Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
BQ24740RHDR
Texas Instruments
IC BAT CHG MULTCHEM 2-4CL 28VQFN
24319 Pcs New Original In Stock
Charger IC Multi-Chemistry 28-VQFN (5x5)
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (90 Ratings)
BQ24740RHDR
Product Overview
13036590
DiGi Electronics Part Number
BQ24740RHDR-DGManufacturer
Texas Instruments
BQ24740RHDR
Description
IC BAT CHG MULTCHEM 2-4CL 28VQFNInventory
24319 Pcs New Original In Stock
Charger IC Multi-Chemistry 28-VQFN (5x5)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
BQ24740RHDR Technical Specifications
Category
Power Management (PMIC), Battery Chargers
Packaging
Cut Tape (CT)
Manufacturer
Texas Instruments
Series
-
Packaging
Tape & Reel (TR)
Part Status
Obsolete
Battery Chemistry
Multi-Chemistry
Number of Cells
2 ~ 4
Current - Charging
Constant - Programmable
Programmable Features
-
Fault Protection
Over Voltage
Charge Current - Max
10A
Battery Pack Voltage
18V (Max)
Voltage - Supply (Max)
24V
Interface
-
Operating Temperature
-40°C ~ 125°C (TJ)
Mounting Type
Surface Mount
Package / Case
28-VFQFN Exposed Pad
Supplier Device Package
28-VQFN (5x5)
Base Product Number
BQ24740
Datasheet & Documents
HTML Datasheet
BQ24740RHDR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
2 (1 Year)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0060
Additional Information
Other Names
296-21374-1
-296-21374-1-ND
-BQ24740RHDRG4
2156-BQ24740RHDR
-296-21374-1
296-21374-6
-BQ24740RHDR-NDR
296-21374-2
-BQ24740RHDRG4-NDR
TEXTISBQ24740RHDR
Standard Package
3,000
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
The market offers many options, but DiGi Electronics stands out for value and quality.
Dec 02, 2025
I am highly satisfied with their after-sales service that caters to remote professionals.
Dec 02, 2025
Durable, reliable, and delivered swiftly—highly satisfied.
Dec 02, 2025
All logistics communication was clear and concise, making it easy to understand the delivery timeline.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
Can the BQ24740RHDR be used as a drop-in replacement for the BQ24725A in a 4-cell Li-ion battery charger design, and what are the key design-in risks?
The BQ24740RHDR is not a direct drop-in replacement for the BQ24725A despite similar multi-chemistry support and 4-cell capability. Key differences include the absence of I2C/SMBus interface in the BQ24740RHDR, requiring redesign of system communication and control logic. Additionally, the BQ24740RHDR lacks dynamic power management (DPM), increasing risk of input overloading if not externally managed. Ensure revised thermal layout due to 28-VQFN (5x5) exposed pad requirements, and verify OTG (On-The-Go) functionality is not needed, as it’s unsupported. Always validate gate drive timing for external FETs as differences in driver strength may affect charge efficiency.
What are the critical thermal design considerations when operating the BQ24740RHDR at its maximum 10A charge current in a compact 5x5mm QFN package?
Operating the BQ24740RHDR at 10A requires aggressive thermal management due to high power dissipation in the 5x5mm VQFN package. Use a minimum 4-layer PCB with ample vias under the exposed thermal pad to transfer heat to internal ground planes. Ensure at least 2 in² of copper area connected to GND for effective conduction cooling. Simulate thermal performance under worst-case ambient (125°C junction limit) and consider forced airflow if enclosure limits convection. Derate charge current by 20–30% in enclosed or high-ambient environments to avoid thermal shutdown or long-term reliability degradation.
How does the BQ24740RHDR handle over-voltage protection in a 19V input system powering a 4S Li-ion stack, and what fault response timing should be expected?
The BQ24740RHDR includes integrated over-voltage protection (OVP) on the input supply, triggering at approximately 26V (above the 24V max rating), safeguarding the IC and battery in 19V systems during transients. However, it does not offer cell-level over-voltage protection; that responsibility lies with the external FET control and voltage sensing network. The OVP response time is typically under 2µs, but system-level protection must still include fast transient suppressors (like TVS diodes) on the input rail. Be cautious: prolonged exposure to over-voltage near 24V may degrade reliability despite protection circuitry.
What are the implications of BQ24740RHDR being marked as obsolete for new designs, and are there viable long-term alternatives with pin-compatible options?
The BQ24740RHDR’s obsolete status means no future production, posing supply chain and lifecycle risks for new designs requiring long-term availability. For drop-in replacements, consider the BQ25713 or BQ25756, which offer similar 2-4 cell support and 10A capability but require interface changes due to I2C integration. Neither is pin-compatible, so PCB redesign is necessary. Evaluate BQ24703 for simplified designs with lower current needs. For minimal change, last-time buys with extended storage (below MSL 2 limits) can support short-term production, but a redesign with active TI parts is strongly recommended for scalability and technical support.
When configuring the BQ24740RHDR in a high-temperature industrial environment (up to 105°C ambient), what derating and reliability trade-offs should be considered?
In ambient temperatures up to 105°C, the BQ24740RHDR must be derated to maintain junction temperature below 125°C. Limit continuous charge current to ≤7A depending on PCB thermal design, and reduce switching frequency if using a custom inductor to lower switching losses. Use high-temperature-rated external components (especially FETs and sense resistors) to match reliability expectations. Monitor long-term parametric drift—thresholds like OVP or charge termination may shift near thermal limits. Add thermal hysteresis in control firmware to prevent oscillation during thermal throttling, ensuring stable operation over the product lifecycle.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
BQ24740RHDR CAD Models
Texas Instruments BQ24740RHDR PCB symbols & footprints
productDetail
