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ATTINY13A-SFR
Microchip Technology
IC MCU 8BIT 1KB FLASH 8SOIC
1369 Pcs New Original In Stock
AVR AVR® ATtiny Microcontroller IC 8-Bit 20MHz 1KB (512 x 16) FLASH 8-SOIC
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5.0 / 5.0
- (277 Ratings)
ATTINY13A-SFR
Product Overview
1262350
DiGi Electronics Part Number
ATTINY13A-SFR-DGManufacturer
Microchip Technology
ATTINY13A-SFR
Description
IC MCU 8BIT 1KB FLASH 8SOICInventory
1369 Pcs New Original In Stock
AVR AVR® ATtiny Microcontroller IC 8-Bit 20MHz 1KB (512 x 16) FLASH 8-SOIC
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Minimum 1
Minimum 1
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ATTINY13A-SFR Technical Specifications
Category
Embedded, Microcontrollers
Packaging
Tape & Reel (TR)
Series
AVR® ATtiny
Product Status
Active
DiGi-Electronics Programmable
Verified
Core Processor
AVR
Core Size
8-Bit
Speed
20MHz
Connectivity
-
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O
6
Program Memory Size
1KB (512 x 16)
Program Memory Type
FLASH
EEPROM Size
64 x 8
RAM Size
64 x 8
Voltage - Supply (Vcc/Vdd)
1.8V ~ 5.5V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
8-SOIC
Package / Case
8-SOIC (0.209", 5.30mm Width)
Base Product Number
ATTINY13
Datasheet & Documents
HTML Datasheet
ATTINY13A-SFR-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.31.0001
Additional Information
Other Names
ATTINY13A-SFR-DG
ATTINY13ASFR
1611-ATTINY13A-SFRDKR
1611-ATTINY13A-SFRDKRINACTIVE
1611-ATTINY13A-SFRCT
1611-ATTINY13A-SFRTR
1611-ATTINY13A-SFRDKR-DG
ATTINY13A-SFRDKR
1611-ATTINY13A-SFRTR-DG
ATTINY13A-SFRTR
1611-ATTINY13A-SFRTRINACTIVE
ATTINY13A-SFRCT
Standard Package
2,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Responsive support makes troubleshooting easy and stress-free.
Dec 02, 2025
I love how clear and accessible all the product options and details are displayed.
Dec 02, 2025
Their clear and fair pricing makes choosing products a straightforward process.
Dec 02, 2025
I've received excellent after-sales assistance, which demonstrates their commitment to customers.
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Frequently Asked Questions (FAQ)
What are the key design risks when integrating the ATTINY13A-SFR in low-voltage applications near 1.8V, and how can I ensure reliable operation under varying loads?
When using the ATTINY13A-SFR at voltages near its minimum 1.8V supply, the primary risks include reduced noise margin, potential core voltage instability, and slower rise times on I/O pins driving capacitive loads. To mitigate this, use local decoupling with a 100nF ceramic capacitor close to VCC and GND pins, and avoid simultaneously switching multiple I/Os. Also, disable unused peripherals to minimize current spikes, and verify brown-out detection (BOD) levels are set appropriately via fuses to prevent erratic behavior during power-up or brownout conditions. Consider using BOD level 1.8V for robust operation in battery-powered designs where voltage sag is expected.
Can the ATTINY13A-SFR replace a PIC12F510 in an existing design, and what critical limitations should I evaluate before making the switch?
While the ATTINY13A-SFR can functionally replace a PIC12F510 in simple control applications, key limitations must be evaluated: the ATTINY13A-SFR has only 1KB Flash versus 2KB in the PIC12F510, and its 64 bytes of RAM may constrain firmware complexity. Additionally, the PIC12F510 includes a built-in 11-channel 8-bit ADC with flexible reference options, while the ATTINY13A-SFR offers four 10-bit ADC channels but with fewer internal reference choices. You’ll also need to port assembly or C code from MPLAB to AVR-GCC or Microchip Studio. Evaluate code footprint, ADC accuracy needs, and pin compatibility (PIC12F510 is typically in 8-pin PDIP or SOIC vs. 8-SOIC for ATTINY13A-SFR) to ensure mechanical and electrical fit.
How do thermal and electrical stresses at the upper end of the ATTINY13A-SFR operating temperature range (125°C) impact long-term reliability, and what PCB layout practices reduce risk?
At elevated ambient temperatures up to 125°C, the ATTINY13A-SFR can experience accelerated electromigration and increased leakage currents, particularly if self-heating from high-frequency operation or heavy I/O loading is present. To enhance reliability, minimize trace resistance to VCC and GND, use thermal vias under the ground pad if available (though 8-SOIC doesn't typically have one), and derate I/O current to 80% of the 40mA max per pin to avoid localized heating. Ensure adequate spacing around the device for airflow, and avoid placing near heat-generating components like voltage regulators or power MOSFETs. Choosing conservative oscillator settings (e.g., 9.6MHz instead of 20MHz) also reduces internal power dissipation.
What are the trade-offs of using the internal oscillator in the ATTINY13A-SFR versus an external crystal for timing-critical applications like precise PWM generation?
The ATTINY13A-SFR's internal 9.6MHz oscillator (calibrated to ±10%) is sufficient for many PWM and general-purpose timing tasks but introduces timing drift with temperature and supply voltage changes—this can affect PWM frequency stability by up to 5–10% across -40°C to 125°C. For precise timing applications (e.g., motor control or audio modulation), an external crystal would be ideal, but the ATTINY13A-SFR does not support external crystals; it only uses the internal RC oscillator. Therefore, if tighter frequency accuracy is needed, consider upgrading to a pin-compatible device like the ATTINY25 or ATTINY45, which support external crystals. Alternatively, calibrate the internal oscillator via user code during production to reduce error.
When replacing an out-of-stock ATTINY13A-SU with the ATTINY13A-SFR, are there any assembly or handling concerns due to differences in packaging?
Yes, while the ATTINY13A-SU (SOIC) and ATTINY13A-SFR (Tape & Reel version of the same 8-SOIC device) are functionally identical and pin-compatible, the ATTINY13A-SFR comes in tape and reel for automated SMT assembly and has a moisture sensitivity level (MSL) of 3 (168 hours). This means once the reel is opened, devices must be soldered within 168 hours unless stored in a dry cabinet or baked per J-STD-033 guidelines to prevent popcorning during reflow. Manual prototyping or low-volume use requires careful moisture control; use humidity indicator cards and seal leftover reels with desiccant. Also, verify pick-and-place equipment nozzle sizes are compatible with the 5.30mm wide 8-SOIC package to prevent misalignment.
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ATTINY13A-SFR CAD Models
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