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MIC708TMY-TR
Microchip Technology
IC SUPERVISOR 1 CHANNEL 8SOIC
25143 Pcs New Original In Stock
Supervisor Complementary 1 Channel 8-SOIC
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5.0 / 5.0
- (262 Ratings)
MIC708TMY-TR
Product Overview
1344761
DiGi Electronics Part Number
MIC708TMY-TR-DGManufacturer
Microchip Technology
MIC708TMY-TR
Description
IC SUPERVISOR 1 CHANNEL 8SOICInventory
25143 Pcs New Original In Stock
Supervisor Complementary 1 Channel 8-SOIC
Quantity
Minimum 1
Minimum 1
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MIC708TMY-TR Technical Specifications
Category
Power Management (PMIC), Supervisors
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Type
Simple Reset/Power-On Reset
Number of Voltages Monitored
1
Voltage - Threshold
3.08V
Output
Complementary
Reset
Active High/Active Low
Reset Timeout
140ms Minimum
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Supplier Device Package
8-SOIC
Base Product Number
MIC708
Datasheet & Documents
HTML Datasheet
MIC708TMY-TR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
MIC708TMY-DKR
MIC708TMY TR
MIC708TMY TR-DG
MIC708TMY-CT
MIC708TMYTR
MIC708TMYTR-DG
Standard Package
2,500
Alternative Parts
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MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
The delivery was incredibly fast, more so than I expected.
Dec 02, 2025
DiGi Electronics offers outstanding customer support that makes troubleshooting a breeze.
Dec 02, 2025
DiGi Electronics’s support team is consistently professional and effective.
Dec 02, 2025
Their professionalism and efficiency made the entire experience excellent.
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Frequently Asked Questions (FAQ)
What are the key design risks when using the MIC708TMY-TR as a replacement for the MAX708TESA+ in a 3.3V industrial control system?
When replacing the MAX708TESA+ with the MIC708TMY-TR in a 3.3V system, the primary risk lies in threshold voltage mismatch—the MIC708TMY-TR has a fixed reset threshold of 3.08V (±2%), while the MAX708TESA+ typically resets at 3.08V but with tighter tolerance and different hysteresis behavior. This can lead to premature resets during brownout conditions or voltage dips. Additionally, the MIC708TMY-TR’s complementary outputs (active-high and active-low) must be correctly wired to match the logic levels expected by downstream circuitry; misconnection may cause latch-up or incorrect system state on power-up. Always validate timing compatibility, especially if your design relies on the 140ms minimum timeout period during fast power cycling.
Can the MIC708TMY-TR reliably handle noisy power rails in automotive environments, and what external components are needed to mitigate false resets?
The MIC708TMY-TR is rated for -40°C to 85°C operation and is suitable for non-safety automotive applications, but its internal noise immunity is limited compared to dedicated automotive-grade supervisors. On noisy rails (e.g., near motors or relays), false resets can occur due to transient voltage spikes below the 3.08V threshold. To mitigate this, add a 100nF ceramic capacitor directly at the VCC pin and consider a small RC filter (e.g., 1kΩ + 100nF) upstream if ripple exceeds 50mVpp. Avoid long PCB traces to the supervisor input, and ensure ground return paths are low-impedance. For harsh environments, evaluate whether a device with built-in glitch filtering (like the MAX708TCSA+) offers better robustness than the MIC708TMY-TR.
How does the reset timeout behavior of the MIC708TMY-TR impact microcontroller startup sequences, and what happens if the MCU draws high inrush current during power-up?
The MIC708TMY-TR asserts a reset for a minimum of 140ms after VCC exceeds 3.08V, which may be insufficient for microcontrollers that require stable clock initialization or external peripheral configuration before code execution. If the MCU draws high inrush current (e.g., >100mA during flash wake-up), the supply voltage may dip below 3.08V after initially crossing it, causing the MIC708TMY-TR to retrigger—leading to repeated resets or boot failure. To prevent this, ensure your power supply can sustain peak load without drooping below the threshold, or add bulk capacitance (e.g., 10–100µF low-ESR tantalum) near the MCU. Alternatively, consider a supervisor with adjustable timeout or watchdog functionality if precise timing control is critical.
Is the MIC708TMY-TR pin-compatible with the DS1708TESA+, and what functional differences should I verify before swapping in a legacy design?
While both the MIC708TMY-TR and DS1708TESA+ come in 8-SOIC packages and monitor a single voltage, they are not fully pin-compatible due to differing output configurations and feature sets. The DS1708TESA+ includes a manual reset input and battery backup switchover—features absent in the MIC708TMY-TR. If your legacy design relies on the manual reset pin (MR#), direct replacement will fail without circuit modification. Additionally, the DS1708 has a wider operating voltage range (1.2V to 5.5V) versus the MIC708’s effective range starting near 3.3V. Verify that your system doesn’t depend on these extra functions, and re-route the manual reset signal through a GPIO or external pull-up if needed. Always cross-check reset polarity and timeout duration to avoid unintended behavior.
What long-term reliability concerns should I consider when deploying the MIC708TMY-TR in high-temperature industrial applications near its 85°C limit?
Although the MIC708TMY-TR is rated up to 85°C ambient, prolonged operation near this limit accelerates aging of internal comparators and can shift the 3.08V threshold beyond datasheet tolerances, increasing the risk of undervoltage lockout failures. Thermal cycling in industrial settings (e.g., furnace controls or motor drives) may also degrade solder joints in the 8-SOIC package over time. To enhance reliability, maintain adequate PCB copper area under the device for heat dissipation, avoid placing it near heat-generating components, and derate the operating temperature by at least 10°C in mission-critical systems. Consider conformal coating if humidity is present, and perform burn-in testing under worst-case load and temperature conditions to catch early-life failures before field deployment.
Quality Assurance (QC)
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MIC708TMY-TR CAD Models
Microchip Technology MIC708TMY-TR PCB symbols & footprints
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