MHQ1005P3N9BT000 >
MHQ1005P3N9BT000
TDK Corporation
FIXED IND 3.9NH 900MA 90MOHM SMD
325333 Pcs New Original In Stock
3.9 nH Unshielded Multilayer Inductor 900 mA 90mOhm Max 0402 (1005 Metric)
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MHQ1005P3N9BT000 TDK Corporation
5.0 / 5.0 - (98 Ratings)

MHQ1005P3N9BT000

Product Overview

6629304

DiGi Electronics Part Number

MHQ1005P3N9BT000-DG

Manufacturer

TDK Corporation
MHQ1005P3N9BT000

Description

FIXED IND 3.9NH 900MA 90MOHM SMD

Inventory

325333 Pcs New Original In Stock
3.9 nH Unshielded Multilayer Inductor 900 mA 90mOhm Max 0402 (1005 Metric)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 10000 0.0587 586.7480
  • 30000 0.0568 1703.5620
  • 50000 0.0531 2657.2000
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MHQ1005P3N9BT000 Technical Specifications

Category Fixed Inductors

Manufacturer TDK

Packaging Tape & Reel (TR)

Series MHQ-P

Product Status Active

Type Multilayer

Material - Core Ceramic, Non-Magnetic

Inductance 3.9 nH

Tolerance ±0.1nH

Current Rating (Amps) 900 mA

Current - Saturation (Isat) -

Shielding Unshielded

DC Resistance (DCR) 90mOhm Max

Q @ Freq 23 @ 250MHz

Frequency - Self Resonant 5GHz

Ratings -

Operating Temperature -55°C ~ 125°C

Inductance Frequency - Test 100 MHz

Mounting Type Surface Mount

Package / Case 0402 (1005 Metric)

Supplier Device Package 0402 (1005 Metric)

Size / Dimension 0.039" L x 0.024" W (1.00mm x 0.60mm)

Height - Seated (Max) 0.024" (0.60mm)

Datasheet & Documents

HTML Datasheet

MHQ1005P3N9BT000-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8504.50.8000

Additional Information

Other Names
MHQ1005P3N9BT000-DG
445-MHQ1005P3N9BT000TR
445-MHQ1005P3N9BT000DKR
445-MHQ1005P3N9BT000CT
Standard Package
10,000

Reviews

5.0/5.0-(Show up to 5 Ratings)
Gout***eLune
Dec 02, 2025
5.0
Les prix affichés sont toujours clairs et sans surprise, ce qui est rassurant.
Silen***agique
Dec 02, 2025
5.0
Les produits offrent une performance constante et une longévité impressionnante.
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Dec 02, 2025
5.0
I highly recommend DiGi Electronics for their value and easy online shopping.
Radi***Soul
Dec 02, 2025
5.0
Their innovative design combined with excellent quality keeps me coming back.
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Dec 02, 2025
5.0
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Dec 02, 2025
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Frequently Asked Questions (FAQ)

When designing in the MHQ1005P3N9BT000, how can I ensure stable inductance under high-frequency noise conditions in a 5G front-end module?

To maintain stable inductance in high-frequency circuits like 5G front-end modules, ensure operating frequencies stay well below the MHQ1005P3N9BT000's self-resonant frequency of 5GHz. Since this inductor has a relatively low inductance value of 3.9 nH and a Q factor of 23 at 250MHz, avoid use beyond 3–3.5GHz to prevent impedance instability. Also, minimize PCB parasitics by using compact layouts and symmetric routing to reduce stray capacitance that could shift resonant behavior. The unshielded construction means sensitive RF traces should be spaced at least 2x the component length away to avoid coupling.

Can the MHQ1005P3N9BT000 replace the Murata LQP03TN3N9B02D in a high-Q matching network, and what are the key trade-offs?

The MHQ1005P3N9BT000 can serve as a functional alternative to the Murata LQP03TN3N9B02D in many matching networks, both offering 3.9nH inductance in a 0402 package. However, the MHQ1005P3N9BT000 has a tighter tolerance of ±0.1nH vs. ±0.2nH on the Murata, improving matching precision. While Murata's device typically offers higher Q (>28), the TDK's Q of 23 at 250MHz may limit efficiency in narrowband high-performance RF stages. Use the MHQ1005P3N9BT000 where cost and tolerance are critical, but verify Q margin in the final circuit to avoid gain or efficiency loss.

What are the reliability risks of using the MHQ1005P3N9BT000 in automotive RF applications with frequent thermal cycling?

The MHQ1005P3N9BT000 supports a wide operating temperature range of -55°C to 125°C, making it suitable for under-hood or exterior automotive electronics. However, as an unshielded multilayer ceramic inductor, it is sensitive to mechanical stress from PCB flexing during thermal cycling. To mitigate cracking risks, avoid placing the MHQ1005P3N9BT000 near board edges or large thermal vias, and use compliant solder joints via proper pad design per IPC-7351. Also, ensure reflow profiles stay within JEDEC MSL1 limits to prevent moisture-related failures during soldering.

How does the MHQ1005P3N9BT000's 90mOhm DCR impact power efficiency in a low-voltage power amplifier (PA) bias line?

The MHQ1005P3N9BT000's maximum 90mOhm DCR introduces minimal resistive loss, making it suitable for low-current PA bias lines up to 500mA. At full 900mA DC current, I²R losses reach ~72mW, which may lead to thermal derating in densely packed RFIC layouts. However, this inductor lacks a defined saturation current (Isat), so core performance under combined AC+DC bias is uncertain. For PA bias applications, verify that inductance remains stable under operating current via bench testing, and consider adding a soft-start circuit to reduce transient stress on the MHQ1005P3N9BT000.

What design challenges arise from using an unshielded inductor like the MHQ1005P3N9BT000 in a dense multilayer RF board?

Using the unshielded MHQ1005P3N9BT000 in high-density RF designs risks magnetic coupling with adjacent traces or components, especially in compact 5G or Wi-Fi 6E modules. To minimize crosstalk, orient the MHQ1005P3N9BT000 with its short axis (0603 footprint dimension) perpendicular to nearby sensitive lines, and maintain keep-out zones of at least 1mm. Route ground planes underneath with limited copper coverage directly under the inductor to reduce eddy currents. Simulate near-field coupling in EM tools before layout finalization, as the ceramic, non-magnetic core offers no flux containment, increasing EMI susceptibility in stacked board configurations.

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