TCM4-1W+ >
TCM4-1W+
Mini-Circuits
1:4 CORE & WIRE TRANSFORMER, 3 -
23354 Pcs New Original In Stock
RF Balun 3MHz ~ 800MHz 1:4 6-SMD Module
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TCM4-1W+ Mini-Circuits
5.0 / 5.0 - (47 Ratings)

TCM4-1W+

Product Overview

9832452

DiGi Electronics Part Number

TCM4-1W+-DG

Manufacturer

Mini-Circuits
TCM4-1W+

Description

1:4 CORE & WIRE TRANSFORMER, 3 -

Inventory

23354 Pcs New Original In Stock
RF Balun 3MHz ~ 800MHz 1:4 6-SMD Module
Balun
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 2.7164 2.7164
  • 10 2.3049 23.0490
  • 30 2.0586 61.7580
  • 100 1.8109 181.0900
  • 500 1.6970 848.5000
  • 1000 1.6458 1645.8000
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TCM4-1W+ Technical Specifications

Category Balun

Manufacturer Mini-Circuits

Packaging Tape & Reel (TR)

Series -

Product Status Active

Frequency Range 3MHz ~ 800MHz

Impedance - Unbalanced/Balanced 1:4

Phase Difference -

Insertion Loss (Max) 3dB

Return Loss (Min) 9.01dB

Package / Case 6-SMD Module

Mounting Type Surface Mount

Datasheet & Documents

HTML Datasheet

TCM4-1W+-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 8504.31.4035

Additional Information

Other Names
3157-TCM4-1W+CT
3157-TCM4-1W+DKR
3157-TCM4-1W+TR
Standard Package
2,000

Reviews

5.0/5.0-(Show up to 5 Ratings)
Vel***Glow
Dec 02, 2025
5.0
The quality assurance process at DiGi Electronics is truly reassuring.
Hidde***rizon
Dec 02, 2025
5.0
Their reliable products are a testament to their commitment to value.
Wildf***erSoul
Dec 02, 2025
5.0
Their consistent product performance reassures me that I am making a reliable choice.
Gol***Echo
Dec 02, 2025
5.0
Their logistics management ensures a smooth experience from order to delivery.
Moonl***ourney
Dec 02, 2025
5.0
I highly value their logistics tracking system, as it kept me informed and reassured during the entire shipping process.
Sky***ker
Dec 02, 2025
5.0
Their affordable pricing makes it easier for me to upgrade my gaming gear without worrying about sacrificing quality.
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Frequently Asked Questions (FAQ)

What are the critical layout considerations when designing a PCB for the TCM4-1W+ RF balun to maintain impedance matching and minimize insertion loss above 500MHz?

When integrating the TCM4-1W+ into a high-frequency design, maintain tight control over transmission line geometry by using grounded coplanar waveguide or microstrip with a solid reference plane directly beneath the device. Keep input and output traces symmetrical and as short as possible to preserve balance and reduce parasitic inductance. Avoid vias near the balun pads, and ensure the ground plane is uninterrupted under the component to prevent phase imbalance and degradation of return loss. Poor layout above 500MHz can increase insertion loss beyond the 3dB spec and cause impedance mismatch, especially in 1:4 impedance transformation applications like 50Ω to 200Ω interfaces.

Can the TCM4-1W+ be safely replaced with the Anaren 1A1392 or the Marki Microwave BAL-0006SMG in a 400–600MHz receiver front-end without redesigning the matching network?

Direct replacement of the TCM4-1W+ with the Anaren 1A1392 or Marki BAL-0006SMG is not recommended without re-evaluating the matching network. While all three are 1:4 impedance ratio baluns covering similar frequencies, the TCM4-1W+ has a lower insertion loss (max 3dB) and better return loss (min 9.01dB) in the 400–600MHz range compared to the 1A1392’s higher loss and the BAL-0006SMG’s narrower optimal bandwidth. Additionally, package parasitics and internal winding configurations differ, which can shift the optimal operating impedance. Always perform S-parameter simulation or bench validation to confirm performance, especially in sensitive receiver chains where noise figure and gain flatness are critical.

How does DC bias current affect the performance of the TCM4-1W+ when used in a bias-T configuration for active antenna applications, and what is the maximum allowable DC current?

The TCM4-1W+ is not designed to carry significant DC current through its windings, as it uses core-and-wire construction optimized for RF signal integrity, not power handling. Applying DC bias—common in active antenna or LNA-powered systems—can saturate the ferrite core, leading to increased insertion loss, harmonic distortion, and degraded phase balance. Mini-Circuits does not specify a DC current rating, so any DC path should be isolated using series capacitors or external bias tees. If DC feed is unavoidable, limit current to <10mA and verify performance with network analyzer measurements, as even small DC levels can shift the lower cutoff frequency and compromise 3MHz operation.

Is the TCM4-1W+ suitable for use in a 5G sub-6GHz massive MIMO array where phase consistency across multiple channels is critical, and how should units be selected for phase matching?

The TCM4-1W+ can be used in sub-6GHz MIMO systems, but phase consistency across units is not tightly controlled in standard production, making it risky for beamforming applications requiring <5° phase mismatch. While the device maintains good amplitude balance, phase variation between individual TCM4-1W+ units can exceed 10° over 300–800MHz, especially near band edges. For critical arrays, request phase-matched binning from Mini-Circuits or consider higher-precision alternatives like the TCM1-63AX+. Alternatively, calibrate each channel in software or use a common reference balun topology to minimize inter-channel phase drift.

What reliability risks should be considered when using the TCM4-1W+ in high-vibration industrial environments, and does its MSL-1 rating imply robustness against thermal cycling?

Although the TCM4-1W+ carries an MSL-1 (unlimited floor life) rating, indicating excellent moisture resistance and reflow stability, its mechanical reliability in high-vibration settings depends on PCB mounting and solder joint integrity. The 6-SMD package lacks through-hole anchors, making it susceptible to fatigue under continuous mechanical stress. In industrial or automotive environments, reinforce the assembly with underfill epoxy or conformal coating to prevent pad lifting. Additionally, thermal cycling can induce stress at the wire-to-pad interface due to CTE mismatch; limit operational temperature swings and avoid rapid thermal transients. Always conduct HALT (Highly Accelerated Life Testing) if deploying in mission-critical, high-stress applications.

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