SS24B >
SS24B
MDD
DIODE SCHOTTKY 40V 2A SMB
10482 Pcs New Original In Stock
Diode 40 V 2A Surface Mount SMB
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SS24B
5.0 / 5.0 - (399 Ratings)

SS24B

Product Overview

12997659

DiGi Electronics Part Number

SS24B-DG

Manufacturer

MDD
SS24B

Description

DIODE SCHOTTKY 40V 2A SMB

Inventory

10482 Pcs New Original In Stock
Diode 40 V 2A Surface Mount SMB
Quantity
Minimum 1

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In Stock (All prices are in USD)
  • QTY Target Price Total Price
  • 20 0.0113 0.2260
  • 200 0.0111 2.2200
  • 600 0.0109 6.5400
  • 3000 0.0108 32.4000
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SS24B Technical Specifications

Category Diodes, Rectifiers, Single Diodes

Manufacturer

Packaging Tape & Reel (TR)

Series SMB

Product Status Active

Technology Schottky

Voltage - DC Reverse (Vr) (Max) 40 V

Current - Average Rectified (Io) 2A

Voltage - Forward (Vf) (Max) @ If 550 mV @ 2 A

Speed -

Capacitance @ Vr, F 220pF @ 4V, 1MHz

Mounting Type Surface Mount

Package / Case DO-214AA, SMB

Supplier Device Package SMB

Operating Temperature - Junction -50°C ~ 125°C

Datasheet & Documents

HTML Datasheet

SS24B-DG

Environmental & Export Classification

RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Additional Information

Other Names
3372-SS24BTR
Standard Package
6,000

Alternative Parts

PART NUMBER
MANUFACTURER
QUANTITY AVAILABLE
DiGi PART NUMBER
UNIT PRICE
SUBSTITUTE TYPE
SK24-TP
Micro Commercial Co
1158
SK24-TP-DG
0.0104
Parametric Equivalent
SS24B-HF
Comchip Technology
755
SS24B-HF-DG
0.0104
Parametric Equivalent

Reviews

5.0/5.0-(Show up to 5 Ratings)
悠***山
Dec 02, 2025
5.0
他們的顧客服務超越期待,處理問題速度很快!
Étoile***llante
Dec 02, 2025
5.0
Un service qui tient ses promesses, je suis très satisfait.
まつぼ***の約束
Dec 02, 2025
5.0
対応が素早く、丁寧で安心できました。配送も非常にスピーディでした。
Lus***lley
Dec 02, 2025
5.0
Their support team handled my urgent request efficiently and professionally.
Sereni***eekers
Dec 02, 2025
5.0
Their suppliers and logistics partners seem well-coordinated, ensuring timely deliveries.
Bri***Nest
Dec 02, 2025
5.0
The packaging materials used by DiGi Electronics are of high quality and durable.
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Frequently Asked Questions (FAQ)

What are the key thermal and layout considerations when designing in the SS24B Schottky diode for high-current switching applications, and how can I prevent localized overheating on a compact PCB?

When designing with the SS24B, prioritize thermal management due to its 2A average rectified current and 550 mV forward voltage drop at full load—this generates approximately 1.1W of heat under worst-case conditions. Use a solid ground plane beneath the SMB package and include multiple thermal vias to dissipate heat into inner or bottom layers. Ensure adequate copper pour around the anode and cathode pads (minimum 200 mm² total) to act as a heatsink. Avoid placing heat-sensitive components within 5 mm of the SS24B, and consider derating the current by 20% if ambient temperatures exceed 85°C to maintain junction temperatures below 125°C and ensure long-term reliability.

Can the SS24B safely replace a 1N5822 in a 3A boost converter, and what performance trade-offs should I expect despite both being 40V Schottky diodes?

The SS24B is not recommended as a direct replacement for the 1N5822 in a 3A continuous boost converter. While both are 40V Schottky diodes in SMB packages, the 1N5822 is rated for 3A average forward current, whereas the SS24B is limited to 2A. Operating the SS24B at 3A would push it beyond its safe operating area, leading to excessive junction temperature rise and potential thermal runaway. Even with forced airflow or oversized copper, long-term reliability will be compromised. For 3A applications, consider upgrading to a higher-current alternative like the SS34 (3A, 40V) or STPS3H100V, and revalidate efficiency and thermal performance in your specific topology.

How does the reverse leakage current of the SS24B behave at elevated temperatures, and what impact might this have on battery-powered systems operating in hot environments?

The SS24B exhibits increasing reverse leakage current with temperature—a common trait in Schottky diodes—though exact values aren't specified in the datasheet. Empirical data from similar MDD Schottky diodes suggests leakage can exceed 10 mA at 125°C reverse voltage (40V). In battery-powered systems (e.g., solar charge controllers or IoT edge devices), this elevated leakage significantly increases quiescent power loss, reducing battery life. If your application operates above 85°C ambient, consider using a diode with lower leakage, such as the Vishay VS-20MQ040-M3, or implement a bypass switch to isolate the diode during standby modes to mitigate unnecessary drain.

Is the SS24B suitable for use in a synchronous buck converter’s freewheeling path, or should I stick with ultrafast PN diodes despite its Schottky technology?

The SS24B is generally not ideal for the freewheeling diode role in synchronous buck converters where the low-side MOSFET handles conduction. In such topologies, the body diode of the MOSFET or a dedicated low-side FET is preferred due to faster reverse recovery and lower losses during dead time. While the SS24B has no reverse recovery time (a Schottky advantage), its relatively high junction capacitance (220 pF @ 4V) can contribute to switching losses and ringing at high frequencies (>500 kHz). For non-synchronous designs or low-frequency applications (<200 kHz), the SS24B can be acceptable, but always simulate or prototype to check for voltage spikes and EMI issues caused by parasitic inductance interacting with diode capacitance.

What reliability risks should I consider when using the SS24B in automotive or industrial environments with high vibration and thermal cycling, and how does its MSL rating affect assembly?

The SS24B carries an MSL 1 (Unlimited) rating, meaning it’s immune to moisture-induced failures during reflow and requires no dry packing—ideal for high-volume production. However, in automotive or industrial settings with thermal cycling (-40°C to +125°C) and mechanical vibration, long-term solder joint integrity becomes a concern. The SMB package has lower mechanical robustness compared to larger packages like SMC or TO-252. To mitigate risk, use strain-relief PCB layouts (avoid right-angle traces near pads), apply conformal coating to reduce moisture and vibration stress, and consider underfill if the application exceeds 10G vibration levels. Also, verify that your solder paste profile and reflow settings meet MDD’s recommendations to prevent voiding, which can accelerate fatigue under thermal cycling.

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