SMM01020C9101FB300 >
SMM01020C9101FB300
Vishay Beyschlag/Draloric/BC Components
SMM0102 50 9K1 1% B3
23207 Pcs New Original In Stock
Chip Resistor
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SMM01020C9101FB300
5.0 / 5.0 - (158 Ratings)

SMM01020C9101FB300

Product Overview

2064277

DiGi Electronics Part Number

SMM01020C9101FB300-DG
SMM01020C9101FB300

Description

SMM0102 50 9K1 1% B3

Inventory

23207 Pcs New Original In Stock
Chip Resistor
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 3000 0.0817 245.1573
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SMM01020C9101FB300 Technical Specifications

Category Chip Resistor - Surface Mount

Manufacturer Vishay BC Components

Packaging Tape & Reel (TR)

Series *

Product Status Active

Datasheet & Documents

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8533.21.0040

Additional Information

Other Names
749-SMM01020C9101FB300TR
Standard Package
3,000

Reviews

5.0/5.0-(Show up to 5 Ratings)
푸***길
Dec 02, 2025
5.0
항상 빠르고 친절한 지원 덕분에 만족스럽게 거래하고 있어요.
幸***者
Dec 02, 2025
5.0
我非常信任DiGi Electronics的出貨效率,每次都準時收到心儀的貨品。
星***者
Dec 02, 2025
5.0
經過多次購買,DiGi Electronics確實提供令人滿意的價格和服務。
Carne***Voyage
Dec 02, 2025
5.0
Une entreprise qui valorise vraiment la satisfaction client et la qualité.
Bri***Nest
Dec 02, 2025
5.0
Shopping here is a pleasant experience, thanks to their price transparency and reliable support.
Sere***hores
Dec 02, 2025
5.0
The craftsmanship and materials used are truly impressive.
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Frequently Asked Questions (FAQ)

How does the SMM01020C9101FB300 perform in high-density PCB layouts where thermal dissipation is a concern?

The SMM01020C9101FB300, being a 0102-size chip resistor, has limited surface area for heat dissipation, making thermal management critical in high-density designs. In tightly packed layouts, cumulative heating from adjacent components can push the resistor beyond its derated power capability, especially since its rated power is only 0.05W. To mitigate risk, ensure at least 0.3mm spacing from nearby heat sources, use thermal vias when possible, and verify operating temperature under worst-case conditions. Consider using multiple parallel SMM01020C9101FB300 resistors to distribute heat if sustained power exceeds 70% of its rating.

Can the SMM01020C9101FB300 be used as a direct footprint-compatible replacement for the RC01005FR-079K1L in precision voltage division circuits?

While the SMM01020C9101FB300 and RC01005FR-079K1L share similar small footprints (both 01005/0402-class), the SMM01020C9101FB300 is a 0102-size resistor with higher aspect ratio and different pad geometry, making it not footprint-compatible without PCB redesign. Attempting direct drop-in replacement risks solder joint bridging or insufficient wetting. If upgrading from RC01005FR-079K1L for better power handling, re-optimize the layout for the SMM01020C9101FB300’s recommended pad dimensions and verify assembly yield with stencil aperture adjustments.

What are the reliability risks of using the SMM01020C9101FB300 in high-humidity industrial environments despite its MSL 1 rating?

The SMM01020C9101FB300’s MSL 1 rating indicates it can withstand indefinite exposure to ambient conditions, but prolonged exposure to high humidity in industrial settings can still lead to performance degradation due to moisture ingress at the termination interface, especially under thermal cycling. Although Vishay’s construction includes protective coatings, long-term reliability in humidity >85% RH should be evaluated with conformal coating (e.g., acrylic or silicone). Additionally, avoid designs where the SMM01020C9101FB300 is exposed to condensation or conductive contaminants, as these can cause leakage currents or drift beyond its 1% tolerance.

How does the SMM01020C9101FB300 compare to the ERJ-2RKF9101X in high-frequency filtering applications above 100MHz?

The SMM01020C9101FB300 and ERJ-2RKF9101X both offer 9.1kΩ resistance and 1% tolerance, but their RF performance differs due to distinct internal structures. The SMM01020C9101FB300 uses a thick-film chip design with higher parasitic inductance (typically >0.4nH), which can introduce impedance deviations above 100MHz, affecting filter stability. In contrast, the ERJ-2RKF9101X uses a thin-film process with better high-frequency consistency. For RF filtering or impedance matching above 100MHz, the SMM01020C9101FB300 may require compensation via shorter trace lengths and ground plane isolation to minimize resonant effects.

What pcb design practices minimize solder joint cracking in SMM01020C9101FB300 when used in automotive applications with frequent thermal cycling?

To prevent solder joint cracking in automotive applications, optimize pad layout for the SMM01020C9101FB300 using IPC-7351-compliant footprints with slight solder mask defined (SMD) pads to enhance adhesion. Use a symmetric thermal relief design and avoid via-in-pad unless filled and plated. Select lead-free solder alloys with good fatigue resistance (e.g., SAC305) and ensure reflow profiles follow JEDEC J-STD-020 to minimize voiding. Additionally, consider underfill or localized potting in designs exposed to combined thermal cycling and mechanical vibration, as the small 0102 body of the SMM01020C9101FB300 is more susceptible to stress concentration than larger packages.

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