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CD74HC367M96
Texas Instruments
IC BUFFER NON-INVERT 6V 16SOIC
3298 Pcs New Original In Stock
Buffer, Non-Inverting 2 Element 2, 4 (Hex) Bit per Element 3-State Output 16-SOIC
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5.0 / 5.0
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CD74HC367M96
Product Overview
1234731
DiGi Electronics Part Number
CD74HC367M96-DGManufacturer
Texas Instruments
CD74HC367M96
Description
IC BUFFER NON-INVERT 6V 16SOICInventory
3298 Pcs New Original In Stock
Buffer, Non-Inverting 2 Element 2, 4 (Hex) Bit per Element 3-State Output 16-SOIC
CAD Models - PCB Symbols & Footprints
Quantity
Minimum 1
Minimum 1
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CD74HC367M96 Technical Specifications
Category
Logic, Buffers, Drivers, Receivers, Transceivers
Packaging
Tape & Reel (TR)
Series
74HC
Product Status
Active
Logic Type
Buffer, Non-Inverting
Number of Elements
2
Number of Bits per Element
2, 4 (Hex)
Input Type
-
Output Type
3-State
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2V ~ 6V
Operating Temperature
-55°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
16-SOIC (0.154", 3.90mm Width)
Supplier Device Package
16-SOIC
Base Product Number
74HC367
Datasheet & Documents
HTML Datasheet
CD74HC367M96-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
296-14523-1
-CD74HC367M96-NDR
296-14523-2
CD74HC367M96E4-DG
296-14523-2-DG
296-CD74HC367M96TR
CD74HC367M96G4-DG
296-14523-6
296-14523-1-DG
-296-14523-1-DG
296-14523-6-DG
296-14523-6-NDR
296-CD74HC367M96DKR
-CD74HC367M96E4-NDR
-CD74HC367M96G4
296-CD74HC367M96CT
-CD74HC367M96E4
-CD74HC367M96G4-NDR
CD74HC367M96E4
CD74HC367M96G4
-296-14523-1
Standard Package
2,500
Alternative Parts
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MANUFACTURER
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UNIT PRICE
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Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
믿음이 가는 가격과 만족스러운 후 서비스 덕분에 계속 이용하고 싶어요.
Dec 02, 2025
長い間愛用していますが、品質が変わらず価格も安定しています。
Dec 02, 2025
Choosing DiGi Electronics is easy thanks to their reasonable prices.
Dec 02, 2025
DiGi’s attentive after-sales service demonstrates their genuine commitment to customer success.
Dec 02, 2025
They prioritize customer satisfaction through supportive after-sales assistance.
Dec 02, 2025
Shipping is swift, and their support team is extremely helpful and friendly.
Dec 02, 2025
We have come to rely on their timely deliveries, which are always prompt and secure.
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Frequently Asked Questions (FAQ)
Can the CD74HC367M96 be safely used as a direct replacement for the MC74HC367ADR2G in a 3.3V I²C level-shifting application, and what are the risks if the enable timing isn't synchronized with bus activity?
While the CD74HC367M96 and MC74HC367ADR2G are functionally equivalent and share the same 74HC367 base part number, the CD74HC367M96 from Texas Instruments has stricter propagation delay matching (±3 ns typical) compared to some on-market variants, making it more reliable in time-sensitive I²C level translation. However, using it without synchronizing the output enable (OE) signal with I²C start/stop conditions can cause bus contention or glitches—especially during hot-plug events. To mitigate this, tie OE to a microcontroller GPIO controlled by firmware that only enables the buffer during active transactions, or use a dedicated I²C buffer with built-in direction control like the PCA9306. Always verify timing margins with an oscilloscope on SDA/SCL lines under load.
What are the thermal and layout considerations when using the CD74HC367M96 in a high-density PCB with adjacent power regulators, given its 16-SOIC package and 125°C max junction temperature?
The CD74HC367M96’s 16-SOIC package has limited thermal dissipation due to its modest copper slug and surface-mount construction. In high-density layouts near switching regulators or power-hungry ICs, ambient temperature can easily exceed 85°C, reducing reliability margins. TI specifies a thermal resistance (θJA) of ~100°C/W for this package—meaning even 100mW of dissipation can raise the junction by 10°C. To prevent thermal runaway or premature aging, maintain at least 2mm clearance from heat sources, use thermal relief pads on ground pins, and avoid placing vias directly under the package unless connected to a solid ground plane. If operating above 105°C ambient, consider derating supply voltage to 4.5V max to reduce internal power dissipation.
Is the CD74HC367M96 suitable for driving long backplane traces (over 30 cm) in industrial control systems, and how should output enable control be managed to avoid signal reflections?
The CD74HC367M96 can drive long backplane traces, but its 3-state outputs have moderate slew rates typical of 74HC logic, which can cause ringing on unterminated lines over 30 cm. Without proper termination, signal integrity issues like overshoot or false triggering may occur, especially at 6V operation. Use series termination resistors (22–47Ω) near the output pins to match trace impedance (~50–75Ω typical). Additionally, ensure OE is deasserted during power-up sequencing to prevent bus conflicts. For critical industrial systems, consider adding Schmitt-trigger inputs (e.g., SN74LVC367A) or using a dedicated backplane driver with controlled slew rate. The CD74HC367M96 lacks built-in ESD protection beyond standard HBM, so external TVS diodes on I/O lines are recommended in electrically noisy environments.
How does the CD74HC367M96 compare to the 74HC367D,653 from NXP in terms of long-term availability, moisture sensitivity, and suitability for automotive-grade designs?
The CD74HC367M96 (TI) and 74HC367D,653 (NXP) are pin- and function-compatible, but key differences affect design longevity and compliance. The CD74HC367M96 is MSL 1 (unlimited floor life), simplifying handling in high-volume production, while NXP’s version is typically MSL 2a—requiring dry packing and bake procedures if exposed >24 hours. TI provides full PPAP documentation and AEC-Q100 qualification options for automotive variants, whereas the standard 74HC367D,653 is not automotive-qualified. For automotive or medical applications requiring traceability and long-term supply assurance, the CD74HC367M96 is preferable. However, if your design already uses NXP logic families and doesn’t require MSL 1, the 74HC367D,653 may offer better ecosystem integration. Always verify lifecycle status via manufacturer portals before finalizing BOMs.
What happens if the CD74HC367M96 is operated at 6V supply with all six buffers simultaneously switching high-current loads, and how can shoot-through current be minimized during output enable transitions?
Operating the CD74HC367M96 at 6V with all six buffers driving capacitive or resistive loads near its 7.8mA output limit increases total package power dissipation significantly—potentially exceeding safe operating area if ambient temperature is high. More critically, during OE transitions (enable/disable), brief shoot-through currents can flow through the output stage due to internal gate delay mismatches, causing voltage droops or EMI spikes. To minimize this, add a small dead-time (100–500 ns) in firmware between disabling one buffer and enabling another in daisy-chained systems. Alternatively, use external pull-up/pull-down resistors on outputs to define a known state during high-Z periods. For high-reliability systems, monitor VCC ripple with a scope during enable edges; if overshoot exceeds 10% of VCC, consider adding a 0.1μF ceramic capacitor within 5mm of the supply pin and reducing simultaneous switching activity.
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CD74HC367M96 CAD Models
Texas Instruments CD74HC367M96 PCB symbols & footprints
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