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R5F1006AASP#10
Renesas Electronics Corporation
IC MCU 16BIT 16KB FLASH 20LSSOP
4150 Pcs New Original In Stock
RL78 RL78/G13 Microcontroller IC 16-Bit 32MHz 16KB (16K x 8) FLASH 20-LSSOP
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5.0 / 5.0
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R5F1006AASP#10
Product Overview
9444352
DiGi Electronics Part Number
R5F1006AASP#10-DGManufacturer
Renesas Electronics Corporation
R5F1006AASP#10
Description
IC MCU 16BIT 16KB FLASH 20LSSOPInventory
4150 Pcs New Original In Stock
RL78 RL78/G13 Microcontroller IC 16-Bit 32MHz 16KB (16K x 8) FLASH 20-LSSOP
Quantity
Minimum 1
Minimum 1
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R5F1006AASP#10 Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Tray
Series
RL78/G13
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
RL78
Core Size
16-Bit
Speed
32MHz
Connectivity
CSI, I2C, UART/USART
Peripherals
DMA, LVD, POR, PWM, WDT
Number of I/O
13
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
EEPROM Size
4K x 8
RAM Size
2K x 8
Voltage - Supply (Vcc/Vdd)
1.6V ~ 5.5V
Data Converters
A/D 6x8/10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
20-LSSOP
Package / Case
20-LSSOP (0.240", 6.10mm Width)
Base Product Number
R5F1006
Datasheet & Documents
HTML Datasheet
R5F1006AASP#10-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
559-R5F1006AASP#10
Standard Package
1,920
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Excellent service client avec des tarifs très avantageux chez DiGi Electronics.
Dec 02, 2025
DiGi Electronics consistently provides an extensive stock, ensuring I always find what I need promptly and reliably.
Dec 02, 2025
The quick dispatch of my order was a pleasant surprise—very efficient service.
Dec 02, 2025
Their products have proven to be both durable and cost-effective for long-term gaming.
Dec 02, 2025
The professionalism displayed by their support staff was truly commendable.
Dec 02, 2025
I’ve tested their products under extreme conditions, and they still perform flawlessly after years of use.
Dec 02, 2025
Excellent shopping experience with great prices and an intuitive website interface.
Dec 02, 2025
Great value and a seamless browsing experience—highly recommended.
Dec 02, 2025
DiGi Electronics makes sure every customer feels taken care of long after purchase.
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Frequently Asked Questions (FAQ)
What are the key design-in considerations when using the R5F1006AASP#10 in a low-power sensor node to avoid premature battery drain?
When designing with the R5F1006AASP#10 for low-power applications, it's critical to fully leverage its RL78 core's multiple low-power modes (HALT, STOP, SNOOZE). To minimize battery drain, ensure unused peripherals like CSI or UART are disabled, and use the on-chip LVD to monitor supply voltage without waking the CPU. Avoid leaving I/O pins floating—configure all 13 GPIOs as inputs with pull-ups/downs or outputs in known states. Additionally, clock source selection impacts power; use the internal oscillator with IDLE mode for balanced performance and current. Mismanagement of wakeup sources or interrupt latency can cause extended active time, increasing average current beyond datasheet claims.
Can the R5F1006AASP#10 replace an MSP430G2553 in an existing analog front-end design, and what are the practical integration risks?
While the R5F1006AASP#10 can functionally replace an MSP430G2553 due to similar pin count, voltage range (1.6V–5.5V), and integrated 10-bit ADCs, key integration risks exist. The R5F1006AASP#10 has only 6 ADC channels vs. 8 on the MSP430G2553, which may require signal multiplexing. ADC reference voltage flexibility is more limited; the Renesas part lacks an internal 2.5V reference, so external refs may be needed for precision. Also, code porting from TI's MSP430 to Renesas' RL78 architecture requires significant changes due to different ISAs and peripheral registers. Ensure timing compatibility in UART/USART and I2C communication if interfacing with legacy peripherals tuned for MSP430 speeds.
How does the R5F1006AASP#10 handle voltage transients in automotive or industrial environments, and what external protection is recommended?
The R5F1006AASP#10 operates from 1.6V to 5.5V and includes integrated LVD (Low Voltage Detection) for brown-out protection, but it remains susceptible to fast transients common in automotive/industrial settings. While its operating range supports 5V-tolerant systems, it lacks on-chip transient voltage suppression. To mitigate risk, use a dedicated voltage supervisor (e.g., TC1301) with adjustable threshold and short reset pulse. Place a 10μF low-ESR ceramic capacitor near the Vcc pin, combined with ferrite beads for filtering switching noise. Ensure PCB layout avoids shared power traces with high-current loads to prevent ground bounce affecting the 2K RAM integrity or ADC accuracy.
What are the practical limitations of using the internal oscillator in timing-critical applications with the R5F1006AASP#10?
The R5F1006AASP#10's internal oscillator supports up to 32MHz but has a typical accuracy of ±1% at 25°C, degrading to ±2.5% over temperature. This makes it unsuitable for USB communication or precise UART baud rates (e.g., 115200 bps) without periodic calibration. For reliable serial communication, use the on-chip CSI or UART with automatic baud rate detection, or implement software compensation based on temperature readings. In time-stamped data logging, rely on an external 32.768 kHz crystal for RTC functionality—internal oscillators drift too much for long-term accuracy. Always verify timing margins in worst-case voltage and temperature conditions.
What are the reliability risks when soldering the R5F1006AASP#10 in high-humidity environments, and how can MSL3 compliance be managed effectively?
The R5F1006AASP#10 has MSL3 rating (168-hour floor life), meaning it must be baked and reflowed within controlled humidity conditions. In high-humidity environments, exposure beyond the floor life risks 'popcorning' during reflow due to internal moisture vaporization. Always store in sealed dry bags with desiccant until assembly. If the device was exposed beyond 168 hours at >60% RH, bake at 125°C for 24 hours before reflow. Use a controlled reflow profile with proper preheat to minimize thermal shock. Post-solder, conformal coating can prevent leakage currents on the 20-LSSOP package, particularly critical given the 1.6V minimum Vcc operation.
Quality Assurance (QC)
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R5F1006AASP#10 CAD Models
Renesas Electronics Corporation R5F1006AASP#10 PCB symbols & footprints
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