MT9172AP1 >
MT9172AP1
Microchip Technology
IC TELECOM INTERFACE 28PLCC
20912 Pcs New Original In Stock
Telecom IC Subscriber Line Interface Concept (SLIC) 28-PLCC (11.51x11.51)
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MT9172AP1 Microchip Technology
5.0 / 5.0 - (49 Ratings)

MT9172AP1

Product Overview

1352044

DiGi Electronics Part Number

MT9172AP1-DG
MT9172AP1

Description

IC TELECOM INTERFACE 28PLCC

Inventory

20912 Pcs New Original In Stock
Telecom IC Subscriber Line Interface Concept (SLIC) 28-PLCC (11.51x11.51)
Telecom
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 1 1047.0900 1047.0900
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MT9172AP1 Technical Specifications

Category Interface, Telecom

Manufacturer Microchip Technology

Packaging -

Series -

Product Status Active

Function Subscriber Line Interface Concept (SLIC)

Interface -

Number of Circuits 1

Voltage - Supply 4.75V ~ 5.25V

Current - Supply 10mA

Operating Temperature -40°C ~ 85°C

Mounting Type Surface Mount

Package / Case 28-LCC (J-Lead)

Supplier Device Package 28-PLCC (11.51x11.51)

Base Product Number MT9172

Datasheet & Documents

HTML Datasheet

MT9172AP1-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Standard Package
37

Reviews

5.0/5.0-(Show up to 5 Ratings)
な***くさ
Dec 02, 2025
5.0
注文から発送までのスピードが抜群です。急ぎの仕事にも最適なサービスです。
古***べ
Dec 02, 2025
5.0
商品ラインナップが豊富で、教育現場で必要なアイテムを一度にそろえることができて助かっています。
Shini***pirit
Dec 02, 2025
5.0
Every purchase from DiGi Electronics has met the highest standards of quality.
Frost***eaves
Dec 02, 2025
5.0
Their packaging integrity is top-notch, preventing any damage during transit.
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Frequently Asked Questions (FAQ)

What are the key design-in risks when integrating the MT9172AP1 SLIC into a new telecommunications line card using surface mount assembly?

When integrating the MT9172AP1 into a new telecom line card, critical design-in risks include proper thermal management due to its 28-PLCC (J-Lead) package, which can be sensitive to uneven heating during reflow. Ensure your PCB layout includes adequate copper planes for heat dissipation and strictly follow the MSL-3 moisture sensitivity guidelines—bake if exposed beyond 168 hours. Also, verify power supply stability: the MT9172AP1 requires a tightly regulated 4.75V–5.25V supply, and noise or ripple above 100mV can disrupt SLIC signaling on the subscriber line. Use local LC filtering near the VCC pin to mitigate this risk.

Can the MT9172AP1 replace the obsolete Legerity 77660-DC in existing exchange equipment, and what board-level modifications are required?

The MT9172AP1 can replace the Legerity 77660-DC in legacy systems, but design adjustments are necessary. While both are single-circuit SLICs in 28-LCC packages, the MT9172AP1 has a lower nominal supply current (10mA vs. 15mA), which affects biasing of off-hook detection circuits. You may need to recalibrate your DC feed sensing resistors on the BORSCHT signal chain. Also, confirm compatibility with existing codec interfaces—although functionally similar, timing characteristics may differ slightly, requiring firmware validation. Always verify with loop simulation under worst-case temperatures (-40°C to 85°C) before full deployment.

How does the MT9172AP1 perform under high-noise or EFT-prone telecom environments, and what PCB layout practices reduce signal integrity risks?

The MT9172AP1 performs reliably in harsh telecom environments, but EFT (Electrical Fast Transient) and inductive kick from relay switching can disrupt its internal biasing. To reduce signal integrity risks, route all analog signal paths (tip, ring, ground) as twisted differential pairs on the PCB with a guard trace connected to AGND. Avoid sharing ground planes between digital and analog sections—use a split plane with a single-point star connection near the MT9172AP1's ground pin. Additionally, install TVS diodes compliant with IEC 61000-4-4 on all line-accessible pins to protect against transient surges that could latch up the device.

What are the trade-offs of selecting the MT9172AP1 over the newer Silicon Labs Si3217x series for new VoIP gateway designs?

Choosing the MT9172AP1 over the Silicon Labs Si3217x involves several trade-offs: the MT9172AP1 is a basic SLIC designed for straightforward line interface applications with minimal integrated BORSCHT functions, while the Si3217x integrates full codecs, DC-DC controllers, and enhanced surge protection—reducing external component count. However, the MT9172AP1 has a proven reliability track record in legacy PBX systems and consumes less active current (10mA), making it suitable for low-power, distributed line cards where thermal density is a concern. Use the MT9172AP1 only if you're already providing external codec and power conversion; otherwise, the Si3217x reduces design complexity and long-term service risk.

What long-term reliability concerns should be evaluated when using the MT9172AP1 in outdoor telecom enclosures exposed to wide temperature swings?

When deploying the MT9172AP1 in outdoor enclosures, long-term reliability hinges on managing thermal cycling stress and moisture ingress due to its MSL-3 rating. Even though it's rated for -40°C to 85°C operation, repeated expansion/contraction can lead to J-lead solder joint fatigue. Use SnAgCu solder and validate joint integrity via accelerated lifecycle testing (e.g., 1000 cycles from -40°C to 85°C). Additionally, conformal coat the PCB to prevent condensation-related leakage currents on the high-impedance analog nodes. Monitor field failure trends closely—Microchip does not provide FIT rates for the MT9172AP1, so empirical data from pilot deployments is critical for assessing field lifespan.

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