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IHLP1616BZER2R2MA1
Vishay Dale
IHLP-1616BZ-A1 2.2 20% ER E3
36731 Pcs New Original In Stock
2.2 µH Shielded Inductor 2.85 A 90mOhm Max Nonstandard
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5.0 / 5.0
- (36 Ratings)
IHLP1616BZER2R2MA1
Product Overview
10410836
DiGi Electronics Part Number
IHLP1616BZER2R2MA1-DGManufacturer
Vishay Dale
IHLP1616BZER2R2MA1
Description
IHLP-1616BZ-A1 2.2 20% ER E3Inventory
36731 Pcs New Original In Stock
2.2 µH Shielded Inductor 2.85 A 90mOhm Max Nonstandard
Quantity
Minimum 1
Minimum 1
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IHLP1616BZER2R2MA1 Technical Specifications
Category
Fixed Inductors
Packaging
Tape & Reel (TR)
Series
IHLP-1616BZ-A1
Product Status
Active
Type
-
Material - Core
Metal Composite
Inductance
2.2 µH
Tolerance
±20%
Current Rating (Amps)
2.85 A
Current - Saturation (Isat)
6A
Shielding
Shielded
DC Resistance (DCR)
90mOhm Max
Q @ Freq
-
Frequency - Self Resonant
39MHz
Ratings
AEC-Q200
Operating Temperature
-55°C ~ 125°C
Inductance Frequency - Test
100 kHz
Features
-
Mounting Type
Surface Mount
Package / Case
Nonstandard
Supplier Device Package
-
Size / Dimension
0.175" L x 0.160" W (4.45mm x 4.06mm)
Height - Seated (Max)
0.079" (2.00mm)
Datasheet & Documents
HTML Datasheet
IHLP1616BZER2R2MA1-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8504.50.8000
Additional Information
Other Names
541-IHLP1616BZER2R2MA1TR
541-IHLP1616BZER2R2MA1DKR
541-IHLP1616BZER2R2MA1CT
Standard Package
4,000
Alternative Parts
View DetailsPART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Their speed in processing and shipping orders is unmatched in the industry.
Dec 02, 2025
Every time I contact DiGi Electronics' customer service, I receive prompt and courteous assistance that exceeds expectations.
Dec 02, 2025
Speedy delivery paired with affordable costs—I’m always happy with my purchases.
Dec 02, 2025
The homepage loads quickly, even during peak hours, which I really appreciate.
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Frequently Asked Questions (FAQ)
Can the IHLP1616BZER2R2MA1 be used as a drop-in replacement for the MPIA4020V2-2R2-R in a high-current DC-DC converter, and what design risks should I consider?
While the IHLP1616BZER2R2MA1 and MPIA4020V2-2R2-R both offer 2.2 µH inductance and similar current ratings, they are not direct drop-in replacements due to differences in footprint, thermal performance, and core material. The IHLP1616BZER2R2MA1 uses a metal composite core with superior saturation characteristics (6A Isat vs ~4.5A for the MPIA4020V2-2R2-R), making it more suitable for high transient load applications. However, its nonstandard 4.45mm x 4.06mm package may not align with the MPIA4020V2-2R2-R’s land pattern. Additionally, the IHLP1616BZER2R2MA1 has a lower DCR (90mΩ max vs ~120mΩ), which reduces conduction losses but may affect soft-start behavior in some controllers. Always verify PCB layout compatibility, re-evaluate thermal derating at your operating temperature, and confirm stability with your specific control loop before substitution.
What are the key reliability concerns when using the IHLP1616BZER2R2MA1 in automotive power systems operating near its 125°C limit?
The IHLP1616BZER2R2MA1 is AEC-Q200 qualified, which validates its suitability for automotive environments, but prolonged operation near 125°C requires careful derating. At elevated temperatures, the metal composite core exhibits reduced permeability, potentially shifting effective inductance by up to 15–20%, which can impact converter efficiency and transient response. Additionally, while MSL 1 allows unlimited floor life, repeated thermal cycling between -55°C and 125°C may induce mechanical stress on the solder joints due to CTE mismatch with the PCB. To mitigate risk, maintain at least 20% current derating above 105°C, ensure adequate copper pour for heat spreading, and avoid placing the IHLP1616BZER2R2MA1 adjacent to other high-heat components. Monitor in-system inductance drift during thermal soak testing.
How does the IHLP1616BZER2R2MA1 compare to the older IHLP1616BZER2R2M01 variant in terms of performance and sourcing risk?
The IHLP1616BZER2R2MA1 is the latest revision in the IHLP-1616BZ-A1 series and offers improved process consistency and tighter manufacturing controls compared to the legacy IHLP1616BZER2R2M01. Electrically, both share identical specs (2.2 µH, 2.85 A Irms, 6 A Isat), but the 'A1' suffix indicates enhanced reliability screening and better parametric stability over temperature. From a sourcing perspective, the IHLP1616BZER2R2MA1 is actively stocked (36,720 units available), while the M01 version is being phased out. Designing in the IHLP1616BZER2R2MA1 reduces long-term supply chain risk and ensures access to future firmware or qualification updates. If you're redesigning or qualifying a new platform, prefer the A1 variant; for like-for-like replacements in existing builds, either may be used, but always verify batch-to-batch consistency in critical applications.
Is the IHLP1616BZER2R2MA1 suitable for high-frequency switching applications above 2 MHz, given its 39 MHz self-resonant frequency?
Although the IHLP1616BZER2R2MA1 has a self-resonant frequency of 39 MHz—well above typical switching frequencies—its effective usability above 2 MHz is limited by core losses and parasitic behavior. The metal composite core exhibits increasing hysteresis and eddy current losses beyond 1–2 MHz, leading to reduced Q-factor and higher core temperature rise even if RMS current remains within rating. Additionally, the nonstandard package introduces trace inductance and capacitance that can interact with PCB parasitics, potentially causing EMI or instability in resonant topologies. For switching frequencies above 2 MHz, consider lower-inductance, high-frequency-optimized inductors like the Vishay IHLE series with integrated shielding. If you must use the IHLP1616BZER2R2MA1 above 2 MHz, validate efficiency, thermal performance, and conducted emissions through prototype testing, and minimize loop area in the switching node layout.
What layout and grounding practices are critical when integrating the IHLP1616BZER2R2MA1 into a noise-sensitive analog power rail?
Despite being shielded, the IHLP1616BZER2R2MA1 can still couple magnetic and electric noise into adjacent circuits if not properly laid out. Place it at least 5 mm away from sensitive analog components (e.g., ADCs, op-amps) and orient it perpendicular to low-level signal traces to minimize mutual inductance. Use a solid ground plane beneath the inductor but avoid routing high-impedance analog traces underneath it. Connect the shield (if accessible via pad or via stitching) directly to the quiet analog ground plane—not the noisy power ground—to prevent ground bounce. Also, ensure input and output capacitors are placed as close as possible to the IHLP1616BZER2R2MA1 terminals to minimize high-di/dt loops. Finally, avoid splitting the ground plane under the inductor, as this can increase radiated emissions and degrade PSRR in downstream regulators.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
IHLP1616BZER2R2MA1 CAD Models
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