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TS3A5017QRGYRQ1
Texas Instruments
IC SWITCH SP4T X 2 11OHM 16VQFN
44426 Pcs New Original In Stock
2 Circuit IC Switch 4:1 11Ohm (Typ) 16-VQFN (4x3.5)
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5.0 / 5.0
- (333 Ratings)
TS3A5017QRGYRQ1
Product Overview
1828279
DiGi Electronics Part Number
TS3A5017QRGYRQ1-DGManufacturer
Texas Instruments
TS3A5017QRGYRQ1
Description
IC SWITCH SP4T X 2 11OHM 16VQFNInventory
44426 Pcs New Original In Stock
2 Circuit IC Switch 4:1 11Ohm (Typ) 16-VQFN (4x3.5)
Quantity
Minimum 1
Minimum 1
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TS3A5017QRGYRQ1 Technical Specifications
Category
Interface, Analog Switches, Multiplexers, Demultiplexers
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Switch Circuit
SP4T
Multiplexer/Demultiplexer Circuit
4:1
Number of Circuits
2
On-State Resistance (Max)
11Ohm (Typ)
Channel-to-Channel Matching (ΔRon)
1Ohm
Voltage - Supply, Single (V+)
2.3V ~ 3.6V
Voltage - Supply, Dual (V±)
-
Switch Time (Ton, Toff) (Max)
9.5ns, 3.5ns
-3db Bandwidth
165MHz
Charge Injection
5pC
Channel Capacitance (CS(off), CD(off))
4.5pF, 19pF
Current - Leakage (IS(off)) (Max)
50nA (Typ)
Crosstalk
-69dB @ 1MHz
Operating Temperature
-40°C ~ 125°C (TA)
Grade
Automotive
Qualification
AEC-Q100
Mounting Type
Surface Mount
Package / Case
16-VFQFN Exposed Pad
Supplier Device Package
16-VQFN (4x3.5)
Base Product Number
TS3A5017
Datasheet & Documents
Manufacturer Product Page
TS3A5017QRGYRQ1 Specifications
HTML Datasheet
TS3A5017QRGYRQ1-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-53169-6
296-53169-1
296-53169-2
Standard Package
3,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
售後服務非常到位，客服人員耐心解答我的疑問，讓我對品牌充滿信心，值得推薦！
Dec 02, 2025
Its durable nature makes it a valuable addition to my daily routine.
Dec 02, 2025
Their team is always courteous, knowledgeable, and eager to assist.
Dec 02, 2025
I appreciated the thoroughness of their customer service team, who went above and beyond to ensure my satisfaction after my purchase.
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Frequently Asked Questions (FAQ)
Can the TS3A5017QRGYRQ1 be used to switch high-speed differential signals like USB 2.0 or LVDS without significant signal degradation?
The TS3A5017QRGYRQ1 supports signals up to 165MHz (-3dB bandwidth), making it marginal for full-speed USB 2.0 (12 Mbps, ~6 MHz fundamental) but unsuitable for high-speed USB 2.0 (480 Mbps) or LVDS, which require >1 GHz bandwidth. Its 11Ω on-resistance and 19pF drain capacitance introduce noticeable insertion loss and rise-time degradation at multi-gigabit rates. For USB 2.0 HS or LVDS, consider lower-capacitance, higher-bandwidth switches like the TS3USB3000 or PI3USB30532. Use the TS3A5017QRGYRQ1 only for control or low-frequency data routing in automotive sensor networks or infotainment subsystems.
Is it safe to replace the TS3A5017QRGYRQ1 with a cheaper general-purpose analog switch like the ADG774A in an automotive-grade design?
No—direct replacement is not recommended. While the ADG774A offers similar SP4T functionality, it lacks AEC-Q100 qualification, has a narrower operating temperature range (-40°C to +85°C), and is not rated for automotive reliability stresses. The TS3A5017QRGYRQ1 is specifically designed for automotive environments with enhanced ESD protection, tighter channel matching (1Ω ΔRon), and guaranteed performance across -40°C to +125°C. Substituting non-automotive parts risks field failures due to thermal cycling, humidity, and EMI susceptibility, potentially violating functional safety requirements in ADAS or body control modules.
What layout considerations are critical when routing high-frequency signals through the TS3A5017QRGYRQ1 to maintain signal integrity?
To preserve signal integrity, minimize trace length between the TS3A5017QRGYRQ1 and connected components, and maintain controlled impedance (typically 50Ω single-ended or 100Ω differential). Avoid vias under the exposed thermal pad unless properly grounded, and ensure the ground plane beneath the 16-VQFN package is solid and stitched with multiple vias to reduce inductance. Keep input/output traces symmetrical to minimize skew, and place decoupling capacitors (100nF ceramic) within 2mm of the V+ pin. Failure to follow these practices can exacerbate crosstalk (-69dB @ 1MHz) and increase charge injection effects (5pC), especially in dense PCB layouts common in automotive ECUs.
Can the TS3A5017QRGYRQ1 handle bidirectional analog signals such as audio or sensor outputs without introducing distortion?
Yes, the TS3A5017QRGYRQ1 supports bidirectional signal flow, making it suitable for analog audio or low-frequency sensor signals (e.g., thermistor or strain gauge outputs). However, its 11Ω typical on-resistance can create voltage drops when driving low-impedance loads (<1kΩ), potentially causing nonlinear distortion. For high-fidelity audio (>10kHz), the 19pF off-state capacitance may introduce high-frequency roll-off. Always buffer the output with a unity-gain op-amp if driving heavy loads. In precision sensing applications, account for the 1Ω channel-to-channel Ron mismatch to avoid gain errors in differential paths.
How does the leakage current of the TS3A5017QRGYRQ1 impact battery-powered automotive systems during sleep mode?
With a typical off-state leakage current of 50nA per channel, the TS3A5017QRGYRQ1 contributes minimally to quiescent current in battery-powered automotive systems (e.g., telematics or door modules). Across both circuits, total leakage remains below 100nA—negligible compared to typical MCU or CAN transceiver sleep currents (µA range). However, in ultra-low-power designs with multi-year backup requirements, cumulative leakage from multiple switches can matter. Ensure unused channels are properly terminated (e.g., pulled to ground via resistors) to prevent floating nodes that could increase effective leakage. The TS3A5017QRGYRQ1’s low leakage makes it a strong choice for always-on subsystems where power budget is tightly constrained.
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