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TL16C752CRHBR
Texas Instruments
IC DUAL UART W/64B FIFO 32-QFN
1997 Pcs New Original In Stock
UART IC 2, DUART Channel RS485 64 Byte 32-VQFN (5x5)
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5.0 / 5.0
- (429 Ratings)
TL16C752CRHBR
Product Overview
1743135
DiGi Electronics Part Number
TL16C752CRHBR-DGManufacturer
Texas Instruments
TL16C752CRHBR
Description
IC DUAL UART W/64B FIFO 32-QFNInventory
1997 Pcs New Original In Stock
UART IC 2, DUART Channel RS485 64 Byte 32-VQFN (5x5)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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TL16C752CRHBR Technical Specifications
Category
Interface, UARTs (Universal Asynchronous Receiver Transmitter)
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Features
-
Number of Channels
2, DUART
FIFO's
64 Byte
Protocol
RS485
Data Rate (Max)
3Mbps
Voltage - Supply
1.62V ~ 5.5V
With Auto Flow Control
Yes
With IrDA Encoder/Decoder
Yes
With False Start Bit Detection
Yes
With Modem Control
Yes
Mounting Type
Surface Mount
Package / Case
32-VFQFN Exposed Pad
Supplier Device Package
32-VQFN (5x5)
Base Product Number
TL16C752
Datasheet & Documents
HTML Datasheet
TL16C752CRHBR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-23536-6-NDR
296-23536-6
-296-23536-1-NDR
-TL16C752CRHBRG4
296-23536-2-NDR
TEXTISTL16C752CRHBR
296-23536-2
-296-23536-1
-TL16C752CRHBRG4-NDR
296-23536-1
TL16C752CRHBRG4
2156-TL16C752CRHBR
-296-23536-1-DG
296-23536-1-NDR
TL16C752CRHBRG4-DG
-TL16C752CRHBR-NDR
Standard Package
3,000
Alternative Parts
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MANUFACTURER
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Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 17, 2025
The product is very good
Dec 04, 2025
The quality here is pretty good.
Dec 02, 2025
Their after-sales team is approachable and always helpful.
Dec 02, 2025
Their support infrastructure is robust, providing confidence in their services.
Dec 02, 2025
DiGi Electronics consistently ensures timely delivery of all their products, which is crucial for my project timelines. I truly appreciate their reliability.
Dec 02, 2025
Their cost-effective pricing and excellent packaging quality make every purchase worthwhile.
Dec 02, 2025
Their shipping is consistently quick, and support team members are fantastic.
Dec 02, 2025
The packaging was compact yet spacious enough to prevent any damage during transit.
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Frequently Asked Questions (FAQ)
Can the TL16C752CRHBR be safely used as a drop-in replacement for the Exar XR16M752 in a 3.3V industrial RS485 system with auto flow control enabled?
While the TL16C752CRHBR and XR16M752 are both dual UARTs with 64-byte FIFOs and support auto flow control, they are not true pin-for-pin or register-compatible drop-in replacements. The TL16C752CRHBR uses TI’s proprietary register map and interrupt handling, which differs from Exar’s implementation. Additionally, the TL16C752CRHBR supports a wider voltage range (1.62V–5.5V) and includes IrDA encoding, but its interrupt request (IRQ) timing and FIFO trigger levels behave differently under load. Before substitution, verify firmware compatibility—especially ISR routines and FIFO threshold configurations—and revalidate signal integrity on your PCB due to differing pinouts and ESD structures. TI provides a migration guide (SLAU572) that outlines key differences; use it to assess firmware rework risk.
What are the thermal and layout risks when using the TL16C752CRHBR in a high-density industrial enclosure with limited airflow, given its 32-VQFN exposed pad package?
The TL16C752CRHBR’s 32-VQFN (5x5 mm) package with an exposed thermal pad requires careful PCB thermal design to avoid overheating, especially at 3 Mbps data rates where internal power dissipation increases. Without proper thermal vias under the pad and adequate copper pour on the bottom layer, junction temperatures can exceed safe limits in enclosed environments, leading to intermittent failures or reduced MTBF. TI recommends at least nine 0.3 mm thermal vias connected to a 2 oz copper ground plane. Also, ensure the ground plane is continuous beneath the device to maintain signal integrity and thermal performance. Neglecting this can cause thermal runaway during sustained bidirectional RS485 traffic, particularly when both channels operate simultaneously at maximum baud rate.
How does the TL16C752CRHBR handle false start bit detection in noisy RS485 environments compared to the Maxim MAX3107, and what design trade-offs should I consider?
The TL16C752CRHBR includes built-in false start bit detection, which helps reject spurious transitions caused by EMI in industrial RS485 networks—this is particularly useful in motor-heavy environments. However, unlike the MAX3107 (which uses adaptive noise filtering and configurable glitch rejection), the TL16C752CRHBR’s algorithm is fixed and may not filter out very short-duration noise pulses (<100 ns) without additional external RC filtering. If your application operates in high-noise zones (e.g., near VFDs or relays), consider adding a small RC low-pass filter (e.g., 100Ω + 100pF) on the RX line. The trade-off is slightly increased rise time, so ensure it doesn’t violate RS485 timing margins at 3 Mbps. The TL16C752CRHBR offers better integration (dual channel, IrDA, modem control), but the MAX3107 provides superior noise immunity for single-channel, high-reliability use cases.
Is it safe to operate the TL16C752CRHBR at 5.5V supply voltage while interfacing with 3.3V microcontroller GPIOs without level shifting?
No, direct connection between the TL16C752CRHBR’s 5.5V-tolerant inputs and 3.3V microcontroller outputs is not recommended without level translation. Although the TL16C752CRHBR’s inputs are 5.5V-tolerant, its output high voltage (VOH) can reach up to VCC – 0.4V, meaning a 5.5V-driven TX line could output ~5.1V, exceeding the absolute maximum ratings of most 3.3V MCUs (typically 3.6V–4.0V). This creates a long-term reliability risk due to oxide stress or latch-up. To safely interface, use a bidirectional level shifter (e.g., TXB0104) or configure the TL16C752CRHBR to run at 3.3V if system power allows. Running the UART at 3.3V also reduces power consumption and thermal load, making it a preferred option when MCU compatibility is critical.
What reliability concerns should I evaluate before designing in the TL16C752CRHBR for a 10-year lifecycle medical device operating in humid environments?
For a 10-year medical application, the TL16C752CRHBR’s MSL 3 (168-hour floor life) rating requires strict moisture control during assembly—exposure beyond 168 hours at <30°C/60% RH necessitates baking before reflow to prevent popcorning. Additionally, the 32-VQFN package’s exposed pad must be soldered with voiding <25% to ensure long-term thermal and mechanical reliability; use X-ray inspection during production. While the device is RoHS3 and REACH compliant, verify that your contract manufacturer uses no-clean, halide-free flux to prevent electrochemical migration in high-humidity conditions. Also, consider conformal coating to protect against condensation. TI’s reliability reports (available via customer support) show >100k hours MTBF at 55°C, but real-world field data in medical settings is limited—conduct HALT testing early to validate performance under temperature cycling and humidity bias.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
TL16C752CRHBR CAD Models
Texas Instruments TL16C752CRHBR PCB symbols & footprints
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