DMP-T1-GE4 >
SIP12116DMP-T1-GE4
Vishay Siliconix
IC REG BUCK ADJ 3A 10DFN
22414 Pcs New Original In Stock
Buck Switching Regulator IC Positive Adjustable 0.6V 1 Output 3A 10-VFDFN Exposed Pad
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SIP12116DMP-T1-GE4 Vishay Siliconix
5.0 / 5.0 - (49 Ratings)

SIP12116DMP-T1-GE4

Product Overview

1078363

DiGi Electronics Part Number

SIP12116DMP-T1-GE4-DG

Manufacturer

Vishay Siliconix
SIP12116DMP-T1-GE4

Description

IC REG BUCK ADJ 3A 10DFN

Inventory

22414 Pcs New Original In Stock
Buck Switching Regulator IC Positive Adjustable 0.6V 1 Output 3A 10-VFDFN Exposed Pad
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Quantity
Minimum 1

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In Stock (All prices are in USD)
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  • 1 12.2366 12.2366
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SIP12116DMP-T1-GE4 Technical Specifications

Category Power Management (PMIC), Voltage Regulators - DC DC Switching Regulators

Manufacturer Vishay

Packaging Tape & Reel (TR)

Series -

Product Status Active

Function Step-Down

Output Configuration Positive

Topology Buck

Output Type Adjustable

Number of Outputs 1

Voltage - Input (Min) 4.5V

Voltage - Input (Max) 15V

Voltage - Output (Min/Fixed) 0.6V

Voltage - Output (Max) 5.5V

Current - Output 3A

Frequency - Switching 600kHz

Synchronous Rectifier Yes

Operating Temperature -40°C ~ 85°C (TA)

Mounting Type Surface Mount

Package / Case 10-VFDFN Exposed Pad

Supplier Device Package 10-DFN (3x3)

Base Product Number SIP12116

Datasheet & Documents

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
SIP12116DMP-T1-GE4DKR-DG
742-SIP12116DMP-T1-GE4DKR
742-SIP12116DMP-T1-GE4CT
SIP12116DMP-T1-GE4TR
SIP12116DMP-T1-GE4CT-DG
SIP12116DMP-T1-GE4TR-DG
742-SIP12116DMP-T1-GE4TR
SIP12116DMP-T1-GE4DKR
SIP12116DMP-T1-GE4CT
Standard Package
2,500

Reviews

5.0/5.0-(Show up to 5 Ratings)
迷***家
Dec 02, 2025
5.0
他們的技術支援團隊非常專業,每次問題都能迅速幫我解決,值得信賴。
海***やき
Dec 02, 2025
5.0
商品が丁寧に梱包されていて、価格以上の価値を感じました。
Gent***ipple
Dec 02, 2025
5.0
The team’s commitment to excellent service made a lasting impression.
Radia***pirit
Dec 02, 2025
5.0
Tracking my order with DiGi Electronics was straightforward and reassuring.
Calm***horia
Dec 02, 2025
5.0
Their pricing is very competitive, and the shipping is always timely.
Serendi***ySprings
Dec 02, 2025
5.0
The after-sales care team is very attentive, ensuring my concerns are fully addressed.
Nig***aven
Dec 02, 2025
5.0
Their competitive pricing doesn't compromise on quality, which is fantastic.
Lus***adow
Dec 02, 2025
5.0
The post-purchase follow-up shows their commitment to customers.
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Frequently Asked Questions (FAQ)

Can the SIP12116DMP-T1-GE4 be used as a drop-in replacement for the Texas Instruments TPS54332DDAR in a 5V-to-1.2V, 3A buck converter design, and what layout or compensation adjustments might be needed?

While both the SIP12116DMP-T1-GE4 and TPS54332DDAR are 3A synchronous buck regulators with similar input/output ranges, they are not direct drop-in replacements due to differences in control architecture and compensation requirements. The SIP12116DMP-T1-GE4 uses a voltage-mode control with internal compensation optimized for its 600kHz switching frequency, whereas the TPS54332DDAR employs current-mode control with external compensation. If replacing, you must re-evaluate the feedback network and output capacitor selection—specifically, ensure the output capacitance provides sufficient phase margin with the SIP12116DMP-T1-GE4’s internal error amplifier. Additionally, verify that the PCB footprint matches (both are 3x3mm DFN), but note that thermal pad grounding and SW node routing may require adjustments to minimize EMI and improve efficiency.

What are the critical thermal design considerations when using the SIP12116DMP-T1-GE4 in a compact enclosure with ambient temperatures up to 70°C, and how does the exposed pad affect heat dissipation?

The SIP12116DMP-T1-GE4 relies heavily on its 10-DFN exposed pad for heat sinking, especially under high-load conditions near its 3A limit. In a 70°C ambient environment, junction temperature can approach 125°C without proper thermal management. You must connect the exposed pad to a solid ground plane with multiple vias (≥9 vias of 0.3mm diameter recommended) to transfer heat to inner or bottom layers. Avoid placing thermal reliefs on the pad vias, as this increases thermal resistance. If the PCB lacks sufficient copper area, consider adding a small heatsink or increasing copper pour on adjacent layers. Monitor efficiency at full load—conduction losses in the internal FETs generate significant heat, and derating may be necessary above 60°C ambient to ensure long-term reliability.

How does the SIP12116DMP-T1-GE4 handle input voltage transients above 15V, such as load dump events in automotive applications, and is external protection required?

The SIP12116DMP-T1-GE4 has an absolute maximum input voltage of 16V, so even brief transients above 15V—common in automotive load dump scenarios (which can reach 40V+)—can damage the device. It is not rated for automotive use without additional protection. To safely use it in such environments, implement a TVS diode (e.g., SMAJ15A) close to the input connector and consider a series Schottky diode or eFuse for reverse polarity and overvoltage protection. A bulk input capacitor (≥10µF low-ESR ceramic) should also be placed near the VIN pin to absorb high-frequency spikes. Without these measures, repeated exposure to overvoltage will degrade or destroy the SIP12116DMP-T1-GE4, leading to premature field failures.

Can the SIP12116DMP-T1-GE4 operate stably with ceramic output capacitors only, and what ESR/ESL values are acceptable to avoid subharmonic oscillation or poor transient response?

Yes, the SIP12116DMP-T1-GE4 is designed to work with all-ceramic output capacitors due to its internally compensated architecture and 600kHz switching frequency. However, very low ESR (<5mΩ) ceramics can cause peaking in the control loop and degrade phase margin. To mitigate this, use capacitors with moderate ESR (10–30mΩ) or add a small series resistor (0.1–1Ω) in line with the output capacitor if ultra-low-ESR types (e.g., X5R/X7R 10µF 0805) are used. Ensure total output capacitance is between 22µF and 100µF for optimal transient response. Avoid using only one very large capacitor; instead, use multiple smaller values in parallel to reduce ESL and improve high-frequency decoupling. This approach ensures stability while maintaining fast load-step performance.

What reliability risks should be considered when designing with the SIP12116DMP-T1-GE4 in industrial applications with frequent power cycling, and how can solder joint fatigue be minimized?

Frequent power cycling in industrial settings induces thermal cycling on the SIP12116DMP-T1-GE4, which can lead to solder joint fatigue—especially at the exposed pad—due to CTE mismatch between the package and PCB. To enhance reliability, use a high-tin-content solder (e.g., SAC305) and ensure the PCB pad is fully wetted with adequate solder volume. Implement a symmetrical via pattern under the exposed pad to evenly distribute thermal stress. Avoid placing the device near board edges or mechanical stress points. Additionally, consider conformal coating to protect against moisture and dust, which can exacerbate corrosion under thermal stress. For mission-critical systems, perform thermal cycle testing (-40°C to +85°C) early in validation to identify weak joints before deployment.

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