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TSV912AQDGKRQ1
Texas Instruments
IC OPAMP GP 2 CIRCUIT 8VSSOP
20271 Pcs New Original In Stock
General Purpose Amplifier 2 Circuit Rail-to-Rail 8-VSSOP
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5.0 / 5.0
- (384 Ratings)
TSV912AQDGKRQ1
Product Overview
12989299
DiGi Electronics Part Number
TSV912AQDGKRQ1-DGManufacturer
Texas Instruments
TSV912AQDGKRQ1
Description
IC OPAMP GP 2 CIRCUIT 8VSSOPInventory
20271 Pcs New Original In Stock
General Purpose Amplifier 2 Circuit Rail-to-Rail 8-VSSOP
Quantity
Minimum 1
Minimum 1
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TSV912AQDGKRQ1 Technical Specifications
Category
Linear, Amplifiers, Instrumentation, Op Amps, Buffer Amps
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Amplifier Type
General Purpose
Number of Circuits
2
Output Type
Rail-to-Rail
Slew Rate
4.5V/µs
Gain Bandwidth Product
8 MHz
Current - Input Bias
5 pA
Voltage - Input Offset
300 µV
Current - Supply
550µA (x2 Channels)
Current - Output / Channel
50 mA
Voltage - Supply Span (Min)
2.5 V
Voltage - Supply Span (Max)
5.5 V
Operating Temperature
-40°C ~ 125°C
Grade
Automotive
Qualification
AEC-Q100
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package
8-VSSOP
Datasheet & Documents
HTML Datasheet
TSV912AQDGKRQ1-DG
Environmental & Export Classification
RoHS Status
Not applicable
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8542.33.0001
Additional Information
Other Names
296-TSV912AQDGKRQ1DKR
296-TSV912AQDGKRQ1TR
296-TSV912AQDGKRQ1CT
Standard Package
2,500
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
購物過程順暢，出貨快速，售後支持細心，讚！
Dec 02, 2025
在迪基電子購物，客服非常專業，解答每個問題都耐心細心，讓我感受到貼心的售後服務。
Dec 02, 2025
Sowohl Preis als auch Zuverlässigkeit sind bei DiGi Electronics top.
Dec 02, 2025
I found the interface to be very accessible, even for users with limited technical skills.
Dec 02, 2025
DiGi Electronics offers detailed FAQs and troubleshooting guides on their site, which are very helpful.
Dec 02, 2025
My order was shipped promptly and arrived ahead of schedule.
Dec 02, 2025
Delivery was quicker than I anticipated; I appreciated the timely updates and tracking info.
Dec 02, 2025
The shipping speed from DiGi Electronics is impressive; I often get my orders within 48 hours of placing the request.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the TSV912AQDGKRQ1 in a dual-supply sensor interface operating near 2.5V?
When designing with the TSV912AQDGKRQ1 in low-voltage dual-supply configurations (e.g., ±1.25V, total 2.5V), a key risk is ensuring signal integrity near the rail extremes despite rail-to-rail input/output operation. While the TSV912AQDGKRQ1 supports 2.5V minimum supply, headroom can be tight for sensor signals near 0V or V+. Maintain at least 50mV clearance from the rails for optimal linearity, especially with higher source impedances, to avoid input crossover distortion. Additionally, verify stability when driving capacitive loads such as long traces or EMI filters—consider adding a small series resistor (10–47Ω) at the output. Always decouple V+ and V− supplies with 100nF ceramic capacitors close to the device pins to minimize noise susceptibility in sensitive analog front-ends.
How does the TSV912AQDGKRQ1 compare to the NCV27299DBVR in automotive applications requiring low input bias current and AEC-Q100 compliance?
The TSV912AQDGKRQ1 and NCV27299DBVR are both AEC-Q100 qualified dual op-amps targeting automotive environments, but the TSV912AQDGKRQ1 offers superior input bias current (5 pA vs. ~100 pA typical in NCV27299DBVR), making it better suited for high-impedance sensor interfaces like piezoelectric or photodiode circuits where leakage could induce DC error. The TSV912AQDGKRQ1 also provides higher gain bandwidth (8 MHz vs. 1.8 MHz) and faster slew rate (4.5 V/µs vs. 1.5 V/µs), enabling better transient response. However, the NCV27299DBVR may offer better EMI rejection in very noisy environments. For precision, low-power signal conditioning under 5.5V rails, TSV912AQDGKRQ1 is the preferred upgrade path from older automotive general-purpose amps.
Can I replace an aging LMV358QDRQ1 with the TSV912AQDGKRQ1 in an existing automotive PCB layout, and what layout modifications should I consider?
Yes, the TSV912AQDGKRQ1 can serve as a functional upgrade to the LMV358QDRQ1 in most cases, as both are AEC-Q100 qualified, dual op-amps in 8-VSSOP packages with rail-to-rail output. However, the TSV912AQDGKRQ1 has significantly lower input bias current (5 pA vs. 100 nA) and lower input offset voltage (300 µV vs. 3 mV max), so feedback network resistors may need re-evaluation—high-impedance networks previously acceptable for LMV358 may now introduce thermal noise or parasitic leakage issues. Also, ensure proper RF filtering on high-impedance inputs to prevent oscillation due to the TSV912AQDGKRQ1's higher bandwidth. Revisit PCB parasitic capacitance in filter paths and maintain short, direct feedback traces to avoid phase margin degradation.
What thermal and reliability considerations should be addressed when operating the TSV912AQDGKRQ1 at 125°C in under-hood automotive designs?
At the upper end of its operating range (125°C), the TSV912AQDGKRQ1 maintains AEC-Q100 reliability, but design-in practices must mitigate parametric drift. Input offset voltage can vary more significantly over temperature, potentially affecting DC precision—use calibration or chopper-stabilized topologies if absolute accuracy is critical. Additionally, while the device has low quiescent current (550 µA per channel), ensure the PCB layout has adequate copper for heat dissipation, particularly if adjacent components generate heat. Avoid placing the TSV912AQDGKRQ1 directly under connectors or heat sinks. To maintain long-term reliability, keep ambient humidity low and leverage the device's MSL1 rating by minimizing exposure prior to reflow, even though moisture sensitivity is not a constraint.
What are the trade-offs when using the TSV912AQDGKRQ1 versus the TSV922AQDBVRQ1 in a 3.3V battery-powered automotive sensor node?
Choosing between the TSV912AQDGKRQ1 and TSV922AQDBVRQ1 for a 3.3V automotive sensor node involves trade-offs in bandwidth, power, and output drive. The TSV912AQDGKRQ1 offers higher gain bandwidth (8 MHz) and faster slew rate (4.5 V/µs), making it suitable for faster signal conditioning, but consumes slightly more quiescent current per channel (~275 µA total for both channels). The TSV922AQDBVRQ1 is optimized for lower power (120 µA total) at the expense of bandwidth (1.8 MHz) and slew rate (0.8 V/µs), ideal for slow-varying sensor signals. For intermittent sensing with battery longevity as a priority, TSV922AQDBVRQ1 is better. For systems requiring wider dynamic response (e.g., motor feedback or audio preamp stages), TSV912AQDGKRQ1 provides superior performance with manageable power impact.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
TSV912AQDGKRQ1 CAD Models
Texas Instruments TSV912AQDGKRQ1 PCB symbols & footprints
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