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GS1M_R1_00001
Panjit International Inc.
DIODE GEN PURP 1KV 1A SMA
17704 Pcs New Original In Stock
Diode 1000 V 1A Surface Mount SMA (DO-214AC)
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Minimum 1
5.0 / 5.0
- (65 Ratings)
GS1M_R1_00001
Product Overview
12965034
DiGi Electronics Part Number
GS1M_R1_00001-DGManufacturer
Panjit International Inc.
GS1M_R1_00001
Description
DIODE GEN PURP 1KV 1A SMAInventory
17704 Pcs New Original In Stock
Diode 1000 V 1A Surface Mount SMA (DO-214AC)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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GS1M_R1_00001 Technical Specifications
Category
Diodes, Rectifiers, Single Diodes
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Technology
Standard
Voltage - DC Reverse (Vr) (Max)
1000 V
Current - Average Rectified (Io)
1A
Voltage - Forward (Vf) (Max) @ If
1.1 V @ 1 A
Speed
Standard Recovery >500ns, > 200mA (Io)
Current - Reverse Leakage @ Vr
1 µA @ 1000 V
Capacitance @ Vr, F
12pF @ 4V, 1MHz
Mounting Type
Surface Mount
Package / Case
DO-214AC, SMA
Supplier Device Package
SMA (DO-214AC)
Operating Temperature - Junction
-55°C ~ 150°C
Base Product Number
GS1
Datasheet & Documents
HTML Datasheet
GS1M_R1_00001-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8541.10.0080
Additional Information
Other Names
3757-GS1M_R1_00001TR
3757-GS1M_R1_00001DKR
Standard Package
1,800
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
S1MA-E3/5AT
Vishay General Semiconductor - Diodes Division
1088
S1MA-E3/5AT-DG
0.0152
Parametric Equivalent
S1MHE3/61T
Vishay General Semiconductor - Diodes Division
85808
S1MHE3/61T-DG
0.0152
Parametric Equivalent
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
신속한 응대와 안정적인 재고 덕분에 업무가 원활하게 진행됩니다.
Dec 02, 2025
DiGi Electronics' user-centric website design boosts customer satisfaction.
Dec 02, 2025
I've experienced wonderful customer support that adds value beyond the initial purchase.
Dec 02, 2025
DiGi Electronics’s delivery speed and customer support set them apart.
Dec 02, 2025
Their commitment to customer happiness is reflected in their top-tier service.
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Frequently Asked Questions (FAQ)
What are the key design-in risks when using the GS1M_R1_00001 in a high-reliability power supply operating near its maximum junction temperature?
When integrating the GS1M_R1_0001 into high-reliability power supplies operating close to the 150°C junction limit, thermal runaway is a primary concern due to increased reverse leakage current at elevated temperatures. To mitigate this, ensure adequate PCB copper padding for heat dissipation and avoid routing heat-generating components nearby. Use thermal vias under the SMA footprint if possible, and consider derating the average rectified current to 0.7A–0.8A in still-air environments to maintain long-term reliability. Monitor ambient temperature and airflow, especially in enclosed systems, as the GS1M_R1_00001 lacks a heatsink option in its surface-mount package.
Can the GS1M_R1_00001 reliably replace the Vishay M1F or ON Semiconductor MUR1100 in a 1A, 800V flyback converter design?
Yes, the GS1M_R1_00001 can serve as a functional replacement for the Vishay M1F and MUR1100 in 1A/800V flyback converters, given its 1000V reverse rating and 1A average current capacity. However, note that the GS1M_R1_00001 has a standard recovery speed (>500ns), making it less suitable for high-frequency designs (>50kHz) compared to ultra-fast alternatives like the MUR1100 (35–50ns). If EMI or switching losses are critical, evaluate whether the slower recovery introduces unacceptable voltage spikes or RFI. Confirm leakage current compatibility, especially at high temperatures, as the GS1M_R1_00001's 1µA @ 1000V may exceed that of the MUR1100 in precision circuits.
What are the PCB layout best practices for minimizing thermal and electrical stress on the GS1M_R1_00001 in surface-mount assembly?
To minimize thermal and electrical stress on the GS1M_R1_00001 during SMT assembly and operation, use at least 50–70mm² of adjacent copper pour on one or both terminals for thermal conduction, connected via multiple thermal vias to internal ground planes. Avoid thin traces (<20mil) directly connected to the SMA leads to prevent current crowding. Maintain clearance >2mm to other high-voltage nodes due to its 1000V rating. Ensure the reflow profile complies with MSL1 handling—even though it's moisture-resistant, peak temperatures should not exceed 260°C to avoid package cracking or die detachment.
How does the 12pF junction capacitance of the GS1M_R1_00001 affect signal integrity in high-frequency rectification applications above 100kHz?
The 12pF junction capacitance at 4V for the GS1M_R1_00001 can cause significant AC current bypass and increased switching losses in high-frequency rectification above 100kHz. In such applications, this capacitance may lead to higher apparent current stress on the diode and coupled noise on secondary windings. For designs near or above 200kHz, consider using a low-capacitance Schottky or ultrafast diode like the STTH1R06 (6pF) instead, unless the circuit operates under low-dV/dt conditions. Use the GS1M_R1_00001 primarily in line-frequency or low-frequency SMPS (<50kHz) where its standard recovery and capacitance have minimal impact.
What reliability issues should be considered when using the GS1M_R1_00001 in automotive or industrial environments with significant thermal cycling?
In automotive or industrial environments, the GS1M_R1_00001 must endure repeated thermal cycling between -55°C and 150°C, risking solder joint fatigue due to CTE mismatch between the SMA plastic package and FR-4 PCB. To improve reliability, use a daisy chain array of small thermal relief spokes instead of solid copper connections, allowing some mechanical compliance. Avoid placing the GS1M_R1_00001 near heat sources like transformers or MOSFETs to reduce thermal gradient stress. Verify long-term performance with accelerated life testing (e.g., 1000 cycles of -40°C to 125°C). The ROHS3 compliance and MSL1 rating support robust assembly, but board flex during maintenance can still damage the device if not mechanically supported.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
GS1M_R1_00001 CAD Models
Panjit International Inc. GS1M_R1_00001 PCB symbols & footprints
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