UF1J_R1_00001 >
UF1J_R1_00001
Panjit International Inc.
DIODE GEN PURP 600V 1A SMB
17279 Pcs New Original In Stock
Diode 600 V 1A Surface Mount SMB (DO-214AA)
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UF1J_R1_00001 Panjit International Inc.
5.0 / 5.0 - (470 Ratings)

UF1J_R1_00001

Product Overview

12965248

DiGi Electronics Part Number

UF1J_R1_00001-DG
UF1J_R1_00001

Description

DIODE GEN PURP 600V 1A SMB

Inventory

17279 Pcs New Original In Stock
Diode 600 V 1A Surface Mount SMB (DO-214AA)
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 10 0.0576 0.5760
  • 100 0.0454 4.5400
  • 300 0.0394 11.8200
  • 800 0.0333 26.6400
  • 4800 0.0296 142.0800
  • 9600 0.0278 266.8800
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UF1J_R1_00001 Technical Specifications

Category Diodes, Rectifiers, Single Diodes

Manufacturer PANJIT

Packaging Tape & Reel (TR)

Series -

Product Status Active

Technology Standard

Voltage - DC Reverse (Vr) (Max) 600 V

Current - Average Rectified (Io) 1A

Voltage - Forward (Vf) (Max) @ If 1.7 V @ 1 A

Speed Fast Recovery =< 500ns, > 200mA (Io)

Reverse Recovery Time (trr) 100 ns

Current - Reverse Leakage @ Vr 1 µA @ 600 V

Capacitance @ Vr, F 17pF @ 4V, 1MHz

Mounting Type Surface Mount

Package / Case DO-214AA, SMB

Supplier Device Package SMB (DO-214AA)

Operating Temperature - Junction -55°C ~ 150°C

Base Product Number UF1J

Datasheet & Documents

HTML Datasheet

UF1J_R1_00001-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.10.0080

Additional Information

Other Names
3757-UF1J_R1_00001TR
3757-UF1J_R1_00001CT
3757-UF1J_R1_00001DKR
Standard Package
800

Alternative Parts

PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
SURS8160T3G
onsemi
125482
SURS8160T3G-DG
0.0278
Similar
CMR1U-06FL TR13 PBFREE
Central Semiconductor Corp
1944
CMR1U-06FL TR13 PBFREE-DG
0.0278
Parametric Equivalent

Reviews

5.0/5.0-(Show up to 5 Ratings)
Péta***eRose
Dec 02, 2025
5.0
Je suis confiant d’acheter chez DiGi Electronics car leurs prix sont très avantageux et leur logistique fiable.
Étoil***lante
Dec 02, 2025
5.0
Je suis très content de la durabilité et de la fiabilité de leurs produits à des prix raisonnables.
Brig***arbor
Dec 02, 2025
5.0
The quick shipment thrilled me—very efficient service overall.
Mist***adow
Dec 02, 2025
5.0
The after-sales support from DiGi Electronics is truly outstanding, ensuring any issues are promptly resolved.
Si***ath
Dec 02, 2025
5.0
Their commitment to consistent product quality makes shopping efficient and reliable.
Sky***eze
Dec 02, 2025
5.0
Reliable delivery times help me plan my work more effectively.
Starl***tQuest
Dec 02, 2025
5.0
Their affordable rates make electronic shopping much easier for me.
Moonl***tMagic
Dec 02, 2025
5.0
I am impressed by the consistency of quality across their entire range.
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Frequently Asked Questions (FAQ)

Can the UF1J_R1_00001 diode safely replace a 1N4007 in a 230V AC rectifier circuit, and what are the key risks to consider during this substitution?

While both the UF1J_R1_00001 and 1N4007 are 1A, 600V+ rated diodes, direct replacement in a 230V AC rectifier requires careful evaluation. The UF1J_R1_00001 has a much faster reverse recovery time (100 ns vs. ~30 µs for 1N4007), which reduces switching losses and EMI—beneficial in high-frequency applications. However, its forward voltage drop (1.7V @ 1A) is higher than the 1N4007’s (~1.1V), leading to increased conduction losses and thermal stress in low-frequency line rectification. Additionally, the SMB package has lower thermal mass than the DO-41 used in 1N4007, so ensure adequate PCB copper area for heat dissipation. Verify that your system’s peak inverse voltage (PIV) margin accommodates transients; although both meet 600V nominal, real-world surges may exceed this. Use only if thermal management and efficiency trade-offs are acceptable.

What design constraints should I consider when using the UF1J_R1_00001 in a high-frequency flyback converter operating at 100 kHz, especially regarding reverse recovery and layout?

The UF1J_R1_00001’s 100 ns reverse recovery time makes it suitable for 100 kHz flyback converters, but layout and snubber design are critical. Its fast trr reduces switching losses compared to standard recovery diodes, minimizing turn-on spikes in the primary MOSFET. However, the low junction capacitance (17 pF @ 4V) can interact with parasitic inductance in poorly routed traces, causing voltage ringing. Minimize loop area between the diode, transformer secondary, and output capacitor. Include an RC snubber if ringing exceeds 20% of Vrrm. Also, ensure the SMB package is mounted on sufficient thermal copper (≥2 cm² recommended) to handle continuous 1A load without exceeding Tj = 150°C. Avoid placing near heat-sensitive components due to elevated operating temperatures under load.

Is the UF1J_R1_00001 a reliable drop-in replacement for the Vishay VS-1A60A in industrial motor drive snubber circuits, and what failure modes should I monitor?

The UF1J_R1_00001 can replace the Vishay VS-1A60A in snubber applications, but with caveats. Both are 1A, 600V fast-recovery diodes in SMB packages, but the VS-1A60A is specifically designed for surge robustness (e.g., IEC 61000-4-5), while the UF1J_R1_00001 lacks published surge current ratings. In motor drives with inductive kickback, repeated high di/dt events may stress the UF1J_R1_00001 beyond its safe operating area, potentially leading to thermal runaway or bond wire fatigue. Monitor junction temperature under worst-case transient conditions and consider adding a transient voltage suppressor (TVS) in parallel for added protection. For mission-critical systems, conduct HALT testing or prefer diodes with verified surge ratings like the VS-1A60A or STTH1R06A.

How does the moisture sensitivity level (MSL 1) of the UF1J_R1_00001 impact PCB assembly processes, and can it be stored indefinitely without dry packing?

The UF1J_R1_00001’s MSL 1 rating means it is not moisture-sensitive and can be exposed to ambient factory conditions indefinitely without requiring dry storage or baking before reflow. This simplifies logistics and reduces handling risks during high-volume SMT assembly. Unlike MSL 3 or higher components, there’s no need for sealed dry bags, humidity indicator cards, or time-limited floor life tracking. However, standard ESD precautions still apply during handling. This makes the UF1J_R1_00001 ideal for just-in-time manufacturing environments where component pre-baking would add cost and complexity.

What are the long-term reliability concerns when operating the UF1J_R1_00001 near its maximum junction temperature (150°C) in an enclosed power supply with limited airflow?

Operating the UF1J_R1_00001 continuously near 150°C significantly accelerates degradation mechanisms such as metal migration, passivation layer breakdown, and solder joint fatigue. While the datasheet specifies 150°C as the absolute maximum, sustained operation above 125°C reduces mean time between failures (MTBF) exponentially. In enclosed, low-airflow environments, ensure the PCB thermal design limits Tj to ≤125°C under full load by using thermal vias, enlarged copper pads, and possibly a small heatsink. Monitor case temperature (Tc) and derate current if Tc exceeds 100°C. Consider derating the average forward current to 0.7A or selecting a higher-power alternative like the STTH1R06A if thermal headroom cannot be guaranteed—reliability drops sharply beyond recommended operating margins.

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