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ESD5Z5.0C
ANBON SEMICONDUCTOR (INT'L) LIMITED
TVS DIODE 5V VBR MIN 5.6V SOD-
6207 Pcs New Original In Stock
18.6V Clamp 9.4A Ipp Tvs Diode Surface Mount SOD-523
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5.0 / 5.0
- (194 Ratings)
ESD5Z5.0C
Product Overview
2668717
DiGi Electronics Part Number
ESD5Z5.0C-DGManufacturer
ANBON SEMICONDUCTOR (INT'L) LIMITED
ESD5Z5.0C
Description
TVS DIODE 5V VBR MIN 5.6V SOD-Inventory
6207 Pcs New Original In Stock
18.6V Clamp 9.4A Ipp Tvs Diode Surface Mount SOD-523
Quantity
Minimum 1
Minimum 1
Purchase and inquiry
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ESD5Z5.0C Technical Specifications
Category
Transient Voltage Suppressors (TVS), TVS Diodes
Packaging
Tape & Reel (TR)
Series
-
Product Status
Active
Type
Zener
Bidirectional Channels
1
Voltage - Reverse Standoff (Typ)
5V (Max)
Voltage - Breakdown (Min)
5.6V
Voltage - Clamping (Max) @ Ipp
18.6V
Current - Peak Pulse (10/1000µs)
9.4A
Power - Peak Pulse
174W
Power Line Protection
No
Applications
General Purpose
Capacitance @ Frequency
25pF @ 1MHz
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
SC-79, SOD-523
Supplier Device Package
SOD-523
Datasheet & Documents
HTML Datasheet
ESD5Z5.0C-DG
Environmental & Export Classification
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Additional Information
Other Names
4530-ESD5Z5.0CDKR
4530-ESD5Z5.0CCT
4530-ESD5Z5.0CTR
Standard Package
3,000
Reviews
5.0/5.0-(Show up to 5 Ratings)
Dec 02, 2025
複雑な配送リクエストにも柔軟に対応してくれて、非常に助かりました。
Dec 02, 2025
Their reliable after-sale support ensures I can focus on growing my business.
Dec 02, 2025
As a loyal customer, I can confidently say DiGi Electronics delivers consistent excellence.
Dec 02, 2025
DiGi Electronics consistently delivers quality products at transparent prices, which I highly recommend.
Dec 02, 2025
This product's build quality is outstanding—it feels durable and resilient.
Dec 02, 2025
Quick responses and efficient processing make DiGi Electronics my go-to.
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Frequently Asked Questions (FAQ)
Can the ESD5Z5.0C be safely used as a drop-in replacement for the Littelfuse SP1003-01WTG in a 5V I/O protection circuit, and what are the key reliability risks to consider?
The ESD5Z5.0C can serve as a functional replacement for the SP1003-01WTG in 5V I/O lines due to its similar 5V reverse standoff voltage and SOD-523 package, but critical differences exist: the SP1003-01WTG has a much lower capacitance (0.25pF vs. 25pF @ 1MHz), making it far superior for high-speed signals like USB or HDMI. Using the ESD5Z5.0C in such applications may introduce signal integrity issues or timing skew. Additionally, the ESD5Z5.0C’s higher clamping voltage (18.6V vs. ~9V for SP1003) increases stress on downstream ICs during ESD events. If replacing, verify signal bandwidth requirements and ensure the protected IC can tolerate higher transient voltages—otherwise, consider a lower-capacitance TVS like the SEMTECH RClamp0521P.
What are the thermal and layout risks when using the ESD5Z5.0C in a compact PCB design with high ambient temperatures near 100°C?
Although the ESD5Z5.0C is rated for operation up to 125°C, its peak pulse power (174W) is significantly derated at elevated temperatures. In compact layouts with poor thermal vias or adjacent heat sources, localized heating can reduce effective surge handling and accelerate aging. The SOD-523 package has limited thermal mass, so without adequate copper pour or thermal relief, repeated ESD strikes may cause premature failure. Always provide a solid ground connection with multiple vias to the ground plane and avoid placing the device near high-power components. For sustained high-temperature environments, consider derating the expected surge current by 30–40% and validate with HBM/CDM testing under thermal stress.
How does the ESD5Z5.0C compare to the ON Semiconductor ESD9X5.0ST5G for protecting 5V microcontroller GPIO pins, especially in terms of leakage and long-term stability?
The ESD5Z5.0C has a higher typical leakage current (not explicitly stated but inferred from Zener-type construction) compared to the ESD9X5.0ST5G, which uses a specialized low-leakage process optimized for sensitive analog or low-power digital lines. In battery-powered or precision measurement systems, even nanoamp-level leakage from the ESD5Z5.0C can accumulate and affect quiescent current or ADC accuracy over time. While both offer 5V standoff, the ESD9X5.0ST5G provides better long-term stability due to tighter process control and lower capacitance (1.2pF). If your design involves sleep-mode power budgets <1µA or high-impedance sensor interfaces, prefer the ESD9X5.0ST5G; otherwise, the ESD5Z5.0C is acceptable for general-purpose digital I/O with less stringent leakage requirements.
Is the ESD5Z5.0C suitable for protecting RS-485 transceiver lines in industrial environments with frequent inductive load switching, and what design mitigations are needed?
The ESD5Z5.0C is not ideal for RS-485 line protection due to its unidirectional Zener-type behavior and relatively high clamping voltage (18.6V), which may exceed the absolute maximum ratings of standard RS-485 transceivers (typically ±15V). Industrial environments often experience bipolar transients from inductive loads, requiring a bidirectional TVS. Using the ESD5Z5.0C here risks latch-up or damage during negative-voltage surges. Instead, use a bidirectional TVS like the Bourns CDSOD323-T05C or Littelfuse SMAJ5.0CA, which clamp symmetrically and offer lower dynamic resistance. If you must use the ESD5Z5.0C, pair it with series current-limiting resistors and a secondary clamping stage, but this adds complexity and reduces robustness—strongly consider a purpose-built RS-485 protection diode.
What are the solder joint reliability concerns when mounting the ESD5Z5.0C in high-vibration automotive or industrial applications, and how can they be mitigated?
The ESD5Z5.0C in SOD-523 (SC-79) package is susceptible to solder joint fatigue under continuous vibration or thermal cycling due to its small size and minimal mechanical anchoring. In automotive under-hood or motor-drive environments, cyclic stress can lead to crack propagation at the solder interface, causing intermittent protection failure. To mitigate, use SAC305 or high-reliability solder with proper fillet formation, ensure symmetrical pad design per IPC-7351, and consider conformal coating to reduce mechanical stress. Additionally, place the device away from board edges or high-flex zones. For mission-critical systems, perform vibration testing per IEC 60068-2-6 and consider larger packages like SOD-323 or SMA if board space allows, as they offer better mechanical robustness.
Quality Assurance (QC)
DiGi ensures the quality and authenticity of every electronic component through professional inspections and batch sampling, guaranteeing reliable sourcing, stable performance, and compliance with technical specifications, helping customers reduce supply chain risks and confidently use components in production.
ESD5Z5.0C CAD Models
ANBON SEMICONDUCTOR (INT'L) LIMITED ESD5Z5.0C PCB symbols & footprints
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