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MLG0402Q2N4BT000
TDK Corporation
FIXED IND 2.4NH 200MA 800MOHM SM
25043 Pcs New Original In Stock
2.4 nH Unshielded Multilayer Inductor 200 mA 800mOhm Max 01005 (0402 Metric)
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5.0 / 5.0
- (405 Ratings)
MLG0402Q2N4BT000
Product Overview
6673041
DiGi Electronics Part Number
MLG0402Q2N4BT000-DGManufacturer
TDK Corporation
MLG0402Q2N4BT000
Description
FIXED IND 2.4NH 200MA 800MOHM SMInventory
25043 Pcs New Original In Stock
2.4 nH Unshielded Multilayer Inductor 200 mA 800mOhm Max 01005 (0402 Metric)
Quantity
Minimum 1
Minimum 1
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MLG0402Q2N4BT000 Technical Specifications
Category
Fixed Inductors
Packaging
Tape & Reel (TR)
Series
MLG-Q
Product Status
Active
Type
Multilayer
Material - Core
Non-Magnetic
Inductance
2.4 nH
Tolerance
±0.1nH
Current Rating (Amps)
200 mA
Current - Saturation (Isat)
-
Shielding
Unshielded
DC Resistance (DCR)
800mOhm Max
Q @ Freq
2 @ 100MHz
Frequency - Self Resonant
7GHz
Ratings
-
Operating Temperature
-55°C ~ 125°C
Inductance Frequency - Test
100 MHz
Mounting Type
Surface Mount
Package / Case
01005 (0402 Metric)
Supplier Device Package
01005 (0402 Metric)
Size / Dimension
0.016" L x 0.008" W (0.40mm x 0.20mm)
Height - Seated (Max)
0.009" (0.22mm)
Datasheet & Documents
HTML Datasheet
MLG0402Q2N4BT000-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8504.50.8000
Additional Information
Standard Package
20,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Un service après-vente fiable, un prix raisonnable : tout ce que je recherche.
Dec 02, 2025
配送の精度が高く、無駄な待ち時間もありませんでした。
Dec 02, 2025
Fast shipping and durable, high-quality products—very happy.
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Frequently Asked Questions (FAQ)
What are the key risks when using the MLG0402Q2N4BT000 in high-density RF PCB layouts where crosstalk and parasitic coupling are concerns?
The MLG0402Q2N4BT000 is an unshielded multilayer inductor with a compact 01005 footprint, making it susceptible to magnetic field interference in tightly packed RF designs. Since it lacks shielding, adjacent high-frequency traces or components can induce unwanted coupling, degrading signal integrity. To mitigate this, maintain at least 2–3 times the component width (≥0.8 mm) spacing from sensitive analog/RF traces, orient it perpendicular to aggressor lines, and consider grounding nearby guard traces. For critical applications, evaluate shielded alternatives like the TDK MLF series (e.g., MLF1005B2N2JT000) despite higher DCR and cost.
Can the MLG0402Q2N4BT000 be safely substituted for the Murata LQP02HQ2N4BH00D in a 5G mmWave front-end matching network, and what performance trade-offs should I expect?
While both the MLG0402Q2N4BT000 and Murata LQP02HQ2N4BH00D offer 2.4 nH inductance in 01005 packages, the TDK part has a lower Q factor (2 @ 100 MHz vs. Murata’s ~8 @ 100 MHz) and higher DCR (800 mΩ max vs. 450 mΩ typical). This results in greater insertion loss and reduced efficiency in mmWave matching networks, especially above 3 GHz. Additionally, the MLG0402Q2N4BT000’s self-resonant frequency (7 GHz) is lower than Murata’s (~10 GHz), limiting usable bandwidth. Only consider substitution if board space is extremely constrained and system-level simulations confirm acceptable return/insertion loss degradation.
How does the non-magnetic core of the MLG0402Q2N4BT000 affect reliability in high-vibration or automotive environments compared to ferrite-based inductors?
The MLG0402Q2N4BT000 uses a non-magnetic ceramic-based multilayer structure, which eliminates magnetic core brittleness and provides superior mechanical stability under vibration and thermal cycling—critical for automotive or industrial applications. Unlike ferrite-core inductors (e.g., Würth WE-KLIS), it won’t suffer microcracking in the core due to mechanical stress. However, its ultra-miniature 01005 size increases susceptibility to solder joint fatigue. Ensure proper pad design (NSMD recommended), use SAC305 or higher-reliability solder, and perform thermal cycle testing per AEC-Q200 if targeting automotive qualification. MSL 1 rating supports unlimited floor life, reducing handling risks.
What layout and grounding practices are essential to prevent self-resonance issues when using the MLG0402Q2N4BT000 above 5 GHz in a broadband amplifier bias tee?
At frequencies approaching its 7 GHz self-resonant frequency (SRF), the MLG0402Q2N4BT000 behaves capacitively, disrupting intended inductive behavior in bias tees. To avoid instability: minimize trace stubs (keep <0.5 mm), use coplanar waveguide routing with grounded side shields, and place a small decoupling capacitor (e.g., 1 pF NP0) in parallel to dampen parasitic oscillations. Avoid placing the inductor over split ground planes. Simulate the S-parameters of the full layout including pad parasitics—TDK’s SPICE models can help—and validate with VNA measurements. If SRF margin is insufficient, consider a slightly higher-inductance part (e.g., 3.3 nH) with better high-frequency roll-off characteristics.
Is the MLG0402Q2N4BT000 suitable for power-sensitive IoT sensor nodes operating at 2.4 GHz, given its 200 mA current rating and 800 mΩ DCR?
The MLG0402Q2N4BT000’s 800 mΩ max DCR introduces significant conduction losses in power paths—even at modest currents. For example, at 100 mA (common in RF power amplifiers), power loss reaches ~8 mW, reducing battery life in energy-constrained IoT nodes. While its 200 mA rating exceeds typical signal-level currents, it’s not optimized for power delivery. Use this inductor only in low-current RF matching or filtering roles (e.g., LNA input matching). For DC-DC converter outputs or PA supply filtering, select low-DCR shielded inductors like the Coilcraft 0402HP series (e.g., 0402HP-R24J) despite larger size. Always verify total power budget and thermal rise in your specific duty cycle.
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MLG0402Q2N4BT000 CAD Models
TDK Corporation MLG0402Q2N4BT000 PCB symbols & footprints
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