T58MM226M6R3C0500 >
T58MM226M6R3C0500
Vishay Polytech
CAP TANT POLY 22UF 6.3V 0603
79213 Pcs New Original In Stock
22 µF Molded Tantalum Polymer Capacitor 6.3 V 0603 (1608 Metric) 500mOhm @ 100kHz
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T58MM226M6R3C0500
5.0 / 5.0 - (179 Ratings)

T58MM226M6R3C0500

Product Overview

11673636

DiGi Electronics Part Number

T58MM226M6R3C0500-DG

Manufacturer

Vishay Polytech
T58MM226M6R3C0500

Description

CAP TANT POLY 22UF 6.3V 0603

Inventory

79213 Pcs New Original In Stock
22 µF Molded Tantalum Polymer Capacitor 6.3 V 0603 (1608 Metric) 500mOhm @ 100kHz
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 5 0.3387 1.6935
  • 50 0.2639 13.1950
  • 150 0.2331 34.9650
  • 500 0.1935 96.7500
  • 2500 0.1760 440.0000
  • 4000 0.1642 656.8000
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T58MM226M6R3C0500 Technical Specifications

Category Tantalum - Polymer Capacitors

Manufacturer

Packaging Tape & Reel (TR)

Series vPolyTan™ T58

Product Status Active

Capacitance 22 µF

Tolerance ±20%

Voltage - Rated 6.3 V

Type Molded

ESR (Equivalent Series Resistance) 500mOhm @ 100kHz

Operating Temperature -55°C ~ 105°C

Lifetime @ Temp. 1000 Hrs @ 85°C

Mounting Type Surface Mount

Package / Case 0603 (1608 Metric)

Size / Dimension 0.063" L x 0.033" W (1.60mm x 0.85mm)

Height - Seated (Max) 0.035" (0.90mm)

Lead Spacing -

Manufacturer Size Code MM

Ratings -

Features General Purpose

Datasheet & Documents

HTML Datasheet

T58MM226M6R3C0500-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8532.21.0050

Additional Information

Other Names
718-2112-2
718-2112-1
718-2112-6
Standard Package
4,000

Alternative Parts

PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
F380J226MMA
KYOCERA AVX
60240
F380J226MMA-DG
0.1563
Parametric Equivalent

Reviews

5.0/5.0-(Show up to 5 Ratings)
푸***길
Dec 02, 2025
5.0
디지 일렉트로닉스는 제품의 일관성과 함께 신속한 고객 지원이 강점입니다.
구***다
Dec 02, 2025
5.0
구매 후 문제 발생 시 빠른 해결책을 제시하여 매우 만족스럽습니다.
맑은***으로
Dec 02, 2025
5.0
고객 지원팀이 항상 친절하고 신속하게 해결해줘서 너무 좋았습니다.
햇***한날
Dec 02, 2025
5.0
매번 신상품이 다양하게 입고되고 가격도 공개적이어서 매우 신뢰가 가요.
Her***lter
Dec 02, 2025
5.0
Ich schätze die nachhaltigen Verpackungen bei DiGi Electronics sehr. Das Preis-Leistungs-Verhältnis ist unschlagbar.
Bli***auch
Dec 02, 2025
5.0
Über die schnelle Lieferung bin ich begeistert. Die Verpackung war stabil und sehr gut verarbeitet, alles kam heil an.
Quie***rbor
Dec 02, 2025
5.0
The company's logistics process is finely tuned for accuracy and speed.
Hopef***earts
Dec 02, 2025
5.0
Exceptional quality products delivered at warp speed—will order again.
Ech***ves
Dec 02, 2025
5.0
The seamless website navigation makes shopping quick and efficient.
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Frequently Asked Questions (FAQ)

What are the key risks when using the T58MM226M6R3C0500 in a high-temperature environment near its maximum rated temperature of 105°C?

When operating the T58MM226M6R3C0500 near its 105°C upper limit, the primary risk is accelerated aging and reduced reliability due to higher internal hot-spot temperatures. Although the capacitor is rated for 1000 hours at 85°C, exceeding this stress level without derating can lead to premature ESR increase and capacitance loss. To mitigate risk, ensure proper PCB thermal design—including minimizing copper traces under the capacitor and avoiding placement near heat sources—and consider voltage derating (e.g., limiting applied voltage to ≤50% of rated 6.3V) to enhance long-term stability in sustained high-temperature applications.

How does the ESR performance of the T58MM226M6R3C0500 compare to the Murata GRM188R71H224KA88 in decoupling applications for low-noise LDOs?

The T58MM226M6R3C0500 offers a significantly lower ESR of 500mΩ at 100kHz compared to the Murata GRM188R71H224KA88 (a ceramic MLCC with near-zero ESR but potential piezoelectric noise), making the T58MM226M6R3C0500 more predictable in damping voltage transients without microphonic effects. However, unlike MLCCs, the T58MM226M6R3C0500 does not suffer from capacitance loss under DC bias, which benefits stable decoupling. Use the T58MM226M6R3C0500 when stable ESR and bias immunity are critical, but pair it with a small ceramic capacitor if ultra-low impedance at high frequencies is required.

Can the T58MM226M6R3C0500 be used as a direct replacement for the Kemet A750D226M2R5ATE085 in a power rail filter circuit, and what design checks are needed?

The T58MM226M6R3C0500 can replace the Kemet A750D226M2R5ATE085 in many filter applications, but critical checks are required: verify voltage rating (6.3V vs. 2.5V on Kemet part) to avoid overdesign, confirm 500mΩ ESR is acceptable (the Kemet part has ~30mΩ, so damping characteristics will differ), and assess ripple current handling in your circuit. The higher ESR of the T58MM226M6R3C0500 may reduce effectiveness in high-frequency filtering but improve stability in feedback-controlled systems where low ESR causes resonance. Always simulate or bench-test the response post-replacement.

What PCB layout practices should be followed when integrating the T58MM226M6R3C0500 in a densely packed 0603 array to ensure reliability and thermal performance?

For reliable integration of the T58MM226M6R3C0500 in high-density 0603 arrays, use symmetric pad designs per IPC-7351, maintain at least 0.1mm spacing between adjacent pads to prevent solder bridging, and avoid thermal vias directly under the pads to prevent uneven reflow. Given its MSL 3 rating, control moisture exposure during assembly and ensure the reflow profile stays within JEDEC guidelines to avoid 'popcorning.' Use moderate copper pour around, but not under, the component to balance thermal dissipation without creating tombstoning risks during soldering.

What are the failure mode risks of the T58MM226M6R3C0500 in automotive power supplies subject to frequent on-off cycling?

In automotive power supplies with frequent cycling, the T58MM226M6R3C0500 may be exposed to repeated thermal stress due to current surges and ambient swings from -40°C to 105°C. While the capacitor operates from -55°C to 105°C, repeated thermal cycling can exacerbate mechanical stress at solder joints due to CTE mismatch. To reduce failure risk, ensure the design limits inrush current via soft-start circuitry, validate solder joint integrity under thermal cycling (-40°C to 125°C, if applicable), and consider conformal coating to mitigate long-term environmental degradation, especially in high-humidity conditions.

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