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RM06F6811CT
Cal-Chip Electronics, Inc.
RES SMD 6.81K OHM 1% 1/10W 0603
261815 Pcs New Original In Stock
6.81 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Thick Film
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5.0 / 5.0
- (441 Ratings)
RM06F6811CT
Product Overview
9540140
DiGi Electronics Part Number
RM06F6811CT-DGManufacturer
Cal-Chip Electronics, Inc.
RM06F6811CT
Description
RES SMD 6.81K OHM 1% 1/10W 0603Inventory
261815 Pcs New Original In Stock
6.81 kOhms ±1% 0.1W, 1/10W Chip Resistor 0603 (1608 Metric) Thick Film
Quantity
Minimum 1
Minimum 1
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RM06F6811CT Technical Specifications
Category
Chip Resistor - Surface Mount
Packaging
Tape & Reel (TR)
Series
RM
Product Status
Active
Resistance
6.81 kOhms
Tolerance
±1%
Power (Watts)
0.1W, 1/10W
Composition
Thick Film
Features
-
Temperature Coefficient
±100ppm/°C
Operating Temperature
-55°C ~ 155°C
Package / Case
0603 (1608 Metric)
Supplier Device Package
0603
Ratings
-
Size / Dimension
0.063" L x 0.031" W (1.60mm x 0.80mm)
Height - Seated (Max)
0.022" (0.55mm)
Number of Terminations
2
Datasheet & Documents
HTML Datasheet
RM06F6811CT-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8533.21.0030
Additional Information
Other Names
2571-RM06F6811CTTR
2571-RM06F6811TR
2571-RM06F6811TR-DG
Standard Package
5,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
他們的物流運作流程明確，追蹤系統先進，讓我們隨時掌握貨物狀況。
Dec 02, 2025
DiGi Electronics always adheres to promised delivery timelines.
Dec 02, 2025
I appreciate the wide range of choices DiGi Electronics provides at honest prices.
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Frequently Asked Questions (FAQ)
What are the key reliability risks when using the RM06F6811CT resistor in high-humidity environments, and how can I mitigate them despite its MSL 1 rating?
Although the RM06F6811CT is rated MSL 1 (unlimited floor life), its thick film composition and 0603 package make it susceptible to moisture-induced drift and electrochemical migration under sustained high humidity (>85% RH) or condensation. To mitigate risk, apply a conformal coating (e.g., silicone or acrylic) and avoid placing the component near board edges or in stagnant air zones. Ensure proper PCB cleaning to remove ionic residues that could accelerate corrosion under bias.
Can I replace a Vishay CRCW06036K81FKEA with the RM06F6811CT in a precision analog front-end without recalibrating the system?
Direct replacement of Vishay CRCW06036K81FKEA with RM06F6811CT is not recommended for precision applications without validation. While both are 6.81kΩ ±1% 0603 resistors, the RM06F6811CT has a ±100ppm/°C tempco versus Vishay’s ±25ppm/°C. This fourfold increase in thermal drift may introduce measurable gain or offset errors in sensitive signal paths—especially over temperature swings. If used, perform end-of-line calibration or select a tighter-tolerance alternative like the RM06FT6811 (if available) or consider thin-film competitors.
How does the power derating curve of the RM06F6811CT affect its long-term stability when operated near 0.1W in a compact IoT sensor node with limited airflow?
The RM06F6811CT is rated for 0.1W at 70°C, but in enclosed, low-airflow environments typical of IoT nodes, internal board temperatures often exceed 85°C. At this point, power must be derated linearly to zero at 155°C. Operating near 0.1W under such conditions accelerates thick film degradation, increasing resistance drift over time. To ensure longevity, limit actual power dissipation to ≤50% of rated (i.e., ≤0.05W) or use a larger 0805 package with better thermal dissipation. Monitor hotspot temperatures with IR imaging during prototyping.
Is the RM06F6811CT suitable for automotive under-hood applications where ambient temperatures reach 125°C, and what derating or layout precautions are necessary?
The RM06F6811CT can operate up to 155°C junction temperature, making it technically viable for under-hood use at 125°C ambient—but with critical caveats. At 125°C, power must be derated to approximately 30% of nominal (≤0.03W). Additionally, the ±100ppm/°C tempco will cause ~0.5% resistance shift from 25°C to 125°C, which may affect timing or feedback circuits. Use thermal vias beneath the pad to improve heat sinking, avoid proximity to high-power components, and validate long-term drift over 1,000-hour burn-in tests per AEC-Q200 guidelines if targeting automotive qualification.
What layout and soldering risks should I consider when designing with the RM06F6811CT in high-volume SMT production, especially regarding tombstoning and thermal mismatch?
The RM06F6811CT’s small 0603 footprint increases tombstoning risk during reflow if pad geometries are unbalanced or stencil apertures are misaligned. Ensure symmetrical land patterns with equal copper area and thermal mass on both terminals. Use a reflow profile with a controlled ramp-up (≤2°C/sec) to prevent uneven wetting. Additionally, the thick film material has a higher CTE than the PCB, so repeated thermal cycling may induce mechanical stress—avoid placing it near large copper pours or rigid connectors. For high-reliability builds, inspect first articles with X-ray or AOI to detect latent solder defects.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
RM06F6811CT CAD Models
Cal-Chip Electronics, Inc. RM06F6811CT PCB symbols & footprints
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