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MM3Z9V1
Diotec Semiconductor
ZENER SOD323F 9.1V 0.3W 5%
80227 Pcs New Original In Stock
Zener Diode 9.1 V 300 mW ±5% Surface Mount SOD-323
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5.0 / 5.0
- (375 Ratings)
MM3Z9V1
Product Overview
12945046
DiGi Electronics Part Number
MM3Z9V1-DGManufacturer
Diotec Semiconductor
MM3Z9V1
Description
ZENER SOD323F 9.1V 0.3W 5%Inventory
80227 Pcs New Original In Stock
Zener Diode 9.1 V 300 mW ±5% Surface Mount SOD-323
Quantity
Minimum 1
Minimum 1
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MM3Z9V1 Technical Specifications
Category
Diodes, Zener, Single Zener Diodes
Packaging
-
Series
-
Product Status
Active
Voltage - Zener (Nom) (Vz)
9.1 V
Tolerance
±5%
Power - Max
300 mW
Impedance (Max) (Zzt)
15 Ohms
Current - Reverse Leakage @ Vr
500 nA @ 6 V
Voltage - Forward (Vf) (Max) @ If
1 V @ 10 mA
Operating Temperature
-50°C ~ 150°C (TJ)
Mounting Type
Surface Mount
Package / Case
SC-90, SOD-323F
Supplier Device Package
SOD-323
Datasheet & Documents
Datasheets
Download MM3Z9V1 Product Specification (PDF)
HTML Datasheet
MM3Z9V1-DG
Environmental & Export Classification
RoHS Status
Not applicable
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8541.10.0000
Additional Information
Other Names
2796-MM3Z9V1TR
Standard Package
3,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
가격이 저렴하고 품질도 안정적이라 만족스럽습니다.
Dec 02, 2025
가격이 뛰어나서 여러 번 구매했어요. 배송도 빨라서 필수품을 빠르게 받을 수 있었습니다.
Dec 02, 2025
Their responsiveness after purchase is top-notch, which builds great trust.
Dec 02, 2025
DiGi Electronics's packaging not only protects the products well but also looks quite premium.
Dec 02, 2025
I love how the website layout is designed to make shopping quick and easy.
Dec 02, 2025
Their post-sale support services are thorough and very responsive.
Dec 02, 2025
Their delivery turnaround is remarkable, ensuring minimal wait times.
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Frequently Asked Questions (FAQ)
Can the MM3Z9V1 Zener diode be used as a reliable voltage reference in a low-power sensor circuit operating at 3.3V with tight ±3% accuracy requirements?
The MM3Z9V1 is not ideal for precision voltage reference applications due to its ±5% tolerance and relatively high dynamic impedance of 15 Ω, which can introduce significant voltage deviation under varying load currents. In a 3.3V system, even minor fluctuations in current draw may cause the 9.1V Zener to regulate poorly when used in a voltage divider or shunt configuration. For ±3% accuracy, consider a dedicated low-dropout regulator (LDO) or a precision reference like the TL431 (adjustable) or LM4040-3.3 (fixed 3.3V, ±0.5%). If space-constrained and a Zener must be used, pair the MM3Z9V1 with an op-amp buffer to isolate load variations, but expect compromised long-term stability due to temperature drift and aging effects inherent in general-purpose Zeners.
Is it safe to replace a BZX384-B9V1 (Nexperia) with the MM3Z9V1 in a 12V automotive input protection circuit, and what are the key reliability risks?
While both the MM3Z9V1 (Diotec) and BZX384-B9V1 (Nexperia) are 9.1V, 300mW Zener diodes in SOD-323 packages, direct replacement carries reliability risks in automotive environments. The BZX384 series is qualified to AEC-Q101 and rated for -55°C to +150°C, with tighter parametric controls and better surge robustness. The MM3Z9V1, though specified from -50°C to 150°C, lacks explicit AEC-Q101 certification, making it unsuitable for under-hood or safety-critical applications. Additionally, reverse leakage current (500 nA @ 6V for MM3Z9V1) may increase under high ambient temperatures, potentially affecting quiescent current in always-on circuits. For non-critical body electronics with limited thermal stress, substitution may work, but for engine control or battery monitoring, stick with AEC-qualified alternatives.
How does the MM3Z9V1 perform under repetitive transient voltage spikes in an industrial 24V control panel, and what derating guidelines should be followed?
The MM3Z9V1 is rated for 300mW continuous power dissipation, but transient spikes common in 24V industrial systems (e.g., inductive load switching) can easily exceed this if not properly clamped. With a Zener impedance of 15 Ω, even short-duration overvoltage events can cause localized heating beyond safe limits. To ensure reliability, derate power handling by at least 50% in high-noise environments—limit steady-state dissipation to ≤150mW. Use a series resistor (e.g., 100–470Ω) to limit surge current and consider adding a TVS diode (e.g., SMAJ33A) in parallel for multi-kV transient suppression. Without such protection, repeated transients may cause premature failure due to thermal cycling or Zener degradation, especially near the upper temperature limit of 150°C.
Can the MM3Z9V1 be used in a battery-powered IoT device where quiescent current must stay below 1µA, and how does its reverse leakage impact total system draw?
The MM3Z9V1 exhibits 500 nA of reverse leakage current at 6V, which may seem low but becomes problematic in ultra-low-power IoT designs targeting sub-1µA sleep currents. In a typical shunt regulator or overvoltage protection role, this leakage flows continuously when the Zener is reverse-biased below breakdown—common in battery-powered systems with varying supply voltages. Over a 3V to 9V input range, leakage can increase with temperature and voltage, potentially doubling at 85°C. For battery life-critical applications, consider lower-leakage alternatives like the BZT52C9V1 (leakage ~100 nA) or replace the Zener with a precision supervisor IC (e.g., MAX809) that draws <100 nA. If the MM3Z9V1 must be used, ensure it’s only activated during fault conditions via a switch or MOSFET to minimize standby loss.
What layout and thermal considerations are critical when placing the MM3Z9V1 in a densely populated PCB with limited copper pour, and how might this affect long-term reliability?
The MM3Z9V1 in SOD-323F (SC-90) package has limited thermal dissipation capability due to its small size and lack of exposed pad. In dense PCBs with minimal copper, junction-to-ambient thermal resistance increases significantly, reducing effective power handling and accelerating aging. Even at 100mW dissipation, localized heating can raise the junction temperature beyond safe margins if adjacent components or traces restrict airflow and heat spreading. To mitigate risk, allocate a small thermal relief pad (≥4 mm²) connected to a ground plane, avoid placing heat-sensitive components nearby, and ensure no conformal coating traps heat. Long-term, repeated thermal cycling from power pulses can cause solder joint fatigue or parameter drift. For high-reliability designs, consider moving to a larger package like SOD-123 (e.g., MMSZ9V1T1G) with better thermal performance, or use remote sensing with a buffered reference to isolate the Zener from thermal stress.
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MM3Z9V1 CAD Models
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