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MSP430F1101AIPWR
Texas Instruments
IC MCU 16BIT 1KB FLASH 20TSSOP
25281 Pcs New Original In Stock
MSP430 CPU16 MSP430x1xx Microcontroller IC 16-Bit 8MHz 1KB (1K x 8 + 256B) FLASH 20-TSSOP
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5.0 / 5.0
- (356 Ratings)
MSP430F1101AIPWR
Product Overview
1341453
DiGi Electronics Part Number
MSP430F1101AIPWR-DGManufacturer
Texas Instruments
MSP430F1101AIPWR
Description
IC MCU 16BIT 1KB FLASH 20TSSOPInventory
25281 Pcs New Original In Stock
MSP430 CPU16 MSP430x1xx Microcontroller IC 16-Bit 8MHz 1KB (1K x 8 + 256B) FLASH 20-TSSOP
Quantity
Minimum 1
Minimum 1
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MSP430F1101AIPWR Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Cut Tape (CT) & Digi-Reel®
Series
MSP430x1xx
Product Status
Active
DiGi-Electronics Programmable
Verified
Core Processor
MSP430 CPU16
Core Size
16-Bit
Speed
8MHz
Connectivity
-
Peripherals
POR, WDT
Number of I/O
14
Program Memory Size
1KB (1K x 8 + 256B)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
128 x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Data Converters
Slope A/D
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
20-TSSOP
Package / Case
20-TSSOP (0.173", 4.40mm Width)
Base Product Number
MSP430F1101
Datasheet & Documents
Manufacturer Product Page
MSP430F1101AIPWR Specifications
HTML Datasheet
MSP430F1101AIPWR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
296-26172-6
TEXTISMSP430F1101AIPWR
296-26172-1
2156-MSP430F1101AIPWR
296-26172-2
MSP430F1101AIPWR-DG
Standard Package
2,000
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
이용하는 동안 항상 가격과 물류에 감탄하고 있어요.
Dec 02, 2025
Je suis ravi de la transparence sur leurs prix et la constance de leur fiabilité.
Dec 02, 2025
Chaque commande que j’ai passée a été traitée rapidement et livrée en un temps record.
Dec 02, 2025
DiGi Electronics offre des produits excellents et un service client irréprochable.
Dec 02, 2025
The consistency in product quality at Di Digi Electronics is admirable.
Dec 02, 2025
DiGi Electronics offers superb quality that lasts and dependable delivery speed.
Dec 02, 2025
They make sure I receive my orders swiftly, which is critical for my business.
Dec 02, 2025
The packaging was designed with environmental impact in mind, and the delivery was impressively rapid.
Dec 02, 2025
I am impressed by their commitment to environmentally sustainable packaging.
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Frequently Asked Questions (FAQ)
When migrating from an older MSP430F1101 design to the MSP430F1101AIPWR, what are the key considerations regarding the 1KB FLASH memory capacity and potential firmware compatibility issues, especially if the original design used external memory?
When migrating to the MSP430F1101AIPWR, while the 1KB FLASH is the same, ensure your existing firmware is optimized for the internal 1KB (1K x 8 + 256B) configuration. The MSP430F1101AIPWR has a unified FLASH structure where the 256B can be seen as additional RAM or FLASH depending on the configuration. If your original MSP430F1101 design relied on external memory for code or data, you'll need to re-evaluate and potentially refactor your firmware to fit within the MSP430F1101AIPWR's internal memory architecture to avoid costly hardware redesigns.
What are the practical limitations of the MSP430F1101AIPWR's 8MHz internal oscillator and 1KB FLASH for real-time control applications requiring precise timing and complex algorithms, and what are alternative TI MCU options for higher performance?
The MSP430F1101AIPWR's 8MHz internal oscillator and 1KB FLASH are suitable for basic control tasks, but for applications demanding high precision timing or computationally intensive algorithms, you might encounter performance bottlenecks. The 8MHz clock may limit the speed of your control loops, and the 1KB FLASH can quickly become restrictive for feature-rich firmware. For higher performance needs, consider TI's MSP430G2xx or MSP430F5xx series, which offer faster clock speeds, more memory, and advanced peripherals for demanding real-time applications.
If I need to replace an existing MSP430F1101 in a legacy system with the MSP430F1101AIPWR, what are the critical pin-to-pin compatibility risks, especially concerning power supply variations (1.8V-3.6V) and analog signal integrity with the Slope A/D converter?
When replacing an MSP430F1101 with the MSP430F1101AIPWR, while both are 20-TSSOP, pay close attention to the voltage supply range. The MSP430F1101AIPWR supports 1.8V to 3.6V, which is generally backward compatible but ensure your system's power regulation consistently stays within this range for stable operation. Critically, the Slope A/D converter's analog input characteristics and any external signal conditioning circuitry need to be carefully verified against the MSP430F1101AIPWR's analog input requirements to maintain signal integrity and prevent unexpected conversion results.
For battery-powered IoT devices designed around the MSP430F1101AIPWR, what are the key design trade-offs to consider when utilizing its POR and WDT peripherals for power management and reliability, especially concerning wake-up times and false trigger prevention?
When designing battery-powered IoT devices with the MSP430F1101AIPWR, the POR (Power-On Reset) and WDT (Watchdog Timer) are crucial for power management and reliability. To optimize battery life, carefully configure the POR to trigger at the lowest acceptable voltage threshold to allow for maximum battery discharge. For the WDT, the trade-off lies between responsiveness and preventing false resets due to software delays; implement a well-timed kick mechanism. Ensure your firmware handles WDT resets gracefully to avoid system crashes and consider the wake-up time impact of the reset circuitry on your device's responsiveness.
What are the potential integration challenges and reliability concerns when using the MSP430F1101AIPWR in a high-density surface mount assembly with its 20-TSSOP package, particularly regarding thermal management and solder joint integrity in varying ambient temperatures?
Integrating the MSP430F1101AIPWR in a high-density surface mount assembly using the 20-TSSOP package requires careful consideration of thermal management. While the device has an operating temperature of -40°C to 85°C, high component density can lead to localized heating. Ensure adequate PCB copper pour and airflow around the MSP430F1101AIPWR to prevent it from exceeding its rated junction temperature, which can impact long-term reliability. Furthermore, during soldering, verify that your reflow profile is optimized for the 20-TSSOP to ensure robust solder joint formation, especially given the MSL 1 rating, which implies proper handling to prevent moisture absorption prior to soldering.
Quality Assurance (QC)
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MSP430F1101AIPWR CAD Models
Texas Instruments MSP430F1101AIPWR PCB symbols & footprints
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