AM26LV31CDR >
AM26LV31CDR
Texas Instruments
IC DRIVER 4/0 16SOIC
37802 Pcs New Original In Stock
4/0 Driver RS422, RS485 16-SOIC
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AM26LV31CDR Texas Instruments
5.0 / 5.0 - (42 Ratings)

AM26LV31CDR

Product Overview

1237800

DiGi Electronics Part Number

AM26LV31CDR-DG

Manufacturer

Texas Instruments
AM26LV31CDR

Description

IC DRIVER 4/0 16SOIC

Inventory

37802 Pcs New Original In Stock
4/0 Driver RS422, RS485 16-SOIC
CAD Models - PCB Symbols & Footprints
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 0.7575 0.7575
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AM26LV31CDR Technical Specifications

Category Interface, Drivers, Receivers, Transceivers

Manufacturer Texas Instruments

Packaging Cut Tape (CT) & Digi-Reel®

Series -

Product Status Last Time Buy

Type Driver

Protocol RS422, RS485

Number of Drivers/Receivers 4/0

Duplex -

Data Rate -

Voltage - Supply 3V ~ 3.6V

Operating Temperature 0°C ~ 70°C

Mounting Type Surface Mount

Package / Case 16-SOIC (0.154", 3.90mm Width)

Supplier Device Package 16-SOIC

Base Product Number AM26LV31

Datasheet & Documents

HTML Datasheet

AM26LV31CDR-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
AM26LV31CDR-DG
296-25912-1
296-25912-2
927-AM26LV31CDRTR
927-AM26LV31CDRCT
2156-AM26LV31CDR
TEXTISAM26LV31CDR
927-AM26LV31CDRDKR
927-AM26LV31CDRDKR-DG
927-AM26LV31CDRTR-DG
296-25912-6
927-AM26LV31CDRCT-DG
Standard Package
2,500

Alternative Parts

View Details
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
MAX3031EESE+T
Analog Devices Inc./Maxim Integrated
2125
MAX3031EESE+T-DG
0.9941
MFR Recommended
AM26LV31IDR
Texas Instruments
15454
AM26LV31IDR-DG
0.0058
MFR Recommended
MAX3030ECSE+T
Analog Devices Inc./Maxim Integrated
7922
MAX3030ECSE+T-DG
0.9807
MFR Recommended
DS26C31TMX/NOPB
Texas Instruments
20390
DS26C31TMX/NOPB-DG
0.0074
MFR Recommended
MAX3030EESE+T
Analog Devices Inc./Maxim Integrated
4595
MAX3030EESE+T-DG
3.0720
MFR Recommended

Reviews

5.0/5.0-(Show up to 5 Ratings)
별***기
Dec 02, 2025
5.0
가격도 좋고 배송도 빨라서 매번 믿고 구매합니다.
바***억
Dec 02, 2025
5.0
이 회사와 거래하며 느낀 최고의 점은 바로 고객 배려와 포장 품질입니다.
Grav***Free
Dec 02, 2025
5.0
Always punctual and careful with packaging—DiGi Electronics is exemplary.
Liv***Glow
Dec 02, 2025
5.0
Their customer care is prompt, knowledgeable, and genuinely helpful.
Oce***liss
Dec 02, 2025
5.0
Fast delivery times combined with safe packaging made my purchase enjoyable.
Blis***lAura
Dec 02, 2025
5.0
The quality of service at DiGi Electronics is unmatched—I am very satisfied.
Hap***aven
Dec 02, 2025
5.0
I appreciated the quick shipment, which made my project start seamlessly.
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Frequently Asked Questions (FAQ)

Can the AM26LV31CDR reliably interface with legacy 5V RS485 systems, and what level-shifting considerations should I account for in a mixed-voltage design?

The AM26LV31CDR operates on a 3V to 3.6V supply and is not 5V I/O tolerant, so direct connection to 5V RS485 buses risks device damage. When interfacing with legacy 5V systems, use bidirectional level translators like the TXS0108E or isolation buffers such as the ISO3072 to ensure signal compatibility and protect the AM26LV31CDR. Additionally, confirm that the external fail-safe biasing network on the differential lines doesn't pull beyond the driver's output common-mode range. This approach maintains signal integrity while mitigating long-term reliability risks due to overvoltage stress.

Is the AM26LV31CDR a viable drop-in replacement for the MAX3031EESE+T in a high-noise industrial environment, and what design adjustments are needed?

While the AM26LV31CDR and MAX3031EESE+T both support RS422/RS485 protocols, the AM26LV31CDR lacks integrated ESD and surge protection, unlike the MAX3031EESE+T which includes ±15kV ESD protection. Replacing the MAX3031EESE+T with the AM26LV31CDR requires adding external TVS diodes (e.g., SP3301-4LC) on A/B lines and robust PCB layout practices—such as minimizing stub lengths and using ground planes—to maintain signal integrity and noise immunity in industrial settings. Always verify bus loading, as the MAX3031 supports higher node counts due to lower input leakage.

What are the key thermal and PCB layout concerns when using the AM26LV31CDR in a densely populated 485 network with continuous high-speed transmission?

The AM26LV31CDR dissipates heat through its SOIC package, which has limited thermal conductivity. In dense layouts with continuous data transmission, ensure adequate copper planes connected to GND pins for heat spreading and avoid placing heat-sensitive components nearby. Use at least two thermal vias under the exposed pad (if available) and maintain spacing of 0.5mm between traces to prevent crosstalk. Consider duty cycling or reducing slew rates via external filtering if average current exceeds 30mA to prevent junction temperature rise beyond recommended limits.

How does the end-of-life (Last Time Buy) status of the AM26LV31CDR impact long-term reliability and supply chain planning for new designs?

With the AM26LV31CDR marked as Last Time Buy, new designs risk future obsolescence and potential redesign costs. For long-term reliability and supply continuity, consider pin-compatible alternatives like the SN65LVDS31 (with extended supply range) or redesign with modular interface boards to ease future swaps. Secure at least 2–3 years of inventory or engage with distributors for allocation programs. Also verify the AM26LV31IDR (industrial temp version) isn’t a better fit, though it’s also nearing obsolescence—evaluate long-term availability of second sources early in the design cycle.

What signal integrity trade-offs should I expect when replacing the AM26LV31CDR with the MAX3030ECSE+T in an existing high-speed RS422 link?

Swapping the AM26LV31CDR with the MAX3030ECSE+T introduces differences in slew rate control and output drive strength. The MAX3030ECSE+T has controlled rise/fall times optimized for reduced EMI, whereas the AM26LV31CDR may require external RC filtering to prevent signal reflections at high speeds (above 10 Mbps). Adjust termination resistors to match cable impedance (typically 120 Ω) and ensure the MAX3030ECSE+T’s lower max data rate (if applicable) doesn’t bottleneck performance. Validate with eye diagram testing on the prototype to mitigate timing margin risks in high-speed RS422 links using the AM26LV31CDR footprint.

Quality Assurance (QC)

DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.

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AM26LV31CDR CAD Models
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