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CX1210MKX7R9BB474
Pulse Electronics
CAP CER 0.47UF 50V X7R 1210
22415 Pcs New Original In Stock
0.47 µF ±20% 50V Ceramic Capacitor X7R 1210 (3225 Metric)
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5.0 / 5.0
- (151 Ratings)
CX1210MKX7R9BB474
Product Overview
10296882
DiGi Electronics Part Number
CX1210MKX7R9BB474-DGManufacturer
Pulse Electronics
CX1210MKX7R9BB474
Description
CAP CER 0.47UF 50V X7R 1210Inventory
22415 Pcs New Original In Stock
0.47 µF ±20% 50V Ceramic Capacitor X7R 1210 (3225 Metric)
Quantity
Minimum 1
Minimum 1
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CX1210MKX7R9BB474 Technical Specifications
Category
Ceramic Capacitors
Packaging
Tape & Reel (TR)
Series
X2Y®
Product Status
Active
Capacitance
0.47 µF
Tolerance
±20%
Voltage - Rated
50V
Temperature Coefficient
X7R
Operating Temperature
-55°C ~ 125°C
Features
Low ESL (X2Y)
Ratings
-
Applications
Bypass, Decoupling
Failure Rate
-
Mounting Type
Surface Mount, MLCC
Package / Case
1210 (3225 Metric)
Size / Dimension
0.126" L x 0.098" W (3.20mm x 2.50mm)
Height - Seated (Max)
-
Thickness (Max)
0.067" (1.70mm)
Lead Spacing
-
Lead Style
-
Datasheet & Documents
HTML Datasheet
CX1210MKX7R9BB474-DG
Environmental & Export Classification
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8532.24.0020
Additional Information
Other Names
553-CX1210MKX7R9BB474TR
1837-CX1210MKX7R9BB474TR-DG
1837-CX1210MKX7R9BB474TR
Standard Package
2,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
他們的售後支援讓我非常感動，無論遇到什麼問題都能快速獲得協助。
Dec 02, 2025
他們的售後支援讓我感到很安心，經常在第一時間內解決問題。
Dec 02, 2025
DiGi Electronics' robust after-sales support makes them a trusted partner.
Dec 02, 2025
The combination of quick shipping and great prices makes them a leader.
Dec 02, 2025
Every interaction with their support team reassures me of their dedication to customers.
Dec 02, 2025
My order arrived in perfect condition thanks to their careful packaging and diligent logistics tracking.
Dec 02, 2025
I appreciate their careful approach to packaging, which minimizes issues.
Dec 02, 2025
Their inventory management practices greatly enhance our project planning.
Dec 02, 2025
DiGi Electronics consistently delivers high-quality products that exceed my expectations.
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Frequently Asked Questions (FAQ)
What are the key design risks when using the CX1210MKX7R9BB474 for high-speed digital decoupling in multi-layer PCBs?
When using the CX1210MKX7R9BB474 for high-speed digital decoupling, a primary risk is ineffective noise suppression due to suboptimal PCB layout, despite the capacitor’s low ESL X2Y® design. To mitigate this, place the device as close as possible to the IC power pins with minimal via length and use low-inductance power/ground plane stacks. Even with X2Y® technology reducing common-mode noise, poor stack-up or long current loops can negate benefits. Always simulate PDN impedance below the target impedance threshold, especially near critical ICs. Avoid shared vias with other components to maintain low loop inductance unique to the CX1210MKX7R9BB474’s noise suppression capability.
How does the CX1210MKX7R9BB474 compare to standard 1210 X7R capacitors like the GRM32DR71H474KA01K in terms of noise filtering for mixed-signal applications?
The CX1210MKX7R9BB474 offers superior noise filtering over standard 1210 X7R MLCCs like the GRM32DR71H474KA01K due to its X2Y® architecture, which integrates low ESL and enhanced EMI suppression via proprietary electrode design. Where the GRM32DR71H474KA01K only provides basic bulk decoupling, the CX1210MKX7R9BB474 actively reduces high-frequency differential and common-mode noise—critical in mixed-signal systems near ADCs or RF sections. However, it should not replace traditional decoupling networks but rather complement them. Use CX1210MKX7R9BB474 at system noise injection points while relying on multiple standard caps for localized high-frequency response.
Can the CX1210MKX7R9BB474 be used as a drop-in replacement for a failed 0.47µF 50V X7R 1210 capacitor in a power supply filtering stage, and what hidden reliability issues should be considered?
While the CX1210MKX7R9BB474 appears to be a drop-in replacement for generic 0.47µF 50V X7R 1210 capacitors in power supply filtering, hidden reliability risks include voltage derating and mechanical stress from PCB flexing. The X2Y® internal structure may respond differently to board strain than standard MLCCs, increasing risk of crack-induced failure under thermal cycling or vibration. Always derate voltage to 50% (max 25V applied) to maintain capacitance stability and long-term reliability. Additionally, verify solder joint integrity during reflow due to the CX1210MKX7R9BB474’s thickness (1.70mm); uneven heating in dense layouts can lead to head-in-pillow defects.
What are the application limits of the CX1210MKX7R9BB474 when used in automotive environments with wide temperature swings?
The CX1210MKX7R9BB474 supports operation from -55°C to 125°C, making it suitable for automotive under-hood applications; however, its X7R dielectric with ±20% tolerance means capacitance can drop significantly at temperature extremes and under DC bias. At 50V rated voltage, expect up to 30% capacitance loss near 125°C under bias, limiting effectiveness in voltage-sensitive filtering. The device lacks AEC-Q200 certification, so long-term reliability in automotive transients (load dump, cold cranking) is not guaranteed. For mission-critical systems, consider additional transient protection and validate with HALT testing when using CX1210MKX7R9BB474.
How should engineers address the lack of MSL warning for the CX1210MKX7R9BB474 during SMT assembly, and what handling precautions are recommended?
Although the CX1210MKX7R9BB474 has MSL 1 (unlimited floor life), its ceramic construction is still vulnerable to moisture-induced popcorning during rapid reflow heating, especially at 1.70mm thickness. The lack of explicit handling warnings doesn’t eliminate risk in humid environments. Always store in dry cabinets (≤40% RH) and bake if exposed to high humidity over 12 hours. Use a ramp-rate controlled reflow profile (≤3°C/sec) to prevent thermal shock cracking. The X2Y® internal electrode symmetry in CX1210MKX7R9BB474 may reduce thermal stress sensitivity, but consistent pre-baking and handling protocols ensure zero defects in high-reliability builds.
Quality Assurance (QC)
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CX1210MKX7R9BB474 CAD Models
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