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BGS15MU14E6327XTSA1
Infineon Technologies
IC RF SWITCH SP5T 6GHZ ULGA14-1
32298 Pcs New Original In Stock
RF Switch IC General Purpose SP5T 50Ohm PG-ULGA-14-1
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5.0 / 5.0
- (240 Ratings)
BGS15MU14E6327XTSA1
Product Overview
9544752
DiGi Electronics Part Number
BGS15MU14E6327XTSA1-DGManufacturer
Infineon Technologies
BGS15MU14E6327XTSA1
Description
IC RF SWITCH SP5T 6GHZ ULGA14-1Inventory
32298 Pcs New Original In Stock
RF Switch IC General Purpose SP5T 50Ohm PG-ULGA-14-1
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
Warranty & Returns
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BGS15MU14E6327XTSA1 Technical Specifications
Category
RF Switches
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
RF Type
General Purpose
Topology
-
Circuit
SP5T
Frequency Range
400MHz ~ 6GHz
Isolation
48dB
Insertion Loss
1.05dB
Test Frequency
5.925GHz
P1dB
-
IIP3
-
Features
-
Impedance
50Ohm
Voltage - Supply
1.65V ~ 1.95V
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
14-UFLGA Exposed Pad
Supplier Device Package
PG-ULGA-14-1
Base Product Number
BGS15MU14
Datasheet & Documents
HTML Datasheet
BGS15MU14E6327XTSA1-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8542.39.0001
Additional Information
Other Names
448-BGS15MU14E6327XTSA1CT
SP005354435
448-BGS15MU14E6327XTSA1DKR
2156-BGS15MU14E6327XTSA1TR
448-BGS15MU14E6327XTSA1TR
Standard Package
4,500
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
Der Support ist immer hilfsbereit, egal wann ich eine Frage habe.
Dec 02, 2025
DiGi Electronicsの配送はいつも予定通りで安心です。
Dec 02, 2025
The support team is always professional and solution-oriented.
Dec 02, 2025
The company’s price transparency makes it easier to compare and choose their services.
Dec 02, 2025
Excellent after-sales service, with staff patiently answering all my questions post-purchase.
Dec 02, 2025
The logistics department at DiGi Electronics is highly professional, ensuring fast and safe delivery of our orders.
Dec 02, 2025
Delivery was rapid, and the items were packaged securely, safeguarding them from any damage.
Dec 02, 2025
I appreciate the great balance of quality and affordability that DiGi Electronics delivers.
Dec 02, 2025
Their prompt delivery and rapid response times make shopping with them very enjoyable.
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Frequently Asked Questions (FAQ)
What are the key reliability and thermal considerations when designing in the BGS15MU14E6327XTSA1 RF switch in a compact 5G mmWave front-end module operating near 6GHz?
When integrating the BGS15MU14E6327XTSA1 into high-density 5G mmWave designs, thermal management is critical despite its low insertion loss of 1.05dB at 5.925GHz. The exposed pad in the PG-ULGA-14-1 package must be properly soldered to a grounded thermal plane to maintain junction temperature within the -40°C to 85°C operating range. Poor pad soldering can lead to localized heating, degrading isolation (rated at 48dB) and accelerating electromigration. Additionally, ensure minimal trace inductance on the RF paths to avoid impedance mismatches that increase effective insertion loss under load, especially when switching between antenna paths in dynamic environments.
Can the BGS15MU14E6327XTSA1 be used as a drop-in replacement for the SKY13322-375LF in a 4G/5G sub-6GHz diversity receiver path, and what layout adjustments are needed?
While both the BGS15MU14E6327XTSA1 and SKY13322-375LF are SP5T RF switches covering similar frequency ranges, they are not direct pin-for-pin replacements due to differences in package footprint and control logic. The BGS15MU14E6327XTSA1 uses a 1.65V–1.95V supply and requires re-evaluation of bias circuitry if the existing design runs at 3.3V. More critically, the PG-ULGA-14-1 package has a smaller footprint and different pad geometry than the QFN-style SKY13322-375LF, necessitating PCB layout changes. Ensure 50Ω-controlled impedance routing and minimize stub lengths to preserve isolation performance, especially above 3GHz where parasitic effects become pronounced.
How does the BGS15MU14E6327XTSA1 perform under high-channel-count MIMO configurations, and what are the risks of crosstalk between adjacent ports?
In high-channel-count MIMO systems (e.g., 4x4 or 8x8), the BGS15MU14E6327XTSA1’s 48dB isolation helps mitigate crosstalk, but real-world performance depends heavily on PCB layout. Adjacent RF traces should maintain at least 3x the trace width spacing and use ground shielding vias between ports to prevent coupling, particularly near 5–6GHz where wavelength shrinks. Without proper isolation techniques, signal leakage can degrade receiver sensitivity. Also, simultaneous switching of multiple paths may induce supply voltage droop—decouple the VDD pin with a 100nF ceramic capacitor placed within 1mm of the package to maintain stable operation.
What design trade-offs should be considered when using the BGS15MU14E6327XTSA1 in battery-powered IoT devices requiring ultra-low standby current?
The BGS15MU14E6327XTSA1 is well-suited for battery-powered IoT applications due to its low control current and compatibility with 1.8V logic, but designers must account for leakage current during power-down modes. Although not explicitly specified in the datasheet, typical CMOS-based switches like this exhibit nanoamp-level leakage that can accumulate in multi-switch arrays. To minimize drain, ensure the control lines are driven to valid logic levels (not left floating) and consider adding a weak pull-down resistor if the MCU GPIO enters high-impedance state during sleep. Also, verify that the 1.65V minimum supply aligns with your system’s low-battery cutoff to avoid undefined switching behavior.
Is the BGS15MU14E6327XTSA1 suitable for automotive-grade RF switching applications, and what qualification gaps exist despite its -40°C to 85°C rating?
While the BGS15MU14E6327XTSA1 operates across the industrial temperature range (-40°C to 85°C), it is not AEC-Q100 qualified and therefore not recommended for safety-critical automotive applications like V2X or in-cabin radar. The absence of automotive-grade screening means potential variability in long-term reliability under thermal cycling, humidity, and vibration. For non-safety telematics or infotainment systems, it may be acceptable—but always validate performance across full temperature extremes with production-like assembly. Additionally, confirm moisture sensitivity level (MSL 1) allows for unlimited floor life, reducing rework risk in high-volume manufacturing.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
BGS15MU14E6327XTSA1 CAD Models
Infineon Technologies BGS15MU14E6327XTSA1 PCB symbols & footprints
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