MBR20200FCT_T0_00001 >
MBR20200FCT_T0_00001
Panjit International Inc.
DIODE ARR SCHOTT 200V ITO220AB
20133 Pcs New Original In Stock
Diode Array 1 Pair Common Cathode 200 V 20A Through Hole TO-220-3 Full Pack
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MBR20200FCT_T0_00001 Panjit International Inc.
5.0 / 5.0 - (410 Ratings)

MBR20200FCT_T0_00001

Product Overview

12993108

DiGi Electronics Part Number

MBR20200FCT_T0_00001-DG
MBR20200FCT_T0_00001

Description

DIODE ARR SCHOTT 200V ITO220AB

Inventory

20133 Pcs New Original In Stock
Diode Array 1 Pair Common Cathode 200 V 20A Through Hole TO-220-3 Full Pack
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 0.3901 0.3901
  • 10 0.3095 3.0950
  • 50 0.2692 13.4600
  • 100 0.2260 22.6000
  • 500 0.2073 103.6500
  • 1000 0.1958 195.8000
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MBR20200FCT_T0_00001 Technical Specifications

Category Diodes, Rectifiers, Diode Arrays

Manufacturer PANJIT

Packaging Tube

Series -

Product Status Active

Diode Configuration 1 Pair Common Cathode

Technology Schottky

Voltage - DC Reverse (Vr) (Max) 200 V

Current - Average Rectified (Io) (per Diode) 20A

Voltage - Forward (Vf) (Max) @ If 900 mV @ 10 A

Speed Fast Recovery =< 500ns, > 200mA (Io)

Current - Reverse Leakage @ Vr 50 µA @ 200 V

Operating Temperature - Junction -65°C ~ 175°C

Mounting Type Through Hole

Package / Case TO-220-3 Full Pack

Supplier Device Package ITO-220AB

Base Product Number MBR20200

Datasheet & Documents

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8541.10.0080

Additional Information

Other Names
3757-MBR20200FCT_T0_00001
Standard Package
50

Alternative Parts

PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
RF2001T2D
Rohm Semiconductor
10484
RF2001T2D-DG
0.1958
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5.0/5.0-(Show up to 5 Ratings)
夜***者
Dec 02, 2025
5.0
他們的價格屬於親民範圍,客服更是熱心又有耐心。
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Dec 02, 2025
5.0
每次購買都能感受到他們的用心,產品的耐用度和品質都超乎預期,非常滿意!
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Dec 02, 2025
5.0
購入後のサポートが丁寧で、問題解決もスムーズでした。長くお付き合いしたい企業です。
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Frequently Asked Questions (FAQ)

What are the thermal design considerations when replacing a MUR20200 in a high-current SMPS with the MBR20200FCT_T0_00001, and how does junction-to-case thermal resistance affect heatsinking requirements?

When substituting the MUR20200 with the MBR20200FCT_T0_00001 in a switch-mode power supply, engineers must account for the MBR20200FCT_T0_00001's higher forward voltage under certain loads and its TO-220AB mechanical compatibility. The junction-to-case thermal resistance of approximately 1.5°C/W requires effective heatsinking, especially near the 20A average current limit. Use a thermally conductive insulator and sufficient copper mass to maintain junction temperature below 150°C under full load, particularly since Schottky diodes like the MBR20200FCT_T0_00001 are more sensitive to thermal runaway at elevated temperatures due to increased reverse leakage current.

Can the MBR20200FCT_T0_00001 be used as a drop-in replacement for STTH20R06 in reverse-voltage protection circuits, and what are the risks related to leakage current at elevated temperatures?

While the MBR20200FCT_T0_00001 shares a similar 200V rating and 20A current capacity with the STTH20R06, it is not a direct replacement in all cases due to technology differences—Schottky vs. ultra-fast PN junction. The MBR20200FCT_T0_00001 exhibits higher reverse leakage current, up to 50 µA at 200V and 25°C, which can increase exponentially at junction temperatures above 125°C. In reverse-polarity protection applications, this could lead to increased standby power loss or false triggering in sensing circuits. Thermal derating and leakage-sensitive control logic should be carefully evaluated before substitution.

How does the forward voltage drop of the MBR20200FCT_T0_00001 at 15A impact efficiency in a dual-diode freewheeling configuration, and what PCB layout practices minimize conduction losses?

The MBR20200FCT_T0_00001 has a typical forward voltage of 850 mV at 10A, which extrapolates to approximately 950–1000 mV at 15A, leading to significant conduction losses of ~14.25W for two diodes in parallel under continuous operation. To maximize efficiency, use wide copper traces (≥5mm), multiple vias for thermal relief, and minimize loop inductance in the freewheeling path. Ensure symmetrical routing to prevent current imbalance, especially if both diodes in the common-cathode pair are utilized, and consider forced-air cooling if ambient exceeds 60°C.

What reliability risks arise when operating the MBR20200FCT_T0_00001 near its 175°C junction temperature limit in high-ambient industrial environments, and how can thermal stress be mitigated?

Operating the MBR20200FCT_T0_00001 near its 175°C maximum junction temperature increases long-term degradation risks, including bond wire fatigue and encapsulation cracking due to thermal cycling. In industrial environments with ambient temperatures above 85°C, derate the maximum forward current by at least 20% and monitor actual junction temperature using thermal imaging or on-board sensors. Mount the MBR20200FCT_T0_00001 on a shared heatsink with other power devices cautiously—ensure thermal coupling does not create hotspots. Use thermal interface material with low thermal resistance to improve reliability over 10+ year operational life.

In a full-wave rectifier design using the MBR20200FCT_T0_00001 dual common-cathode configuration, how does reverse recovery differ from standard PN rectifiers like the 1N5408, and what EMI implications should be considered?

The MBR20200FCT_T0_00001, being a Schottky diode, offers near-zero reverse recovery time due to its majority-carrier conduction, unlike the 1N5408 which exhibits significant reverse recovery charge (up to 30µs). This reduces switching losses and high-frequency ringing in rectifier stages, improving efficiency and lowering EMI. However, the lower junction capacitance of the MBR20200FCT_T0_00001 can lead to faster voltage transients, potentially increasing radiated noise in poorly filtered designs. Use RC snubbers across the transformer secondary and ensure input filtering to mitigate high-frequency emissions in EMI-sensitive applications.

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