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FI168B5538FW-T
Taiyo Yuden
RF FILT BAND PASS 5.5375GHZ 0603
89996 Pcs New Original In Stock
5.5375GHz Center Frequency Band Pass RF Filter (Radio Frequency) 775MHz Bandwidth 1.2dB 0603 (1608 Metric), 3 PC Pad
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5.0 / 5.0
- (482 Ratings)
FI168B5538FW-T
Product Overview
9327769
DiGi Electronics Part Number
FI168B5538FW-T-DGManufacturer
Taiyo Yuden
FI168B5538FW-T
Description
RF FILT BAND PASS 5.5375GHZ 0603Inventory
89996 Pcs New Original In Stock
5.5375GHz Center Frequency Band Pass RF Filter (Radio Frequency) 775MHz Bandwidth 1.2dB 0603 (1608 Metric), 3 PC Pad
Quantity
Minimum 1
Minimum 1
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FI168B5538FW-T Technical Specifications
Category
RF Filters
Packaging
Cut Tape (CT)
Series
FI
Product Status
Not For New Designs
Frequency
5.5375GHz Center
Bandwidth
775MHz
Filter Type
Band Pass
Ripple
-
Insertion Loss
1.2dB
Mounting Type
Surface Mount
Package / Case
0603 (1608 Metric), 3 PC Pad
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Height (Max)
0.026" (0.65mm)
Datasheet & Documents
HTML Datasheet
FI168B5538FW-T-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN
EAR99
HTSUS
8529.90.9800
Additional Information
Other Names
587-FI168B5538FW-TTR
PG FI 168B5538FW-T
587-FI168B5538FW-TCT
Standard Package
5,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Je suis impressionné par la robustesse des produits, manipuler et utiliser est un vrai plaisir.
Dec 02, 2025
Je recommande vivement DiGi Electronics pour la qualité et la fiabilité de ses produits et emballages.
Dec 02, 2025
Received my order quickly, and everything was in perfect condition.
Dec 02, 2025
Efficient checkout process and detailed product info make shopping hassle-free.
Dec 02, 2025
DiGi’s commitment to fast delivery and excellent support is unmatched.
Dec 02, 2025
Affordable prices paired with durable products make DiGi Electronics my preferred brand.
Dec 02, 2025
Excellent customer service and reliable after-sales assistance make DiGi Electronics our preferred partner.
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Frequently Asked Questions (FAQ)
Can the FI168B5538FW-T be used as a drop-in replacement for the Murata BPF5540DN-01 in a 5.5 GHz Wi-Fi front-end design, and what layout adjustments are needed to avoid performance degradation?
The FI168B5538FW-T is not a direct drop-in replacement for the Murata BPF5540DN-01 due to differences in package footprint, impedance matching requirements, and grounding layout. While both are 5.5 GHz band-pass filters with similar center frequencies, the FI168B5538FW-T uses a 0603 (1608 metric) 3-pad surface-mount package, whereas the Murata part uses a different pin configuration and may require distinct transmission line tuning. To ensure minimal insertion loss and optimal return loss, you must re-optimize the PCB trace impedance (typically 50 Ω) and adjust the ground via placement near the input/output pads. Additionally, perform a full S-parameter simulation with the actual layout to validate performance before prototyping.
What are the key reliability risks when using the FI168B5538FW-T in high-humidity environments despite its MSL 1 rating, and how should PCB assembly be managed?
Although the FI168B5538FW-T has an MSL 1 (unlimited floor life) rating, indicating high resistance to moisture absorption, long-term exposure to high humidity—especially in non-hermetic enclosures—can still lead to electrochemical migration or delamination under thermal cycling. To mitigate risk, ensure the PCB undergoes proper conformal coating if deployed in harsh environments, and avoid prolonged storage in uncontrolled humidity prior to reflow. During assembly, follow standard reflow profiles (e.g., peak temperature ≤260°C) to prevent microcracking in the ceramic body. Post-assembly, perform functional RF testing under environmental stress to catch latent failures early.
How does the FI168B5538FW-T perform under high-power RF signals, and what is the maximum input power it can handle without risking damage or nonlinear distortion?
The FI168B5538FW-T is not rated for high-power applications, as Taiyo Yuden does not specify a maximum input power in the datasheet—a red flag for power handling. Based on similar 0603 ceramic RF filters, typical safe continuous-wave input power is limited to around +20 dBm (100 mW). Exceeding this level may cause dielectric heating, solder joint fatigue, or intermodulation distortion, especially near the edges of the 775 MHz bandwidth. For applications like 802.11ac/ax access points with high transmit power, consider adding a directional coupler or limiter circuit upstream, or switch to a higher-power filter such as the Qorvo TQQ1014 if power exceeds +23 dBm.
Since the FI168B5538FW-T is marked 'Not For New Designs,' what are viable long-term alternatives with better lifecycle support for new 5.5 GHz IoT or industrial wireless systems?
Due to its 'Not For New Designs' status, the FI168B5538FW-T poses supply chain and longevity risks for new projects. Recommended alternatives include the Mini-Circuits VBFZ-5500+, which offers similar 5.5 GHz center frequency and bandwidth in a comparable footprint with active lifecycle support, or the Knowles (formerly DLI) 5500BP14A0002, which provides tighter insertion loss control and better availability. Both support modern pick-and-place assembly and are qualified for industrial temperature ranges. Always validate impedance matching and board-level performance, as filter parasitics differ even with similar specs.
What PCB layout practices are critical to maintain the 1.2 dB insertion loss specification of the FI168B5538FW-T in a densely populated RF module with nearby digital components?
To preserve the FI168B5538FW-T’s low 1.2 dB insertion loss in a compact design, maintain a continuous ground plane beneath the filter with no splits or slots, and place ground vias as close as possible to all three pads to minimize parasitic inductance. Keep input and output traces symmetrical and impedance-controlled (50 Ω), and avoid routing high-speed digital lines (e.g., SPI, clock) within 3 mm of the filter to prevent coupling-induced noise or ripple distortion. Use a guard ring tied to ground around the component if space allows. Finally, minimize solder mask clearance to reduce effective dielectric variation, which can shift the center frequency and degrade passband flatness.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
FI168B5538FW-T CAD Models
Taiyo Yuden FI168B5538FW-T PCB symbols & footprints
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