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ATSAMD10D14A-UUT
Microchip Technology
IC MCU 32BIT 16KB FLASH 20WLCSP
16707 Pcs New Original In Stock
ARM® Cortex®-M0+ SAM D10D Microcontroller IC 32-Bit Single-Core 48MHz 16KB (16K x 8) FLASH 20-WLCSP (2.43x1.93)
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5.0 / 5.0
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ATSAMD10D14A-UUT
Product Overview
1449104
DiGi Electronics Part Number
ATSAMD10D14A-UUT-DGManufacturer
Microchip Technology
ATSAMD10D14A-UUT
Description
IC MCU 32BIT 16KB FLASH 20WLCSPInventory
16707 Pcs New Original In Stock
ARM® Cortex®-M0+ SAM D10D Microcontroller IC 32-Bit Single-Core 48MHz 16KB (16K x 8) FLASH 20-WLCSP (2.43x1.93)
Quantity
Minimum 1
Minimum 1
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ATSAMD10D14A-UUT Technical Specifications
Category
Embedded, Microcontrollers
Packaging
-
Series
SAM D10D
Product Status
Active
DiGi-Electronics Programmable
Not Verified
Core Processor
ARM® Cortex®-M0+
Core Size
32-Bit Single-Core
Speed
48MHz
Connectivity
I2C, LINbus, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, WDT
Number of I/O
18
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
EEPROM Size
-
RAM Size
4K x 8
Voltage - Supply (Vcc/Vdd)
1.62V ~ 3.63V
Data Converters
A/D 8x12b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Supplier Device Package
20-WLCSP (2.43x1.93)
Package / Case
20-XFBGA, WLCSP
Base Product Number
ATSAMD10
Datasheet & Documents
HTML Datasheet
ATSAMD10D14A-UUT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
3A991A2
HTSUS
8542.31.0001
Additional Information
Other Names
ATSAMD10D14A-UUTDKR
ATSAMD10D14A-UUTCT
ATSAMD10D14A-UUT-DG
ATSAMD10D14A-UUTTR
Standard Package
5,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
アフターサービスの質が高く、安心して利用できます。
Dec 02, 2025
DiGi Electronics offers an incredible variety of products, making it easy to find exactly what I need.
Dec 02, 2025
They provide reliable, high-quality products at prices that are accessible.
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Frequently Asked Questions (FAQ)
Can the ATSAMD10D14A-UUT be safely used to replace an STM32G031K8T6 in a low-power sensor node design, and what are the key integration risks?
Replacing the STM32G031K8T6 with the ATSAMD10D14A-UUT is technically feasible due to similar core architecture (ARM Cortex-M0+) and voltage range (1.62V–3.63V), but critical differences exist. The ATSAMD10D14A-UUT has only 16KB Flash and 4KB RAM versus 64KB/8KB on the STM32G031K8T6, which may require code optimization or feature reduction. Additionally, the 20-WLCSP package (2.43x1.93mm) demands tighter PCB layout tolerances and advanced reflow profiling compared to the LQFP-32 of the STM32. Ensure your toolchain supports Atmel START or MPLAB X for configuration, as peripheral register mapping differs significantly. Always validate brown-out detection thresholds and sleep current in your actual application to avoid unexpected resets or battery drain.
What are the main design constraints when using the ATSAMD10D14A-UUT in a battery-powered IoT device operating down to 1.8V?
The ATSAMD10D14A-UUT supports operation down to 1.62V, making it suitable for single-cell Li-ion or 2xAA alkaline systems, but several constraints apply. First, the internal oscillator accuracy degrades near the lower voltage limit, potentially affecting UART/I2C timing—consider using an external crystal if communication reliability is critical. Second, ADC performance (8x12b) drops in resolution and linearity below 2.0V; calibrate or oversample if precision measurements are needed. Third, Flash write operations require a stable VDD above 2.7V—avoid programming non-volatile data during low-battery conditions. Always implement a robust power management strategy with voltage monitoring via the built-in BOD to prevent corruption during brown-out events.
How does the ATSAMD10D14A-UUT compare to the newer ATSAMD21E16B-U for industrial control applications requiring higher reliability and more peripherals?
While both are ARM Cortex-M0+ MCUs from Microchip, the ATSAMD21E16B-U offers significant advantages for industrial control: 64KB Flash, 8KB RAM, more I/O (30 vs. 18), additional SERCOM modules for flexible UART/SPI/I2C, and a wider operating temperature range (-40°C to 105°C). The ATSAMD10D14A-UUT is limited by its 16KB Flash and 4KB RAM, which can constrain RTOS usage or complex state machines. However, the ATSAMD10D14A-UUT’s ultra-small 20-WLCSP package and lower cost make it ideal for space-constrained, cost-sensitive designs where functionality fits within its limits. For mission-critical industrial applications, the ATSAMD21E16B-U provides better long-term scalability and fault tolerance, though at a higher BOM and board complexity cost.
What reliability risks should I consider when designing with the ATSAMD10D14A-UUT in high-humidity environments, given its MSL 3 rating?
The ATSAMD10D14A-UUT has an MSL 3 (Moisture Sensitivity Level 3) rating, meaning it can be exposed to ambient conditions for up to 168 hours after dry packing before requiring baking. In high-humidity environments, this increases the risk of popcorning during reflow if moisture ingress occurs. To mitigate, store the devices in sealed dry bags with desiccant until assembly, and follow IPC/JEDEC J-STD-033 guidelines for handling. Post-assembly, consider conformal coating to protect the WLCSP package from condensation, especially since the tiny solder joints are more vulnerable to electrochemical migration. Also, ensure your PCB finish (e.g., ENIG or OSP) is compatible with long-term humidity exposure to prevent pad corrosion that could weaken connections to the ATSAMD10D14A-UUT.
Is it safe to run the ATSAMD10D14A-UUT at 48MHz continuously in an enclosure with ambient temperatures reaching 80°C, and what thermal design practices are recommended?
The ATSAMD10D14A-UUT is rated for operation up to 85°C ambient, so running at 48MHz in an 80°C environment is within specification—but marginal. At high temperatures, leakage current increases, potentially pushing total power dissipation beyond safe limits, especially in the compact 20-WLCSP package with limited thermal dissipation. To ensure reliability, provide a solid ground plane beneath the device to act as a heat spreader, and avoid enclosing the MCU in thermally insulated areas. Monitor junction temperature using the internal temperature sensor (if calibrated) or external thermocouple during prototyping. If sustained high-load operation is expected, consider reducing clock speed dynamically or adding minimal airflow. Long-term exposure near Tj(max) may accelerate electromigration and reduce lifespan, so derating or thermal relief design is strongly advised.
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ATSAMD10D14A-UUT CAD Models
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