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BZT52C9V1
Diotec Semiconductor
ZENER SOD-123F 9.1V 0.5W 5%
74345 Pcs New Original In Stock
Zener Diode 9.1 V 500 mW ±5% Surface Mount SOD-123F
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5.0 / 5.0
- (466 Ratings)
BZT52C9V1
Product Overview
12944733
DiGi Electronics Part Number
BZT52C9V1-DGManufacturer
Diotec Semiconductor
BZT52C9V1
Description
ZENER SOD-123F 9.1V 0.5W 5%Inventory
74345 Pcs New Original In Stock
Zener Diode 9.1 V 500 mW ±5% Surface Mount SOD-123F
Quantity
Minimum 1
Minimum 1
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BZT52C9V1 Technical Specifications
Category
Diodes, Zener, Single Zener Diodes
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Voltage - Zener (Nom) (Vz)
9.1 V
Tolerance
±5%
Power - Max
500 mW
Impedance (Max) (Zzt)
30 Ohms
Current - Reverse Leakage @ Vr
500 nA @ 6 V
Operating Temperature
-50°C ~ 150°C (TJ)
Mounting Type
Surface Mount
Package / Case
SOD-123F
Supplier Device Package
SOD-123F
Datasheet & Documents
HTML Datasheet
BZT52C9V1-DG
Environmental & Export Classification
RoHS Status
Not applicable
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
Vendor Undefined
ECCN
EAR99
HTSUS
8541.10.0000
Additional Information
Other Names
2796-BZT52C9V1TR
Standard Package
3,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
J’ai reçu ma commande en seulement deux jours, c’est exceptionnel.
Dec 02, 2025
Die sicheren Verpackungen bei DiGi Electronics sind ein Beweis für ihre Qualitätssicherung.
Dec 02, 2025
I am very satisfied with the product quality and the proactive customer support.
Dec 02, 2025
Their product diversity allows me to be creative with my tech setups.
Dec 02, 2025
I appreciate how quickly they handle shipping requests and inquiries.
Dec 02, 2025
DiGi Electronics' prices are very competitive, especially considering their after-sales support.
Dec 02, 2025
DiGi Electronics consistently exceeds our expectations with its reliable solutions and proactive support efforts.
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Frequently Asked Questions (FAQ)
Can the BZT52C9V1 replace a 1N5239B Zener diode in a 12V power supply regulation circuit without compromising thermal stability or long-term reliability?
Yes, the BZT52C9V1 can functionally replace the 1N5239B in many 12V regulation applications due to its matching 9.1V Zener voltage and 500mW power rating. However, the BZT52C9V1 uses the smaller SOD-123F package compared to the 1N5239B’s DO-35 through-hole package, which reduces thermal mass and may lead to higher junction temperatures under sustained load. For improved thermal performance, ensure adequate PCB copper pour for heat dissipation and avoid continuous operation near the 500mW limit. Monitor operating temperature in high-ambient environments, as the BZT52C9V1’s -50°C to 150°C range is sufficient but requires proper derating above 100°C ambient.
What are the risks of using the BZT52C9V1 in a high-impedance feedback network for a switching regulator, and how does its dynamic impedance compare to alternatives like the MMSZ5239B?
Using the BZT52C9V1 in a high-impedance feedback network introduces potential noise sensitivity and regulation drift due to its maximum dynamic impedance (Zzt) of 30Ω. While acceptable for coarse voltage references, this can degrade loop stability in precision switching regulators. The MMSZ5239B (also 9.1V, 500mW) from ON Semiconductor offers similar Zzt but may have tighter process controls and better noise performance in practice. If your design demands low noise and tight regulation, consider adding a bypass capacitor (e.g., 100nF ceramic) close to the BZT52C9V1 or evaluating lower-impedance Zeners like the BZX84C9V1 (Zzt ~15Ω). Always validate transient response in your specific layout.
Is the BZT52C9V1 suitable for overvoltage protection in automotive 12V systems where load dump transients can exceed 40V, and what external components are needed to protect it?
The BZT52C9V1 is not suitable as a standalone overvoltage protector in automotive 12V systems due to its 9.1V breakdown and limited 500mW power handling—load dump events can deliver hundreds of watts for milliseconds. However, it can be used as a reference clamp in a crowbar or shunt regulator circuit if paired with a series current-limiting resistor and a robust TVS diode (e.g., SMAJ15A) to absorb the bulk of the transient energy. Calculate the resistor value to limit peak current through the BZT52C9V1 to <50mA during normal operation, and ensure the TVS clamps below the system’s maximum input voltage. This hybrid approach protects the BZT52C9V1 while leveraging its precision for threshold detection.
How does the reverse leakage current of the BZT52C9V1 at 6V affect its use in low-power battery monitoring circuits, and can it be substituted with a lower-leakage alternative like the MM3Z9V1T1G?
The BZT52C9V1 has a reverse leakage current of 500nA at 6V, which may be acceptable in moderate-power designs but can significantly impact ultra-low-power battery monitoring circuits where quiescent current must be minimized. In contrast, the MM3Z9V1T1G (9.1V, SOD-323) from ON Semiconductor typically exhibits <100nA leakage at 6V, making it a better fit for energy-sensitive applications. If replacing the BZT52C9V1, verify that the smaller SOD-323 footprint doesn’t compromise thermal performance under load and that the reduced leakage justifies any increase in unit cost. For best results in battery-powered systems, consider using a dedicated voltage reference IC instead of a Zener diode.
What PCB layout considerations are critical when using the BZT52C9V1 in a high-density surface-mount design to avoid thermal runaway or premature failure?
To prevent thermal issues with the BZT52C9V1 in high-density layouts, minimize thermal resistance by connecting both pads to generous copper areas (≥50mm² total) on the top layer and using multiple thermal vias to inner ground planes. Avoid placing heat-generating components (e.g., regulators, FETs) within 5mm to reduce localized heating. Since the BZT52C9V1 lacks an exposed thermal pad, rely on trace width and copper weight for heat spreading—use at least 2oz copper if operating near 300mW. Also, ensure solder joints are void-free during reflow, as poor thermal contact increases junction temperature. Always perform thermal imaging or simulation under worst-case load to confirm TJ remains below 125°C for long-term reliability.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
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