Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
MD8832-D1G-V18-X-P
SanDisk
IC FLASH 1GBIT PARALLEL 69FBGA
2137 Pcs New Original In Stock
FLASH - NAND Memory IC 1Gbit Parallel 30 ns 69-FBGA (9x12)
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (272 Ratings)
MD8832-D1G-V18-X-P
Product Overview
11681330
DiGi Electronics Part Number
MD8832-D1G-V18-X-P-DGManufacturer
SanDisk
MD8832-D1G-V18-X-P
Description
IC FLASH 1GBIT PARALLEL 69FBGAInventory
2137 Pcs New Original In Stock
FLASH - NAND Memory IC 1Gbit Parallel 30 ns 69-FBGA (9x12)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
MD8832-D1G-V18-X-P Technical Specifications
Category
Memory, Memory
Packaging
Tape & Reel (TR)
Series
-
Product Status
Obsolete
DiGi-Electronics Programmable
Not Verified
Memory Type
Non-Volatile
Memory Format
FLASH
Technology
FLASH - NAND
Memory Size
1Gbit
Memory Organization
128M x 8
Memory Interface
Parallel
Write Cycle Time - Word, Page
-
Access Time
30 ns
Voltage - Supply
1.65V ~ 1.95V
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
69-FBGA
Supplier Device Package
69-FBGA (9x12)
Base Product Number
MD8832
Datasheet & Documents
HTML Datasheet
MD8832-D1G-V18-X-P-DG
Environmental & Export Classification
Moisture Sensitivity Level (MSL)
3 (168 Hours)
ECCN
3A991B1A
HTSUS
8542.32.0071
Additional Information
Other Names
MD8832D1GV18XP
585-1148-1
585-1148-2
Standard Package
1,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Their responsive after-sales service sets them apart from other brands in the industry.
Dec 02, 2025
Their dedication to quality makes me feel valued as a customer.
Dec 02, 2025
Customer support provided detailed guidance when I had questions, and they handled my concerns very patiently.
Dec 02, 2025
The support team went above and beyond to ensure my issues were resolved smoothly after purchase.
Dec 02, 2025
I highly recommend DiGi Electronics for their superior quality and affordability.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
Is the SanDisk MD8832-D1G-V18-X-P still viable for new designs despite being marked obsolete, and what are the key supply chain and reliability risks?
The SanDisk MD8832-D1G-V18-X-P is officially obsolete, meaning it is no longer recommended for new designs. While limited stock may exist (e.g., 2045 units in inventory), relying on it introduces significant supply chain risks, including sudden depletion and lack of future availability. Additionally, obsolete components often lack ongoing reliability monitoring and technical support. For new designs, consider migrating to a modern, actively supported NAND flash like the Micron MT29F1G08ABADA or Kioxia TC58CVG0S3HRAIJ, which offer similar 1Gbit parallel interfaces with improved endurance, lower power, and full lifecycle support.
Can I replace the SanDisk MD8832-D1G-V18-X-P with a more recent 1Gbit parallel NAND flash without redesigning my PCB, and what pinout or timing compatibility issues should I expect?
Direct replacement of the SanDisk MD8832-D1G-V18-X-P is risky due to its 69-FBGA (9x12) package and proprietary pinout, which may not align with newer industry-standard devices. For example, the Micron MT29F1G08ABAEAWP uses a 48-TBGA package and different ball map, requiring PCB layout changes. Even if package size matches, timing parameters like tWB (write busy time) and command set compatibility must be verified. Always cross-check the command interface, voltage tolerance (1.8V nominal), and timing diagrams in the datasheet before substitution. A drop-in replacement is unlikely; a full signal integrity and protocol validation is recommended.
What are the critical design constraints when using the SanDisk MD8832-D1G-V18-X-P in a high-temperature industrial application near its 85°C limit?
Operating the SanDisk MD8832-D1G-V18-X-P near its maximum temperature of 85°C significantly impacts data retention and endurance. NAND flash reliability degrades exponentially with temperature—above 70°C, uncorrectable bit error rates (UBER) increase, demanding stronger ECC (e.g., BCH with ≥4-bit correction per 512 bytes). Additionally, thermal cycling can stress the 69-FBGA solder joints, especially under MSL 3 conditions. Ensure robust thermal management, minimize write/erase cycles at peak temps, and implement real-time health monitoring. Consider derating the operating temperature to ≤70°C for long-term reliability in industrial environments.
How does the 30 ns access time of the SanDisk MD8832-D1G-V18-X-P affect system-level performance in a parallel memory interface, and what controller-side optimizations are needed?
The 30 ns access time of the SanDisk MD8832-D1G-V18-X-P defines the minimum delay between address assertion and valid data output, directly impacting memory bus throughput. In a synchronous design, this limits maximum clock frequency unless wait states are inserted. For optimal performance, ensure your memory controller supports programmable timing parameters (tRC, tREA) and accounts for PCB trace delays. Use source-synchronous clocking if possible, and validate signal integrity on DQ[7:0] and control lines (CLE, ALE, WE#). Underestimating setup/hold times can lead to read errors—simulate or bench-test timing margins under PVT (process, voltage, temperature) variation.
What are the moisture sensitivity and handling risks for the SanDisk MD8832-D1G-V18-X-P during assembly, and how should it be stored and processed to avoid popcorning?
The SanDisk MD8832-D1G-V18-X-P has an MSL 3 rating, meaning it can be exposed to ambient conditions for up to 168 hours (7 days) after dry packaging is opened before reflow. Exceeding this window without proper baking (typically 125°C for 24 hours) risks moisture absorption, leading to popcorning during reflow soldering—a catastrophic failure in 69-FBGA packages. Store unused parts in dry cabinets (<5% RH) or reseal in moisture barrier bags with desiccant. Always follow J-STD-033 guidelines for handling. For high-volume production, track floor life rigorously; for prototype builds, minimize exposure and consider baking if storage conditions are uncertain.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MD8832-D1G-V18-X-P CAD Models
SanDisk MD8832-D1G-V18-X-P PCB symbols & footprints
productDetail
