Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
MPC8309VMAGDCA
NXP USA Inc.
IC MPU MPC83XX 400MHZ 489BGA
2047 Pcs New Original In Stock
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 400MHz 489-PBGA (19x19)
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (308 Ratings)
MPC8309VMAGDCA
Product Overview
7240069
DiGi Electronics Part Number
MPC8309VMAGDCA-DGManufacturer
NXP USA Inc.
MPC8309VMAGDCA
Description
IC MPU MPC83XX 400MHZ 489BGAInventory
2047 Pcs New Original In Stock
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 400MHz 489-PBGA (19x19)
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
MPC8309VMAGDCA Technical Specifications
Category
Embedded, Microprocessors
Packaging
-
Series
MPC83xx
Product Status
Obsolete
Core Processor
PowerPC e300c3
Number of Cores/Bus Width
1 Core, 32-Bit
Speed
400MHz
Co-Processors/DSP
Communications; QUICC Engine
RAM Controllers
DDR2
Graphics Acceleration
No
Display & Interface Controllers
-
Ethernet
10/100Mbps (3)
SATA
-
USB
USB 2.0 (1)
Voltage - I/O
1.8V, 3.3V
Operating Temperature
0°C ~ 105°C (TA)
Security Features
-
Mounting Type
Surface Mount
Package / Case
489-LFBGA
Supplier Device Package
489-PBGA (19x19)
Additional Interfaces
CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
Base Product Number
MPC8309
Datasheet & Documents
HTML Datasheet
MPC8309VMAGDCA-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
MPC8309VMAGDCA-DG
568-14354
935317359557
Standard Package
84
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
신속한 배송과 포장도 꼼꼼해서 믿고 구매했어요.
Dec 02, 2025
他們的產品選擇豐富，我們每次都能找到心儀的產品，很滿意。
Dec 02, 2025
Their dedication to quick shipping and attentive customer support sets them apart from competitors.
Dec 02, 2025
DiGi Electronics consistently delivers products on time, which has helped us keep our production schedule smooth and efficient.
Dec 02, 2025
配送速度非常快，几天内就收到了商品，效率令人赞赏！
Dec 02, 2025
Customer service excellence shines through in every interaction I’ve had.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
Can the MPC8309VMAGDCA be used as a drop-in replacement for the MPC8306 in an existing 3.3V industrial control design, and what are the key risks if the original board uses a 1.8V DDR2 memory interface?
While the MPC8309VMAGDCA shares architectural similarities with the MPC8306, it is not a guaranteed drop-in replacement due to subtle differences in I/O voltage tolerances and boot configuration requirements. The MPC8309VMAGDCA supports 1.8V and 3.3V I/O banks, but its DDR2 controller must match the memory voltage used on the target board—using a 1.8V DDR2 interface with improperly configured I/O banks can lead to signal integrity issues or permanent damage. Additionally, the QUICC Engine block in the MPC8309VMAGDCA has enhanced communication features that may require firmware updates. Always verify pin compatibility, power sequencing, and boot ROM settings before substitution; consider re-spinning the PCB if legacy timing assumptions from the MPC8306 are embedded in the layout.
What are the critical thermal and layout considerations when designing a compact embedded system around the MPC8309VMAGDCA, especially given its 489-PBGA package and 400MHz operation in a 0°C to 105°C ambient environment?
The MPC8309VMAGDCA’s 489-PBGA (19x19mm) package demands careful thermal and high-speed layout practices to ensure reliability under full load at 400MHz. Due to its MSL-3 rating, the device must be reflowed within 168 hours of opening the dry pack to avoid moisture-induced cracking. Thermal vias under the die pad are essential to dissipate heat, especially when operating near the 105°C Ta limit—insufficient cooling can trigger thermal throttling or long-term electromigration failures. High-speed signals like DDR2 and PCI must follow controlled impedance routing with minimal vias and length matching. Also, decoupling capacitors should be placed within 2mm of power pins to mitigate simultaneous switching noise. A 4-layer minimum PCB with dedicated power and ground planes is strongly recommended to maintain signal integrity and thermal performance.
Is it safe to interface the MPC8309VMAGDCA’s 1.8V GPIOs directly with 3.3V logic from a legacy CAN transceiver like the TJA1050, and what protection circuitry is needed to prevent latch-up or damage?
Directly connecting 3.3V signals from a TJA1050 CAN transceiver to the MPC8309VMAGDCA’s 1.8V GPIOs risks overvoltage damage and potential latch-up, as the MPC8309VMAGDCA’s I/O pins are not 3.3V-tolerant on 1.8V banks. While some pins may survive brief exposure, sustained 3.3V input can degrade oxide layers over time, leading to early field failures. To safely interface, use a bidirectional level shifter (e.g., TXB0108) or series resistors (100–330Ω) combined with Schottky clamping diodes to limit voltage spikes. Alternatively, configure adjacent I/O banks to 3.3V if the design allows, but verify that the DDR2 interface remains on a separate 1.8V bank to avoid cross-voltage conflicts. Always validate signal levels with an oscilloscope during power-up transients.
Given that the MPC8309VMAGDCA is marked as obsolete by NXP, what are the long-term supply chain risks, and which currently available NXP processors offer a viable migration path with minimal software rework?
The MPC8309VMAGDCA’s obsolete status poses significant long-term risks, including sudden last-time buy deadlines, counterfeit parts in the open market, and lack of future firmware or security updates. Although 1,975 units are currently in stock, this inventory may not support volume production beyond 12–18 months. For a forward-compatible migration, consider the NXP Layerscape LS1012A or LS1021A, which maintain software compatibility with the e300 core and QUICC Engine heritage while offering modern interfaces like Gigabit Ethernet and ARM Cortex-A cores. However, migrating requires updating the bootloader, DDR3/DDR4 memory controller configuration, and potentially rewriting low-level drivers. A more conservative path is the still-active MPC8308, which shares pin and software compatibility but lacks the MPC8309VMAGDCA’s enhanced communication accelerators—evaluate feature trade-offs before committing to a redesign.
How does the QUICC Engine in the MPC8309VMAGDCA impact real-time performance in a multi-protocol communication gateway using CAN, SPI, and TDM, and what are the hidden bottlenecks when all three are active simultaneously?
The QUICC Engine in the MPC8309VMAGDCA offloads protocol processing for CAN, SPI, and TDM, significantly improving real-time responsiveness compared to pure software implementations on the e300c3 core. However, simultaneous high-throughput operation across all three interfaces can create hidden bottlenecks due to shared internal bandwidth and memory access contention. For example, sustained CAN message bursts combined with TDM voice streaming may starve SPI transactions, leading to buffer overruns—especially if DMA channels are not prioritized correctly. Additionally, the QUICC Engine’s internal FIFO depths are limited, so poorly timed interrupts or excessive polling can degrade performance. To mitigate this, allocate dedicated DMA channels, use interrupt coalescing, and profile worst-case latency using NXP’s QUICC Engine firmware libraries. Always validate timing under peak load with logic analyzers on actual hardware, as simulation models often underestimate real-world contention.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
MPC8309VMAGDCA CAD Models
NXP USA Inc. MPC8309VMAGDCA PCB symbols & footprints
productDetail
