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AT30TS75A-XM8M-T
Microchip Technology
SENSOR DIGITAL -55C-125C 8MSOP
18273 Pcs New Original In Stock
Temperature Sensor Digital, Local -55°C ~ 125°C 11 b 8-TSSOP/MSOP
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5.0 / 5.0
- (484 Ratings)
AT30TS75A-XM8M-T
Product Overview
1279470
DiGi Electronics Part Number
AT30TS75A-XM8M-T-DGManufacturer
Microchip Technology
AT30TS75A-XM8M-T
Description
SENSOR DIGITAL -55C-125C 8MSOPInventory
18273 Pcs New Original In Stock
Temperature Sensor Digital, Local -55°C ~ 125°C 11 b 8-TSSOP/MSOP
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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AT30TS75A-XM8M-T Technical Specifications
Category
Temperature Sensors, Analog and Digital Output
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Sensor Type
Digital, Local
Sensing Temperature - Local
-55°C ~ 125°C
Sensing Temperature - Remote
-
Output Type
I2C/SMBus
Voltage - Supply
1.7V ~ 5.5V
Resolution
11 b
Features
One-Shot, Output Switch, Programmable Limit, Programmable Resolution, Shutdown Mode
Accuracy - Highest (Lowest)
±1°C (±3°C)
Test Condition
0°C ~ 85°C (-40°C ~ 120°C)
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package
8-TSSOP/MSOP
Base Product Number
AT30TS75
Datasheet & Documents
HTML Datasheet
AT30TS75A-XM8M-T-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
1611-AT30TS75A-XM8M-TTR-DG
1611-AT30TS75A-XM8M-TDKR
AT30TS75A-XM8M-TDKR
1611-AT30TS75A-XM8M-TCT-DG
1611-AT30TS75A-XM8M-TTRINACTIVE
1611-AT30TS75A-XM8M-TDKR-DG
1611-AT30TS75A-XM8M-TCTINACTIVE
1611-AT30TS75A-XM8M-TTR
AT30TS75A-XM8M-TTR
AT30TS75A-XM8M-TCT
1611-AT30TS75A-XM8M-TCT
1611-AT30TS75A-XM8M-TDKRINACTIVE
Standard Package
5,000
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
ディジエレクトロニクスの製品は価格が安いのに、長持ちするので助かっています。
Dec 02, 2025
Their pricing is very competitive, making high-quality support affordable.
Dec 02, 2025
DiGi Electronics ensures a hassle-free shopping experience through stable delivery.
Dec 02, 2025
DiGi Electronics truly values their customers with competitive prices and excellent support.
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Frequently Asked Questions (FAQ)
Can I replace a TMP117 or MAX31865 with the AT30TS75A-XM8M-T in a precision industrial temperature monitoring system without redesigning the I2C interface or firmware?
No, direct replacement is not recommended due to significant architectural differences. The TMP117 offers ±0.1°C accuracy and 16-bit resolution, while the MAX31865 is a dedicated RTD-to-digital converter—neither matches the AT30TS75A-XM8M-T’s 11-bit resolution and ±1°C accuracy over 0°C to 85°C. Although all three support I2C, the AT30TS75A-XM8M-T lacks built-in cold-junction compensation and has different register maps and timing requirements. Firmware would need substantial modification, and system-level accuracy would degrade. For drop-in compatibility with higher precision, consider the AT30TS750A instead.
What are the key reliability risks when using the AT30TS75A-XM8M-T in high-vibration automotive under-hood applications near its -55°C to 125°C operating limit?
The primary risks stem from thermal cycling and mechanical stress on the 8-MSOP package, which has limited solder joint robustness under continuous vibration. At temperature extremes—especially near -40°C and 125°C—CTE mismatches between the PCB and package can induce fatigue cracks. Mitigate this by using a high-Tg PCB material, conformal coating, and strain relief in layout (e.g., avoid routing traces perpendicular to package edges). Also, ensure the MSL3 rating is respected during assembly; exposure beyond 168 hours at >85% RH requires baking to prevent popcorning during reflow.
How does the programmable resolution feature of the AT30TS75A-XM8M-T impact power consumption and conversion time in battery-powered IoT edge devices?
Lowering the resolution from 11-bit to 9-bit reduces conversion time from ~220 ms to ~55 ms and cuts average current during active conversion by approximately 40%, significantly extending battery life in duty-cycled applications. However, this trades off temperature granularity (±0.5°C at 11-bit vs. ±2°C at 9-bit), which may affect control loop stability in precision thermal management. Use one-shot mode with shutdown between readings to minimize quiescent current (<0.5 µA), and dynamically adjust resolution based on application phase—e.g., high resolution during calibration, low during idle monitoring.
Is the AT30TS75A-XM8M-T suitable for replacing an analog thermistor circuit in a medical device requiring IEC 60601-1 compliance, and what design constraints must be addressed?
Yes, but with critical constraints. The digital output simplifies isolation and reduces noise susceptibility compared to analog thermistors, aiding compliance with IEC 60601-1 leakage and EMI requirements. However, the AT30TS75A-XM8M-T lacks medical-grade qualification (e.g., AEC-Q100 or ISO 13485), so full system-level validation is required. Ensure the I2C bus is isolated using digital isolators (e.g., Si86xx series), and validate long-term drift over the full -55°C to 125°C range—datasheet accuracy is only guaranteed from -40°C to 120°C. Also, implement redundant limit checking in firmware since the internal comparator may not meet single-fault safety requirements alone.
What layout and grounding practices are essential to maintain ±1°C accuracy when integrating the AT30TS75A-XM8M-T on a mixed-signal PCB with switching regulators nearby?
To preserve accuracy, place the AT30TS75A-XM8M-T away from high-di/dt paths (e.g., inductor and switch nodes of DC-DC converters) and use a solid ground plane beneath the device with a single-point connection to the analog ground net. Route I2C lines with controlled impedance and guard them with grounded traces if running parallel to noisy signals. Power the sensor directly from a clean LDO (not the switcher output) and include a 100 nF ceramic capacitor within 2 mm of the VDD pin. Avoid thermal vias under the package that could create unintended heat sinks, as this skews local temperature readings—especially critical near the 125°C upper limit where self-heating effects become non-negligible.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
AT30TS75A-XM8M-T CAD Models
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