MLG0603P3N6CT000 >
MLG0603P3N6CT000
TDK Corporation
FIXED IND 3.6NH 400MA 200MOHM SM
480229 Pcs New Original In Stock
3.6 nH Unshielded Multilayer Inductor 400 mA 200mOhm Max 0201 (0603 Metric)
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MLG0603P3N6CT000 TDK Corporation
5.0 / 5.0 - (303 Ratings)

MLG0603P3N6CT000

Product Overview

6646955

DiGi Electronics Part Number

MLG0603P3N6CT000-DG

Manufacturer

TDK Corporation
MLG0603P3N6CT000

Description

FIXED IND 3.6NH 400MA 200MOHM SM

Inventory

480229 Pcs New Original In Stock
3.6 nH Unshielded Multilayer Inductor 400 mA 200mOhm Max 0201 (0603 Metric)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 100 0.0041 0.4100
  • 1000 0.0033 3.3000
  • 3000 0.0028 8.4000
  • 15000 0.0025 37.5000
  • 45000 0.0023 103.5000
  • 105000 0.0022 231.0000
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MLG0603P3N6CT000 Technical Specifications

Category Fixed Inductors

Manufacturer TDK

Packaging Tape & Reel (TR)

Series MLG-P

Product Status Active

Type Multilayer

Material - Core Non-Magnetic

Inductance 3.6 nH

Tolerance ±0.2nH

Current Rating (Amps) 400 mA

Current - Saturation (Isat) -

Shielding Unshielded

DC Resistance (DCR) 200mOhm Max

Q @ Freq 14 @ 500MHz

Frequency - Self Resonant 6.5GHz

Ratings -

Operating Temperature -55°C ~ 125°C

Inductance Frequency - Test 500 MHz

Mounting Type Surface Mount

Package / Case 0201 (0603 Metric)

Supplier Device Package 0201 (0603 Metric)

Size / Dimension 0.024" L x 0.012" W (0.60mm x 0.30mm)

Height - Seated (Max) 0.013" (0.33mm)

Datasheet & Documents

HTML Datasheet

MLG0603P3N6CT000-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8504.50.8000

Additional Information

Other Names
445-172437-6
445-172437-2
445-172437-1
MLG0603P3N6CT000-DG
Standard Package
15,000

Reviews

5.0/5.0-(Show up to 5 Ratings)
夢***者
Dec 02, 2025
5.0
DiGi Electronics的包裝做工細膩,安全穩妥,真的讓我非常信賴這個品牌。
Cla***Lune
Dec 02, 2025
5.0
Ils se démarquent par leur organisation logistique et leur excellent support client.
Étoile***llante
Dec 02, 2025
5.0
Un service qui tient ses promesses, je suis très satisfait.
Joyf***eart
Dec 02, 2025
5.0
Their attentive service makes every purchase experience pleasant and hassle-free.
Sun***ibes
Dec 02, 2025
5.0
DiGi Electronics consistently delivers value-packed products at unbeatable prices.
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Frequently Asked Questions (FAQ)

Can the MLG0603P3N6CT000 be safely used in a high-density RF front-end design where adjacent components are spaced less than 0.5mm apart, given its unshielded construction and 0201 footprint?

The MLG0603P3N6CT000 is unshielded and may couple magnetic fields to nearby inductors or sensitive traces, especially at its test frequency of 500 MHz and self-resonant frequency of 6.5 GHz. In high-density layouts with sub-0.5mm spacing, crosstalk or unintended mutual inductance can degrade RF performance. To mitigate risk, maintain at least 1mm spacing from other magnetic components, orient it perpendicular to adjacent inductors if possible, and validate performance with network analyzer measurements during prototype testing. Consider shielded alternatives like TDK’s MLK series if isolation is critical.

What are the key reliability risks when replacing a shielded 3.6nH inductor (e.g., Murata LQP03TN3N6B02D) with the unshielded MLG0603P3N6CT000 in a 5G mmWave receiver chain operating near 6 GHz?

Replacing a shielded inductor like the Murata LQP03TN3N6B02D with the unshielded MLG0603P3N6CT000 introduces EMI susceptibility and emission risks due to lack of magnetic shielding. At 6 GHz—close to the MLG0603P3N6CT000’s 6.5 GHz self-resonant frequency—parasitic coupling can cause frequency drift, reduced Q-factor, or spurious oscillations. Additionally, the lower Q (14 @ 500 MHz) compared to high-Q RF inductors may increase insertion loss. Only consider this substitution if board-level shielding, grounding planes, and layout isolation are rigorously implemented, and always verify phase noise and sensitivity in system-level testing.

How does the DC resistance of the MLG0603P3N6CT000 (200mΩ max) impact power efficiency in a 400mA peak-current buck converter for a battery-powered IoT device, and is it suitable for continuous operation at this current?

At 400mA, the MLG0603P3N6CT000 dissipates up to P = I²R = (0.4)² × 0.2 = 32mW, which may seem low but can cause localized heating in compact IoT modules, especially if airflow is limited. More critically, multilayer ceramic inductors like the MLG0603P3N6CT000 are not optimized for power conversion—they lack a defined saturation current (Isat not specified), meaning inductance could drop significantly under load, leading to subharmonic oscillation or reduced efficiency. For buck converters, prefer power inductors with explicit Isat ratings (e.g., TDK VLS2010 series). Use the MLG0603P3N6CT000 only in low-duty-cycle or signal-path applications, not continuous power delivery.

Is the MLG0603P3N6CT000 a drop-in replacement for the Coilcraft 0201CS-3N6X series in a 500MHz impedance matching network, considering tolerance, Q-factor, and parasitic behavior?

While both the MLG0603P3N6CT000 and Coilcraft 0201CS-3N6X offer ±0.2nH tolerance and similar 0201 footprints, the MLG0603P3N6CT000 has a lower Q (14 @ 500MHz) compared to typical values >20 for the 0201CS series, which may increase insertion loss in narrowband matching networks. Additionally, the non-magnetic core and multilayer construction of the MLG0603P3N6CT000 result in different parasitic capacitance and ESR characteristics, potentially shifting the matching frequency. Always re-tune the matching network using a VNA after substitution and avoid direct drop-in use in sensitive RF stages without validation.

Given the MLG0603P3N6CT000’s MSL-1 rating and 125°C max operating temperature, can it be reliably used in automotive under-hood applications with sustained temperatures above 110°C and thermal cycling from -40°C to 125°C?

While the MLG0603P3N6CT000 is rated for -55°C to 125°C and has an MSL-1 (unlimited floor life) rating, prolonged operation near 125°C in automotive environments may accelerate aging of the ceramic dielectric and solder joints, especially under thermal cycling stress. The lack of AEC-Q200 qualification means it hasn’t been tested for automotive reliability standards like thermal shock, humidity bias, or mechanical vibration. For under-hood use, prefer AEC-Q200-compliant inductors such as TDK’s MLG-A series. If cost or size constraints force use of the MLG0603P3N6CT000, implement derating (e.g., operate ≤105°C), enhance PCB thermal relief, and conduct extended HALT testing to validate lifetime.

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