Counterfeit and defect prevention
Visual and packaging inspection
Electrical performance verification
Service Email:
[email protected]
>
US1MF
MDD
DIODE GEN PURP 1KV 1A SMAF
125203 Pcs New Original In Stock
Diode 1000 V 1A Surface Mount SMAF
Request Quote
(Ships tomorrow)
*Quantity
Minimum 1
Minimum 1
5.0 / 5.0
- (145 Ratings)
US1MF
Product Overview
12959279
DiGi Electronics Part Number
US1MF-DGManufacturer
MDD
US1MF
Description
DIODE GEN PURP 1KV 1A SMAFInventory
125203 Pcs New Original In Stock
Diode 1000 V 1A Surface Mount SMAF
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
How to Order
Shipping & Delivery
Quality Assurance
365 - Day Quality Guarantee - Every part fully backed.
90 - Day Refund or Exchange - Defective parts? No hassle.
Limited Stock, Order Now - Get reliable parts without worry.
Global Shipping & Secure Packaging
Worldwide Delivery in 3-5 Business Days
100% ESD Anti-Static Packaging
Real-Time Tracking for Every Order
Secure & Flexible Payment
Credit Card, VISA, MasterCard, PayPal, Western Union, Telegraphic Transfer(T/T) and more
All payments encrypted for security
US1MF Technical Specifications
Category
Diodes, Rectifiers, Single Diodes
Packaging
Tape & Reel (TR)
Series
SMAF
Product Status
Active
Technology
Standard
Voltage - DC Reverse (Vr) (Max)
1000 V
Current - Average Rectified (Io)
1A
Voltage - Forward (Vf) (Max) @ If
1.7 V @ 1 A
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
75 ns
Current - Reverse Leakage @ Vr
5 µA @ 1000 V
Capacitance @ Vr, F
15pF @ 4V, 1MHz
Mounting Type
Surface Mount
Package / Case
DO-221AC, SMA Flat Leads
Supplier Device Package
SMAF
Operating Temperature - Junction
-55°C ~ 150°C
Datasheet & Documents
Datasheets
Download US1MF Product Specification (PDF)
HTML Datasheet
US1MF-DG
Environmental & Export Classification
RoHS Status
RoHS Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
3372-US1MFTR
Standard Package
12,000
Alternative Parts
PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
DiGi Electronics consistently delivers products on time, which greatly helps our project timelines stay on track.
Dec 02, 2025
Customer service staff are knowledgeable and ready to assist with detailed info.
Dec 02, 2025
Their prices are always fair and reasonable for large orders.
Publish Evalution
Evalution Message
Please enter your review message.
Please post honest comments and do not post ilegal comments.
Frequently Asked Questions (FAQ)
What are the key thermal design considerations when using the US1MF diode in a high-temperature environment near its 150°C junction limit?
When operating the US1MF diode near its maximum junction temperature of 150°C, adequate PCB thermal management is critical. Ensure at least 25 mm² of copper pad area for thermal dissipation, preferably connected to a ground plane. Avoid placing the US1MF near other heat-generating components like MOSFETs or inductors. Monitor actual junction temperature under load using thermal imaging or IR testing, especially in enclosed or non-ventilated enclosures. Derate the average rectified current (Io) by 10–15% above 100°C ambient to prevent thermal runaway, particularly in high-trr recovery scenarios where switching losses increase.
Can the US1MF replace the MUR160 in a flyback converter, and what are the performance trade-offs?
Yes, the US1MF can replace the MUR160 in low-current flyback converters (≤1A), but with important trade-offs. While both are 1A, 1000V SMAF-packaged diodes, the MUR160 has a faster trr (50ns vs. 75ns for the US1MF) and a lower Vf (1.3V vs. 1.7V max), leading to higher conduction and switching losses with the US1MF. This can reduce efficiency by 2–4% in continuous conduction mode (CCM) designs. Use the US1MF only if cost or availability outweighs efficiency needs, or in discontinuous conduction mode (DCM) where trr impact is reduced.
How does the 75ns reverse recovery time of the US1MF affect EMI in SMPS designs, and how can it be mitigated?
The 75ns trr of the US1MF can contribute to voltage overshoot and EMI in switch-mode power supplies due to the sudden cessation of reverse current. This is most visible during MOSFET turn-on, where diode recovery induces ringing on the drain node. To mitigate EMI, place a low-inductance RC snubber (e.g., 10Ω + 100pF) across the primary winding or use a TVS diode on the drain. Avoid using the US1MF in high-frequency (>100kHz) hard-switching topologies; instead, consider ultrafast alternatives like the UF1J or SB1100 if EMI compliance is tight.
Is the US1MF suitable for use in a bridge rectifier circuit in a 90–265VAC input power supply, and what derating factors should be applied?
Yes, the US1MF is suitable for bridge rectifiers in universal AC input (90–265VAC) supplies when current demands are ≤1A RMS. However, derating is essential for reliability. Limit continuous forward current to 0.7A at ambient temperatures above 85°C. Voltage derating should apply 20% margin—while the US1MF handles 1000V peak, ensure line surges (per IEC 61000-4-5) don't exceed 800V. Use transient protection like a 275V MOV. Monitor leakage current (5μA @ 1000V), which can increase with temperature and affect standby power in energy-sensitive designs.
What are the PCB layout best practices for ensuring reliable surface mount assembly of the US1MF diode?
For reliable US1MF assembly, follow IPC-7095 guidelines for surface mount diodes: Use symmetric thermal pads (SMAF footprint) with 0.5mm solder mask dams to prevent tombstoning. Ensure reflow profiles comply with MSL-1 requirements—peak temperature <260°C for ≤30 seconds. Maintain 3mm creepage and clearance distances on the PCB to handle 1000V isolation safely. Avoid placing vias in thermal pads unless thermally connected to ground planes. Inspect post-reflow for proper wetting and voiding (<25% per IPC-A-610) to ensure long-term thermal and mechanical reliability.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
US1MF CAD Models
MDD US1MF PCB symbols & footprints
productDetail
