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GRM011R60J102KE01L
Murata Electronics
CAP CER 1000PF 6.3V X5R 08004
25206 Pcs New Original In Stock
Ceramic Capacitor
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Minimum 1
5.0 / 5.0
- (164 Ratings)
GRM011R60J102KE01L
Product Overview
11112423
DiGi Electronics Part Number
GRM011R60J102KE01L-DGManufacturer
Murata Electronics
GRM011R60J102KE01L
Description
CAP CER 1000PF 6.3V X5R 08004Inventory
25206 Pcs New Original In Stock
Ceramic Capacitor
Quantity
Minimum 1
Minimum 1
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GRM011R60J102KE01L Technical Specifications
Category
Ceramic Capacitors
Packaging
Tape & Reel (TR)
Series
*
Product Status
Active
Datasheet & Documents
Part Numbering Guide
Chip Monolithic Ceramic Caps Part Numbering
HTML Datasheet
GRM011R60J102KE01L-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8532.24.0020
Additional Information
Other Names
490-GRM011R60J102KE01LTR
Standard Package
50,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
재고 파악이 잘 돼 있어서 주문 후 예상 배송일을 확신할 수 있었어요.
Dec 02, 2025
他們的客戶服務態度很好，解答我的每個疑問都很詳細。
Dec 02, 2025
The tough outer packaging safeguarded the product effectively during transit.
Dec 02, 2025
The diverse range of products allows us to keep our classrooms updated with the latest technology.
Dec 02, 2025
Fast shipping and excellent prices—this shop is a treasure for electronics fans.
Dec 02, 2025
The shipping was extremely quick, and they kept me updated throughout the process.
Dec 02, 2025
The shipping was lightning-fast and reliable. Plus, their customer support was top-notch.
Dec 02, 2025
The logistics team demonstrates great attention to detail, ensuring secure and prompt deliveries.
Dec 02, 2025
The affordable prices combined with consistent quality make shopping here a pleasure.
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Frequently Asked Questions (FAQ)
When designing a high-density PCB for a wearable device, can I safely replace the GRM011R60J102KE01L with a similarly sized 08004 ceramic capacitor from a different manufacturer like TDK or Samsung, and what are the key risks to evaluate?
While the GRM011R60J102KE01L (Murata) shares the same 08004 package, 1000pF, 6.3V, and X5R characteristics with alternatives like the TDK C08004X5R6R3C102K or Samsung CL00C102KP8NNNC, direct substitution without validation introduces risks. Key concerns include subtle differences in DC bias performance, temperature stability under load, and parasitic inductance due to internal electrode design. Murata’s GRM series is known for tight tolerance and low microphonics—critical in compact analog front-ends. Always verify impedance vs. frequency and DC bias curves across all candidate parts; even minor shifts can affect RF matching or power integrity in sensitive wearables.
What are the reliability implications of using the GRM011R60J102KE01L in a battery-powered IoT sensor node that experiences frequent thermal cycling between -20°C and +70°C, and how does X5R derating impact long-term stability?
The GRM011R60J102KE01L uses X5R dielectric, which guarantees capacitance stability within ±15% from -55°C to +85°C, but real-world performance under thermal cycling can drift more due to mechanical stress on the ultra-small 08004 package. In battery-powered IoT nodes with intermittent high-current bursts, repeated thermal expansion may accelerate microcrack formation, especially if board flexure or poor solder joint design is present. To mitigate risk, apply a 30–50% voltage derating (e.g., operate at ≤3V despite 6.3V rating) and ensure conformal coating is used if environmental exposure is expected. Monitor capacitance drift over 1,000+ cycles during qualification.
Can the GRM011R60J102KE01L be used as a bypass capacitor for a 2.4GHz RF power amplifier, and what layout considerations are critical to avoid unintended resonance or EMI issues?
Yes, the GRM011R60J102KE01L can serve as a bypass capacitor in 2.4GHz RF paths due to its low ESL and stable X5R characteristics, but its 08004 footprint demands extreme layout discipline. Place it within 1–2 mm of the PA supply pin with minimal via stubs and symmetric grounding to avoid creating stub resonances near 2.4GHz. Avoid routing high-speed signals beneath it, as the ceramic body can couple noise. For optimal performance, pair it with a slightly larger capacitor (e.g., 10nF in 1005) to cover lower frequencies, creating a broadband decoupling network. Always simulate or measure S-parameters to confirm no self-resonance occurs within the operating band.
How does the moisture sensitivity level (MSL 1) of the GRM011R60J102KE01L affect assembly processes, and can it be safely used in high-volume pick-and-place lines without special handling?
The GRM011R60J102KE01L is rated MSL 1 (unlimited floor life), meaning it requires no dry packing, baking, or time-limited exposure control during assembly—making it ideal for high-volume SMT lines. However, its 08004 size (0.8mm × 0.4mm) poses placement challenges: nozzle selection, vacuum pressure, and vision alignment must be finely tuned to prevent tombstoning or misalignment. Unlike larger capacitors, even minor solder paste stencil aperture variations (±10%) can significantly affect yield. Recommend using laser-cut stencils with 1:1 aperture ratio and verifying first-article inspection with automated optical inspection (AOI) to maintain >99.5% placement accuracy.
If I'm upgrading a legacy design that previously used a 0402-sized 1000pF capacitor, is it advisable to switch to the GRM011R60J102KE01L in 08004 for space savings, and what trade-offs should I consider in terms of mechanical robustness and high-frequency performance?
Switching from a 0402 to the GRM011R60J102KE01L in 08004 saves ~60% board area, which is compelling for miniaturized designs—but introduces trade-offs. The smaller package has reduced mechanical strength, increasing susceptibility to cracking during drop tests or thermal stress, especially on flexible PCBs. While high-frequency performance (ESL ~200pH) is excellent and often better than 0402 due to shorter internal electrodes, the reduced solder joint area lowers thermal and mechanical fatigue life. If your application involves vibration or frequent thermal cycling, consider reinforcing with underfill or opting for a molded 0201 alternative with similar specs. Validate drop and thermal shock performance early in prototyping.
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