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3401
Goford Semiconductor
MOSFET P-CH 30V 4.2A SOT-23
300117 Pcs New Original In Stock
P-Channel 30 V 4.2A (Tc) 1.2W (Tc) Surface Mount SOT-23-3
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3401
Product Overview
12949102
DiGi Electronics Part Number
3401-DGManufacturer
Goford Semiconductor
3401
Description
MOSFET P-CH 30V 4.2A SOT-23Inventory
300117 Pcs New Original In Stock
P-Channel 30 V 4.2A (Tc) 1.2W (Tc) Surface Mount SOT-23-3
Quantity
Minimum 1
Minimum 1
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3401 Technical Specifications
Category
Transistors, FETs, MOSFETs, Single FETs, MOSFETs
Packaging
Tape & Reel (TR)
Series
TrenchFET®
Product Status
Active
FET Type
P-Channel
Technology
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)
30 V
Current - Continuous Drain (Id) @ 25°C
4.2A (Tc)
Drive Voltage (Max Rds On, Min Rds On)
4.5V, 10V
Rds On (Max) @ Id, Vgs
55mOhm @ 4A, 10V
Vgs(th) (Max) @ Id
1.3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs
9.5 nC @ 4.5 V
Vgs (Max)
±12V
Input Capacitance (Ciss) (Max) @ Vds
950 pF @ 15 V
FET Feature
Standard
Power Dissipation (Max)
1.2W (Tc)
Operating Temperature
-55°C ~ 150°C (TJ)
Mounting Type
Surface Mount
Supplier Device Package
SOT-23-3
Package / Case
TO-236-3, SC-59, SOT-23-3
Datasheet & Documents
Datasheets
Download 3401 Product Specification (PDF)
HTML Datasheet
3401-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
3 (168 Hours)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8541.29.0095
Additional Information
Other Names
3141-3401TR
3141-3401CT
4822-3401TR
3141-3401DKR
Standard Package
3,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
他們的客服團隊每次都禮貌又專業，讓人感受到溫暖的服務。
Dec 02, 2025
品質の安定性が素晴らしく、毎回期待通りの製品が届きます。
Dec 02, 2025
The clarity of pricing reflects their commitment to honesty and transparency.
Dec 02, 2025
DiGi Electronics prioritizes customer support, making us feel valued.
Dec 02, 2025
Excellent packaging that minimizes damage risk during shipping.
Dec 02, 2025
Their reliable delivery schedule is a crucial advantage for my fast-paced electronics projects.
Dec 02, 2025
I’ve found their online platform very accessible, with great cost benefits.
Dec 02, 2025
DiGi Electronics' prompt shipping has helped me avoid unnecessary delays in servicing my clients' devices.
Dec 02, 2025
Their commitment to excellence in support makes me trust their brand even more.
Dec 02, 2025
Their pricing strategy makes high-quality electronics accessible to everyone.
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Frequently Asked Questions (FAQ)
Can the Goford Semiconductor 3401 P-Channel MOSFET safely replace an Infineon BSS84 in a low-side switching application with a 3.3V microcontroller drive, and what design risks should I consider?
The Goford Semiconductor 3401 can replace the Infineon BSS84 in low-side switching, but with caution: while both are P-channel SOT-23 MOSFETs rated for 30V, the 3401 has a higher Rds(on) of 55mΩ @ 10V (vs. BSS84’s ~80mΩ @ -4.5V), but critically, its Vgs(th) max is 1.3V, making it more suitable for 3.3V logic drive. However, at 3.3V Vgs, Rds(on) will be significantly higher than at 10V—check the transfer curves. Ensure your load current stays within thermal limits given the 1.2W package dissipation. Also verify gate drive strength; the 3401’s 9.5nC Qg is manageable but may require a gate resistor to dampen ringing in high-di/dt scenarios.
What thermal management strategies are necessary when using the Goford Semiconductor 3401 in a compact PCB layout with continuous 3A load current near its 4.2A rating?
At 3A continuous, the Goford Semiconductor 3401 will dissipate approximately 0.5W (P = I² × Rds(on) ≈ 3² × 0.055), approaching 42% of its 1.2W limit—requiring careful thermal design. Use a solid ground plane under the SOT-23-3 package and add thermal vias to inner or bottom copper layers to improve heat spreading. Avoid placing heat-sensitive components nearby. Monitor junction temperature: even with modest ambient temps, localized heating can push TJ toward 125°C+, reducing long-term reliability. Consider derating to 2.5A for industrial applications to maintain >50°C margin below Tj(max).
How does the Goford Semiconductor 3401 compare to the Diodes Incorporated DMG2301LK in terms of switching speed and EMI performance in a 100kHz buck converter?
The Goford Semiconductor 3401 has slightly higher input capacitance (950pF vs. DMG2301LK’s ~750pF) and comparable gate charge (9.5nC vs. ~8nC), resulting in marginally slower turn-on/off times. In a 100kHz buck converter, this increases switching losses and may elevate EMI, especially if dead-time control is tight. The 3401’s lower Vgs(th) helps with 3.3V compatibility, but the DMG2301LK offers better optimized switching behavior for high-frequency DC-DC. If EMI is critical, add a small gate resistor (2–10Ω) with the 3401 to control dv/dt and use snubbers if voltage spikes exceed 25V.
Is the Goford Semiconductor 3401 reliable for automotive 12V battery reverse-polarity protection given its MSL 3 rating and -55°C to 150°C operating range?
The Goford Semiconductor 3401 meets basic temperature requirements for automotive underhood use, but MSL 3 (168-hour floor life) demands strict handling—bake per J-STD-033 if exposed >168 hours post-reflow. More critically, in reverse-polarity protection, the body diode conducts during fault, potentially exceeding safe operating area (SOA) if input voltage surges (e.g., load dump >36V). The 30V Vdss leaves minimal margin; consider a TVS diode upstream. Also, verify long-term reliability under thermal cycling—SOT-23 packages are prone to solder joint fatigue in vibration-heavy environments. For mission-critical systems, prefer AEC-Q101 qualified alternatives like Vishay SI2301.
What layout precautions are essential when paralleling two Goford Semiconductor 3401 MOSFETs to achieve higher current capacity in a space-constrained design?
Paralleling Goford Semiconductor 3401 devices requires symmetrical PCB layout to ensure current sharing: place both devices close together with identical trace lengths from source to load and gate to driver. Use a common gate resistor (or individual 1–5Ω resistors) to prevent oscillation due to mismatched gate thresholds. Ensure shared thermal coupling—mount on the same copper pour—to balance temperatures, as Rds(on) decreases with heating, promoting thermal runaway in unbalanced setups. Even with matching, expect ~10–15% current imbalance; do not exceed 7A total (vs. 8.4A theoretical). Validate with thermal imaging under load, and avoid paralleling if fault tolerance isn’t designed-in.
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3401 CAD Models
Goford Semiconductor 3401 PCB symbols & footprints
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